• Title/Summary/Keyword: Ultrasonic Cleaning

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A Study on the Effectiveness of Remanufacturing Technology for the Catalyzed Diesel Particulate Filter-trap(DPF) Deactivated by Diesel Exhaust Gas (촉매가 담지된 사용후 경유차 매연저감장치 DPF의 재제조 효과에 관한연구)

  • Choi, Kang-Yong;Park, Hea-Kyung
    • Journal of Korean Society of Environmental Engineers
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    • v.32 no.10
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    • pp.957-964
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    • 2010
  • The deactivated catalyzed diesel particulate filter-trap (DPF) was remanufactured by ultrasonic wave treatment with various prepared solutions, followed by active component re-impregnation, and the emission control performance and surface properties of remanufactured DPF were studied at various remanufacturing conditions. The proper ultrasonic wave cleaning time at various prepared solutions and optimal re-impregnation amounts of active component for the best emission control performance of DPF were investigated and its performance tests were also carried out with various temperatures for the conversions of CO, THC (total hydrocarbon) and PM (particulate matter) by catalytic reaction test unit using bypass gas from the diesel engine dynamo system. It was found that the emission control performance of DPF remanufactured with the high-temperature air washing, ultrasonic wave cleaning at acid/base solutions and active component re-impregnation method was recovered to 95% level of its activity compared to that of the fresh DPF, which was caused by removing the deactivating materials from the surface of the DPF, through the analyses of performance test and their surface characterization by Optical microscope, EDX, ICP, TGA, and porosimeter.

Development of a High-power Ultrasonic System for Sonochemistry Reaction (음향화학 반응용 강력초음파 개발)

  • Lee, Yang-Lae;Kim, Hyun-Se;Baek, Min-Hyuck
    • Journal of Power System Engineering
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    • v.17 no.6
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    • pp.142-148
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    • 2013
  • High-power ultrasonic promotes a chemical reaction by its own energy, thus it has been used for sonochemistry applications. For example, it has been mostly used for mixing, reaction catalyst, dispersion and disintegration. High-power ultrasonic transducer is made with structure based on a Bolt-clamped Langevin type Transducer (BLT), But it has difficulty in the development because degradation of piezoelectric ceramic by the heat generation of BLT. In this study, for a development of the transducer of 25 kHz and 1000 W used in sonochemistry and industrial cleaning, BLT with a hole in its center and tubular type waveguide of the transducer were designed based on finite element method (FEM). The transducer was fabricated based on the design parameter, and the impedance characteristics are measured experimentally and compared with the numerical results.

The effect of the Ultrasound in recovery of Cu by the Electrochemical deposition (초음파가 전착반응에 의한 구리의 회수에 미치는 영향)

  • 이재동;윤용수;홍인권;정일현
    • Journal of the Korean Society of Safety
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    • v.8 no.3
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    • pp.56-63
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    • 1993
  • In this study the ultrasound which has the properties of mixing, surface cleaning effect, increasing of the effective reaction surface area and increasing of the effective collision frequency, was used to enhance the recovering efficiency of Cu from the Cu-ion containning waste water. The ultrasonic reactor used in this study was dsigned and constructed for improving the disadvantage of the existing ultrasonic reactor From the experimental result and its analysis. we obtained following conclusions. 1. The ultrasound increased the rate of electrochemical deposition to 582.2% in maximum at the Condition of 0.1M-CuSO$_4$and 2.1V-overpotential. 2. This study gave the possibility of the scale-up of ultrasonic reactor and In particular, ultrasonic reactor would be effective in treatment of waste water contains a low concentration of Cu ion.

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Output power maximizing in ultrasonic transducer driven at 1MHz utilizing auto-tune MOS-FET RF inverter

  • Mizutani, Yoko;Suzuki, Taiju;Ikeda Hiroaki;Yoshida, Hirofumi
    • 제어로봇시스템학회:학술대회논문집
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    • 1995.10a
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    • pp.87-90
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    • 1995
  • When the ultrasonic transducer operating at l MHz for use in cleaning semiconductor wafers or other industsrial materials is driven from the MOS-FET DC-to RF inverter, the output power severely depends on the frequency of operation since the quality factor of the transducer is high. In order to tune to the eresonating frequency of the ultrasonic transducer, the drive signal frequency of the MOS-FET power inverter is automatically scananed until the frequency is set at the resonating frequency of the ultrasonic transducer is maximized. The control circuit consists of an output power sensing circuit, a PLL controller, a frequency standard, and other peripheral circuits. The operation was satisfactory when the transducer having an output of 600 W at 1 MHz was used.

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반도체/디스플레이 소자용 초음파 표면세정기술

  • Lee Gang-Won;Yun Ui-Jung;Kim Cheol-Ho;Lee Seok-Tae;Kim Yun-Su
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.05a
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    • pp.184-187
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    • 2005
  • In this paper, the transducer instead of mechanical dynamic structure was used to generate ultrasonic wave and the horn-shape amplifier was utilized to solve the energy decaying problem of ultrasonic wave with propagating it through the media. The analyses of ultrasonic wave and a fluid for the selected structure of a cleaning head were carried out Based on simulator results, the distance between a horn and the substrate of 4 mm and the horn diameter of 10 mm were determined to maximize the energy of ultrasonic waves. The cool ins structure was also considered to reduce the heat from the transducer and the horn.

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Linear measurement evaluation according to UV-type ultrasonic cleaning of artificial teeth for temporary dentures manufactured using a light-curing type printer produced by a DLP printer (광중합형 프린터로 제작한 임시 의치용 인공치아의 UV형 초음파 세척에 따른 선형측정 평가)

  • Dong-Yeon Kim;Gwang-Young Lee
    • Journal of Technologic Dentistry
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    • v.46 no.1
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    • pp.8-14
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    • 2024
  • Purpose: This study compares the deformation of traditional resin dentures to resin dentures printed with digital light processing (DLP). Methods: Eleven edentulous research models were developed. Ten of them were made with traditional resin dentures. The remaining one was prepared for scanning and 3D (three-dimensional) printing. Ten traditional resin dentures were made, with the remaining artificial teeth created using 3D software and a DLP printer. Traditional resin dentures, 3D printed resin denture artificial teeth, and a denture base with artificial teeth were all cleaned simultaneously in an ultrasonic cleaner for 3 minutes. Three groups were assigned four artificial tooth measurement points, which were then measured with digital calipers. The measured data was analyzed using descriptive statistics. The significance test was conducted using a nonparametric test Kruskal-Wallis test due to the small number of specimens (α=0.05). Results: The traditional resin dentures had the lowest strain rate at -0.04%, while the group that manufactured only artificial teeth had the highest strain rate at -0.09%. However, no statistically significant difference was observed between the 3 groups (p>0.05). Conclusion: During ultraviolet-type ultrasonic cleaning, traditional resin dentures (TD group) and denture base with artificial teeth made of DLP (DD group) demonstrated stable durability, whereas the artificial teeth made of DLP (AD group) with only artificial teeth did not show a good deformation rate.

Comparison of Cleaning Performance of CFC 113 and the Alternatives (CFC 113과 대체세정제의 세정성능 비교)

  • Row, Kyung Ho;Choi, Dai-Ki;Lee, Youn Yong
    • Analytical Science and Technology
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    • v.6 no.5
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    • pp.521-530
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    • 1993
  • According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.

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Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor (CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합)

  • Koo, Ja-Myeong;Moon, Jung-Hoon;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.19-26
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    • 2007
  • This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

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A Study on Preventing Cracks at the Small Hole Exit in Ultrasonic Machining Using a Wax Coating (초음파 미세구멍 관통가공에서 왁스 코팅을 이용한 출구크랙 방지에 관한 연구)

  • Li, Hang;Ko, Tae Jo;Baek, Dae Kyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.3
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    • pp.105-111
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    • 2015
  • Ultrasonic machining (USM) does not involve heating or any electrochemical effects, and subsequently causes low surface damage, has small residual stress, and does not rely on the conductivity of the workpiece. These characteristics are suitable for the machining of brittle materials, such as glass or ceramics. However, USM for brittle materials generates cracks on the workpiece while machining, especially at the hole exit with a small diameter. In this study, wax coating was used to deposit wax on the back side of the workpiece to decrease the occurrence of cracks at the exit holes in USM, and it was finally removed with a cleaning process. The experimental results show that this technique is beneficial for restricting the occurrence of cracks in glass or ceramics.