• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1149-1150
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1179-1180
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.903-904
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.933-934
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.525-526
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.689-690
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• 2009

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.3
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• pp.224-230
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• 2007

This work is aimed to explore a possibility of using the generalized Lamb waves for nondestructive evaluation of the bonding quality of layered substrates. For this purpose, we prepared two sets of specimens with imperfect bonding at their interfaces; 1) TiN-coated specimens with various wear conditions, and 2) CVD diamond specimens with various cleaning conditions. A dispersion simulation performed for layered substrates with imperfect interfaces are carried out to get the characteristics of dispersion curves that can be used for bonding quality evaluation. Then the characteristics of dispersion curves of the fabricated specimens are experimentally determined by use of an ultrasonic backward radiation measurement technique. The results obtained in the present study show that the lowest velocity mode (Rayleigh-like) of the generalized Lamb waves are sensitively affected by the bonding quality. Therefore, the generalized Lamb waves can be applied for nondestructive evaluation of imperfect bonding quality in various layered substrates.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Journal of Welding and Joining
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• v.22 no.2
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• pp.38-45
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• 2004

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.2
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• pp.227-233
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• 2014

This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.