• Journal of electromagnetic engineering and science
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• 제10권1호
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• pp.28-34
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• 2010

This paper introduces a new U.S. ultra-wideband(UWB: 3.1~10.6 GHz) 1:2 power divider based on a single section Wilkinson type configuration. The divider provides very flat in-band power splitting, high isolation, low insertion loss, sharp roll-off bandpass filtering, and DC blocking characteristics. The circuit consists of a $\lambda$/4 Y resonator, three capacitively coupled $\lambda$/2 short-circuited lines, and a resistor between the two output ports. The circuit structure was simulated with ADS and HFSS, and realized with low-temperature co-fired ceramic(LTCC) green tape, which has a dielectric constant of 7.8. $|S_{11}|$ better than 10 dB, $|S_{21}|$ and $|S_{31}|$ less than 3.2 dB, with both $|S_{22}|$ and $|S_{32}|$ measured as better than 12 dB for the whole UWB band. Measurement results agree closely with HFSS simulation results. The power divider has a compact size of $4\times9\times0.6mm^3$.

• 소성∙가공
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• 제16권4호
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• pp.299-303
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• 2007

Dry sliding wear behavior of ultra-fine grained(UFG) plain low carbon dual phase steel, of which microstructure consists of hard martensite in a ductile ferrite matrix, has been investigated. The wear characteristics of the UFG dual phase steel was compared with that of a coarse grained dual phase steel under various applied load conditions. Dry sliding wear test were carried out using a pin-on-disk type tester at various loads of 1N to 100N under a constant sliding speed condition of 0.20m/s against an AISI 52100 bearing steel ball at room temperature. The sliding distance was fixed as 1000m for all wear tests. The wear rate was calculated by dividing the weight loss, measured to the accuracy of 10-5g by the specific gravity and sliding distance. The worn surfaces and wear debris were analyzed by SEM, EDS and profilometer. Micro-vickers hardness of the cross section of worn surfaces were conducted to analyze strain hardening underneath the contact surfaces. The wear mechanism of the UFG dual phase steel was investigated with emphasis on the unstable nature of the grain boundaries of the UFG microstructure.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1455-1458
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• 2008

Amorphous silicon (a-Si:H) thin-film transistors (TFTs) are fabricated on flexible organic polymer foil substrates. As-fabricated performance, electrical bias-stability at elevated temperatures, electrical response under mechanical flexing, and prolonged mechanical stability of the TFTs are studied. TFTs made on plastic at ultra low process temperatures of $150^{\circ}C$ show initial electrical performance like TFTs made on glass but large gate-bias stress instability. An abnormal saturation of the instability against operation temperature is observed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제30회 학술논문발표회 초록집
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• pp.125-125
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• 2006

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.12-15
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• 2007

Excimer-laser-based crystallization is ideallysuited for forming crystalline Si films on glass substrates for use in active-matrix displays. In this paper, we will report on recent and significant technical advances in light sources and beam delivery systems targeted at enabling ultra-uniform mura-free low-temperature polycrystalline silicon active-matrix backplanes while simultaneously lowering production costs and increasing throughput.

• 한국유체기계학회 논문집
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• 제17권3호
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• pp.19-24
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• 2014

Development of long-term mobile energy sources for mobile robots or small-sized unmanned vehicles are actively increasing. The micro gas turbine generator (MTG) is a good candidate for this purpose because it has both of high energy density and high power density, and 500W class MTG is under development. The designed MTG can be divided into 2 main parts. One part consists of motor/ generator and compressor, and the other one consists of combustor, recuperator and turbine. 500W class MTG is designed to operate at ultra-high speed of 400,000 rpm in high turbine temperature over $700^{\circ}C$ to improve the efficiency. Because the magnetism of NdFeB permanent magnet for the motor/generator could be degraded if the temperature is over $150-200^{\circ}C$, MTG needs the thermal insulation to block the heat transfer from combustor/turbine side to motor/generator side. Moreover, the motor/generator is allocated to get the cooling effect from the rapid air flow by the compressor. This study presents the experimental results to verify whether the thermal insulator and air flow are effective enough to keep the motor/generator part in the low temperature less than $100^{\circ}C$. From the motoring test by using the high temperature test rig, it was confirmed that the motor/generator part could maintain the temperature less than $50^{\circ}C$ under the condition of 1.0 bar compressed air.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• 한국식품위생안전성학회지
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• 제10권1호
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• pp.19-22
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• 1995

Sensory characteristics of various milk samples-low-temperature long-time(LTLT) milk, high-temperature short-time (HTST) milk and ultra-high temperature (UHT) milk-were investigated using chemical analysis and sensory evaluation. The chemical composition was not much different among the milk samples. The results of evaluation of preference for color, flavor, taste and overall desirability of the milk samples by scoring and ranking tests indicated that significant difference on the sensory quality was recognized at 0.01 percent level. UHT milk samples (especially sample F and H) had better sensory acceptability than LTLT milk HTST milk samples.

• 한국세라믹학회지
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• 제56권4호
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• pp.331-339
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• 2019

While high-temperature ceramic composites consisting of carbides, borides, and nitrides, the so-called ultra-high-temperature ceramics (UHTCs), have been commonly produced through solid-state sintering, melt-solidification is an alternative method for their manufacture. As many UHTCs are binary or ternary eutectic systems, they can be melted and solidified at a relatively low temperature via a eutectic reaction. The microstructure of the eutectic composites is typically rod-like or lamellar, as determined by the volume fraction of the second phase. Directional solidification can help fabricate more sophisticated UHTCs with highly aligned textures. This review describes the fabrication of UHTCs through the eutectic reaction and explains their mechanical properties. The use of melt-solidification has been limited to small specimens; however, the recently developed laser technology can melt large-sized UHTCs, suggesting their potential for practical applications. An example of laser melt-solidification of a eutectic ceramic composite is demonstrated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 제2회 학술대회 논문집 일렉트렛트 및 응용기술전문연구회
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• pp.59-63
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• 2000

BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below $730^{\circ}C$ and decreases linearly with temperature over $730^{\circ}C$ This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.