• Journal of Electrical Engineering and Technology
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• v.13 no.3
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• pp.1392-1397
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• 2018

The potentiometric measurement result for a high resistance up to $100P{\Omega}$ using a low resistance, a low voltage source and a commercial digital multimeter(DMM) is presented. With the method, a resistance can be easily, fast and economically measured. Using the method, resistance ranges over the $10G{\Omega}$ range which is difficult to measure using a commercial DMM and resistance ranges between $100T{\Omega}$ and $100P{\Omega}$ which cannot measure using an insulation tester were measured within accuracy of a few percent. It is expected that it can be useful to determine the temperature and voltage effect of a high resistance and an insulation material because it uses a reference resistance with a low resistance, very low temperature and voltage effect. Besides, it is expected that it can be useful to calibrate a dc high voltage divider with a large resistance ratio and a very low resistance because arbitrary resistance ratio measurements are possible with it.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.32 no.5A
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• pp.307-315
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• 2012

Recently, ultra high performance fiber reinforced concrete (UHPFRC) having over 180 MPa compressive strength and 10 MPa tensile strength has been developed in Korea. However, UHPFRC represents different material properties with normal concrete (NC) and conventional high performance concrete (HPC) such as a high early age autogenous shrinkage and a rapid dry on the surface, because it has a low water-binder ratio and high fineness admixtures without coarse aggregate. In this study, therefore, to propose suitable experimental methods and regulations, and to evaluate mechanical properties at a very early age for UHPFRC, setting, shrinkage and tensile tests were performed. From the setting test results, paraffin oil was an appropriate material to prevent drying effect on the surface, because if paraffin oil is applied on the surface, it can efficiently prevent the drying effect and does not disturb or catalyze the hydration of cement. From the ring-test results, it was defined that the shrinkage stress is generated at the time when the graph tendency of temperature and strain of inner steel ring is changed. By comparing with setting test result, the shrinkage stress was firstly occurred as the penetration resistance of 1.5 MPa was obtained, and it was about 0.6 and 2.1 hour faster than those of initial and final sets. So, the starting time of autogenous shrinkage measurement (time-zero) of UHPFRC was determined when the penetration resistance of 1.5 MPa was obtained. Finally, the tensile strength and elastic modulus of UHPFRC were measured from near initial setting time by using a very early age tensile test apparatus, and the prediction models for tensile strength and elastic modulus were proposed.

• Journal of the Korea institute for structural maintenance and inspection
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• v.15 no.4
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• pp.155-164
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• 2011

In the case of impact loading test, measurement of the test data has difficulties due to fast loading velocity. In addition, the dynamic behaviors of specimens are distorted by ignoring local fracture. In this study, therefore, finite element analysis which considers local fracture and strain rate effect on impact load was performed by using LS-DYNA, an explicit analysis program. The one-way and two-way specimens strengthened with FRP Sheets and steel fibers were considered as analysis models. The results showed that the impact resistance of steel fiber reinforced concrete (SFRC) and ultra high performance concrete (UHPC) was enhanced. In the case of specimens strengthened with FRP Sheets, GFRP was superior to CFRP in the performance of impact resistance, and there was little effect of the FRP Sheet orientation. The reliability of this analysis model was verified by comparing with previous experimental results.

• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.342-348
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• 2021

For the characterization or failure analysis of electronic devices such as PCB (printed circuit boards), the most common method is the measurement of voltage waveforms with an oscilloscope. However, because there are many types of problems that cannot be detected by voltage waveform analysis, several other methods such as X-ray transmission, infrared imaging, or eddy current measurement have been applied for these analyses. However, these methods have also been limited to general analyses because they are partially useful in detecting physical defects, such as disconnections or short circuits. Fundamentally current waveform measurements during the operation of electronic devices need to be performed, however, commercially available current sensors have not yet been developed, particularly for applications in highly integrated PCB products with sub-millimeter fine pitch. In this study, we developed a highly sensitive PHR (planar hall resistance) magnetic sensor for application in highly integrated PCBs. The developed magnetic sensor exhibited sufficient features of an ultra-small size of less than 340 ㎛, magnetic field resolution of 10 nT, and current resolution of 1 mA, which can be applicable for PCB analyses. In this work, we introduce the development process of the magnetic sensing probe and its characteristic results in detail, and aim to extend this pin-type current probe to applications such as current distribution imaging of PCBs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.119-122
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• 2000

Recently polymer insulators are being used for outdoor high voltage applications. Polymer insulators for transmission line have significant advantages over porcelain and glass insulators, especially for ultra-high voltage transmission lines. Their advantages are light weight, vandalism resistance and hydrophobicity. Polymer insulators are a relatively new technology, but their expected life is still unknown. Therefore these estimating technique are very important. Their life time is related to weathering and operating condition. Multi-aging test is requested because aging factor is occurred by multi-aging than unique aging. The aging test about polymer insulators have mainly carried out by IEC 61109. This paper presents multi-stress chamber experiments and tracking wheel test to examine the tracking and erosion performance of polymer insulator for transmission. Multi-stress testing is able to demonstrate deficiencies of polymer insulator materials and designs, including the nature of interfaces in insulation design. We have investigated IEC 61109 Annex C (5000h aging test) and CEA tracking wheel test as test methods of artificial accelerated aging. The aging degree of polymer insulator is estimated by leakage current, measurement of hydrophobicity degree, damage conditions of insulator surface, withstand voltage test etc.

• Journal of Internet of Things and Convergence
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• v.6 no.1
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• pp.97-102
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• 2020

Multi-Channel Switch ICs for IoT have integrated several solid state structure low ON-resistance bi-directional relay MOS switches with level shifter to drive high voltage and they should be independently controlled by external serialized logic control. These devices are designed for using in applications requiring high-voltage switching control by low-voltage control signals, such as medical ultra-sound imaging, ink-jet printer control, bare board open/short and leakage test system using Kelvin 4-terminal measurement method. This paper describes implementation of analog switch control block and its verification using Field programmable Gate Array (FPGA) test pattern generation. Each block has been implemented using Verilog hardware description language then simulated by Modelsim and prototyped in a FPGA board. Compare to conventional IC, The proposed architecture can be applied to fields where multiple entities need to be controlled simultaneously in the IoT environment and the proposed pattern generation method can be applied to test similar types of ICs.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.188-190
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• 2022

본 연구에서는 정전류(Constant Current) 방식에 전압강하법을 이용하여 접촉저항 측정 시스템을 구현하고 측정값을 블루투스 통신을 통해 안드로이드 운영체제에서 확인할 수 있도록 앱을 개발한다. 측정가능한 범위로 0 Ω에서 10.24 Ω 사이의 접촉 저항을 MCP3424 18 bit 분해능 ADC를 사용하여 측정할 수 있도록 설계하였다. 기존에는 반고정 저항과 별도의 전류계를 이용하여 정전류를 설정하였으나, 본 연구에서는 측정의 정밀도 및 편리성 개선을 위해 0.1% 고정밀 고정저항을 병렬로 4개 연결하여 구현하였으며, 또한 1:1 Unity Gain Buffer를 구성하고 Ultra High Precision Z-Foil 방식으로 오차 0.01%, 온도 계수 0.05 ppm/℃ 저항을 사용하여 실제로 측정한 샘플 저항 값의 결과를 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.