• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.522-528
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• 2023

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.

• Polymer(Korea)
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• v.36 no.4
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• pp.536-541
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• 2012

The effects of silica content were studied on UV curing characteristics and defect formations in imprinted patterns of hundreads nanometer size for the photo-curable imprinting composites with silica particles. An increase in elasticity and a decrease in shrinkage were observed with an increase in silica content in the imprinting resin which was UV cured at room temperature. However, the patterned nano-pillars were stuck together with neighboring nano-pillars if the amount of silica is more than 7 wt%. This can be ascribed to the increased viscosity of imperfectly cured resin due to the obstruction of the photo-reaction by silica particles. Addition of silica to the imprinting resin is useful in enhancing the strength of the cured resin although it is difficult to get good imprinted patterns for the resin with more than 7 wt% of silica due to the reduction of photo-reaction conversion.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

• KSBB Journal
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• v.22 no.6
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• pp.433-437
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• 2007

A constant desire has been to fabricate nanopatterns for biochip and the Ultraviolet-nano imprint lithography (UV-NIL) is promising technology especially compared with thermal type in view of cost effectiveness. By using this method, nano-scale to micro-scale structures also called nanopore structures can be fabricated on large scale gold plate at normal conditions such as room temperature or low pressure which is not possible in thermal type lithography. One of the most important methods in fabricating biochips, immobilizing, was processed successfully by using this technology. That means immobilizing proteins only on the nanopore structures based on gold, not on hardened resin by UV is now possible by utilizing this method. So this selective nano-patterning process of protein can be useful method fabricating nanoscale protein chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.269-269
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• 2008

통상적으로 PCB 연성 기판에는 회로를 보호하기 위한 절연 보호 층이 부착되어 있다. 이 절연 보호 층은 보통 기계적 강도를 갖는 외부 층과 접착력을 가지는 2층 구조로 이루어져 있다. 필름 형태의 보호 층을 회로에 hot lamination 등의 공정을 수행하여 절연 보호 층이 형성된다. 본 연구에서는 복잡한 형상 제어와 보다 정밀한 제품에 응용하기 위하여 보호 층 형성 공정에 잉크젯 공법을 적용하였다. 잉크젯 공정을 이용할 경우 계산된 정략의 액적을 정확한 위치에 탄착시킴으로서 좀 더 정밀한 보호 층 형성이 가능하다. 또한 원하는 위치에 선택적으로 형성 가능한 잉크젯 공법의 장점으로 인해 현 공정대비 원가 절감의 효과가 극대화 된다. 본 연구에서는 보호 층형성에 필요한 재료 선정을 위한 열 경화 잉크 및 UV잉크의 토출성과 퍼짐성 분석 및 인쇄 공정에 대한 연구를 수행하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1849-1856
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• 2010

Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.

• Journal of Adhesion and Interface
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• v.11 no.2
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• pp.41-49
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• 2010

Furan-containing epoxide monomers (8, 9) were designed and synthesized as carbon-neutral, environment-friendly adhesion material. Bicyclic skeleton were constructed using the Diels-Alder reaction of furan and methyl acrylate, both readily accessible starting material from a biomass via bio-refinery process. After reduction of ester functionality, resulting hydroxyl moieties were coupled to epichlorohydrin to provide the epoxy-functionalized furanic monomers (8, 9). The structure of new furanic monomers was confirmed by $^1H$ and $^{13}C$ NMR spectroscopy. As UV-curable monomers, basic properties such as UV curing time and the extent of UV curing were evaluated by photo DSC. Photo-curing shrinkages were measured by linear variable differential transformer transducer (LVDT) and the effect of molecular structure on shrinkage was considered. In addition, new synthetic compounds showed the shear strength over 3 MPa when they were photo-cured between polycarbonate plates, which indicates these compounds are feasible to use as photo-curable adhesive materials.

• Polymer(Korea)
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• v.36 no.3
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• pp.315-320
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• 2012

Ultra violet (UV) curable pressure sensitive adhesives (PSA) were prepared by controlling both the structure of acryl copolymer and the functionality and content of multi-functional monomers. Acryl copolymer worked as the base polymer for giving the tackiness. Multi-functional monomers were used to vary the crosslinked structure and the degree of crosslink. Acryl copolymer showed the reduced peel strength after UV curing by decreasing the content of 2-ethylhexyl acrylate in the monomer composition. Both the peel strength of PSA and the content of residue found on silicon wafer decreased after UV curing by increasing the functionality of multi-functional monomers. UV curable PSA containing 20 phr six-functional monomer showed the higher peel strength before UV curing and the lower peel strength and the least residue on silicon wafer after UV curing.

• Applied Chemistry for Engineering
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• v.24 no.3
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• pp.320-326
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• 2013

In this study, various polyimide films were synthesized via low temperature cure in order to understand changes in their physical properties when using 4,4'-oxydianiline (ODA) as a diamine and dianhydride molecules with different backbones on a single diamine such as 4,4'-Oxydiphthalic anhydride (ODPA), 4,4-hexafluoroisopropylidene diphthalic dianhydride (6FDA), and 3,3', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA). After the synthesis of poly(amic acid), polyimide films were fabricated by adding 1,4-diazabicyclo [2.2.2]octane (DABCO), a low-temperature catalyst, at various wt% to poly(amic acid)s. Changes of optical and thermal properties were compared and analyzed between polyimide films without catalyst and polyimide films with catalyst by FT-IR, UV-Vis transmittance, DSC/TGA, and WAXD analysis. Wide-angle X-ray diffraction (WAXD) analysis revealed that the mean intermolecular distance decreased with the use of a catalyst by the type of dianhydride. Thus, while the optical properties of the films improve by a low-temperature cure performed using a catalyst, their thermal properties decrease. These changes can be explained by the changes in the morphological structure of the films triggered by a catalyst-induced reduction in the mean intermolecular distance. Moreover, the results show that the type of dianhydride determines the degree of change in the optical and thermal properties in each types of polyimide, demonstrating that changes in the optical and thermal properties are directly associated with the backbone of the polyimide structure.

• Applied Chemistry for Engineering
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• v.24 no.5
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• pp.499-506
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• 2013

As the usuage of tempered glass for touch panel increased rapidly with the development of industry, the amount of UV curable coating solution used to protect glass surfaces during a tempered glass manufacturing process increased as well. The UV curable coating has advantages compared to thermal curing such as shortened curing time and non-solvent. Appropriated polymer and monomer were used as an acid polymer to grant an alkali peeling ability. The monomers were 2-hydroxyl methylacrylate, 1,6-hexanediol diacrylate and dipentaerythritol hexaacrylate which have acryl groups of 1, 2, and 6, respectively. The combination of three different types of photoinhibitors were used and bisphenol A epoxy diacrylate was used as an oligomer. In this study, experiments were carried out by controlling the amount of photoinitiator, oligomer, and additive while maintaining the constant content of the acid polymer and the acrylic monomer. The changes in physical properties according to the additive content were investigated. It was found that the combination of photoinitiators was necessary to achieve the hardness above 4H and it was possible to control the delamination type of the coating film from a sheet to pieces by the addition of TPO as an initiator. The increase in oligomer contents increased the hardness and adhesiveness alongside dissection time. Talc content of 20 wt% showed the best results.