• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.12
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• pp.545-552
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• 2003

When a Si PIN diode is exposed to fast neutrons, it results in displacement damage to the Si lattice structure of the diode. Defects induced from structural dislocation become effective recombination centers for carriers which pass through the base of a PIN diode. Hence, increasing the resistivity of the diode decreases the current for the applied forward voltage. This paper involves the development of a neutron sensor based on the phenomena of the displacement effect damaged by neutron exposure. The neutron effect on the semiconductor was analyzed. Several PIN diode arrays with various thickness and cross-section area of the intrinsic layer(I layer) were fabricated. Under irradiation tests with a neutron beam, the manufactured diodes have a good linearity to neutron dose and show that the increase of thickness of I layer and the decrease of cross-section of PIN diodes improve the sensitivity. Newly developed PIN diodes with thicker I layer and various cross section, were retested and then showed the best neutron sensitivity at the condition that the I layer thickness was similar to a side length. On the basis of two test results, final discrete PIN diodes with a rectangular shape were manufactured and the characteristics as neutron detectors were analyzed through the neutron beam test using on-line electronic dosimetry system. Developed PIN diode shows a good linearity as dosimetry in the range of 0 to 1,000cGy(Tissue) and its neutron sensitivity is 13mV/cGy at constant current of 5mA, that is three times higher than that of commercially available neutron detectors. And the device shows little dependency on the orientation of the neutron beam and a considerable stability in annealing test for a long period.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.208-211
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• 2002

$Bi_2Sr_2CuO_x$(Bi-2201) thin films were fabricated by atomic layer-by-layer deposition using an ion beam sputtering method. 10 wt% and 90 wt% ozone mixed with oxygen were used with ultraviolet light irradiation to assist oxidation. At early stages of the atomic layer by layer deposition, two dimensional epitaxial growth which covers the substrate surface would be suppressed by the stress and strain caused by the lattice misfit, then three dimensional growth takes place. Since Cu element is the most difficult to oxidize, only Sr and Bi react with each other predominantly, and forms a buffer layer on the substrate in an amorphous-like structure, which is changed to $SrBi_2O_4$ by in-situ anneal.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.119-121
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• 2002

$Bi_2Sr_2CuO_x$ thin films were fabricated by atomic layer-by-layer deposition using an ion beam sputtering method, 10 wt% and 90 wt% ozone mixed with oxygen were used with ultraviolet light irradiation to assist oxidation. At early stages of the atomic layer by layer deposition, two dimensional epitaxial growth which covers the substrate surface would be suppressed by the stress and strain caused by the lattice misfit, then three dimensional growth takes place. Since Cu element is the most difficult to oxidize, only Sr and Bi react with each other predominantly, and forms a buffer layer on the substrate in an amorphous-like structure, which is changed to $SrBi_2O_4$ by in-situ anneal.

• Journal of the Korean institute of surface engineering
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• v.43 no.4
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• pp.170-175
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• 2010

The GaAs epitaxial layers were grown on Si(100) substrates by molecular beam epitaxy(MBE) using the two-step method. The Si(100) substrates were cleaned with different surface cleaning method of vacuum heating, As-beam, and Ga-beam at the substrate temperature of $800^{\circ}C$. Growth temperature and thickness of the GaAs epitaxial layer were $800^{\circ}C$ and 1 ${\mu}m$, respectively. The surface structure and epitaxial growth were observed by reflection high-energy electron diffraction(RHEED) and scanning electron microscope(SEM). Just surface structure of the Si(100) substrate cleaned by Ga-beam at $800^{\circ}C$ shows double domain ($2{\times}1$). RHEED patterns of the GaAs epitaxial layers grown on Si(100) substrates with cleaning method of vacuum heating, As-beam, and Ga-beam show spot-like, ($2{\times}4$) with spot, and clear ($2{\times}4$). From SEM, it is found that the GaAs epitaxial layers grown on Si(100) substrates with Ga-beam cleaning has a high quality.

• Structural Engineering and Mechanics
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• v.52 no.2
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• pp.369-389
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• 2014

Two-layer coupled or composite beams with discrete shear connectors of finite dimensions are commonly encountered in pre-fabricated construction. This paper presents the development of simplified closed-form solutions for such type of coupled beams for practical applications. A new coupled beam element is proposed to represent the unconnected segments in the beam. General solutions are then developed by an inductive method based on the results from the finite element analysis. A modification is subsequently considered to account for the effect of local deformations. For typical cases where the local deformation is primarily concerned about its distribution over the depth of the coupled beam, empirical modification factors are developed based on parametric calculations using finite element models. The developed analytical method for the coupled beams in question is simple, sufficiently accurate, and suitable for quick calculation in engineering practice.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.555-556
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• 2006

In this paper, we have proposed a novel process using two-step electron beam lithography to fabricate 20 nm T-gates for high performance MODFETs. Two-step lithography reduces electron forward scattering by defining the foot on a thin (100 nm) bottom-layer of polymethyl methacrylate (PMMA) at the second step, the T-gate head having been developed at the first step. Adopting a low temperature development technique for the second step reduces the detrimental effect of head exposure on foot definition. We have shown that 20 nm T-gate can be patterned with this process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.2
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• pp.125-129
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• 2005

Two kinds of physical treatments were examined for the analysis both of intrinsic surface and interior nature of CuInS $e_2$[CIS] and CuGaS $e_2$[CGS] films grown in separated systems. For the first method, a selenium protection layer which was immediately deposited after the growth of the CIS was investigated. The Se cap layer protects CISe surface from oxidation and contamination during the transport under ambient atmosphere. The Se cap was removed by thermal annealing at temperature above 15$0^{\circ}C$. After the decapping treatment at 2$25^{\circ}C$ for 60 min, ultraviolet photoemission and inverse photoemission measurements of the CIS film showed that its valence band maximum(VBM) and conduction band minimum (CBM) are located at 0.58 eV below and 0.52 eV above the Fermi level $E_{F}$, respectively. For the second treatment, an Ar ion beam etching was exploited. The etching with ion kinetic energy $E_{k}$ above 500 eV resulted in broadening of photoemission spectra of core signals and occasional development of metallic feature around $E_{F}$. These degradations were successfully suppressed by decreasing $E_{k}$ below 400 eV. CGS films etched with the beam of $E_{k}$ = 400 eV showed a band gap of 1.7 eV where $E_{F}$ was almost centered.st centered.

• Advances in nano research
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• v.14 no.2
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• pp.141-154
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• 2023

Effects of viscoelastic foundation on vibration of curved-beam structure with clamped and simply-supported boundary conditions is investigated in this study. In doing so, a micro-scale laminate composite beam with two piezoelectric face layer with a carbon nanotube reinforces composite core is considered. The whole beam structure is laid on a viscoelastic substrate which normally occurred in actual conditions. Due to small scale of the structure non-classical elasticity theory provided more accurate results. Therefore, nonlocal strain gradient theory is employed here to capture both nano-scale effects on carbon nanotubes and microscale effects because of overall scale of the structure. Equivalent homogenous properties of the composite core is obtained using Halpin-Tsai equation. The equations of motion is derived considering energy terms of the beam and variational principle in minimizing total energy. The boundary condition is assumed to be clamped at one end and simply supported at the other end. Due to nonlinear terms in the equations of motion, semi-analytical method of general differential quadrature method is engaged to solve the equations. In addition, due to complexity in developing and solving equations of motion of arches, an artificial neural network is design and implemented to capture effects of different parameters on the inplane vibration of sandwich arches. At the end, effects of several parameters including nonlocal and gradient parameters, geometrical aspect ratios and substrate constants of the structure on the natural frequency and amplitude is derived. It is observed that increasing nonlocal and gradient parameters have contradictory effects of the amplitude and frequency of vibration of the laminate beam.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.42-50
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• 2000

We show that both cross and bar states with high extinction ratios larger than 30dB can be achieved at eh same ends of ultra-short fused vertical directional coupler switches with two sections by changing the refractive indices of cores and inner cladding layers less than 1%. Based on the calculation of extinction ratios of cross state and bar state for various refractive index and thickness of inner cladding layer and core using the improved coupled mode theory and beam propagation method, the guidelines for design to achieve large tolerances in refractive indices of core and inner cladding layer in fused vertical directional coupler switches are presented.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.1
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• pp.82-91
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• 1991

Molecular beam epitaxial growth of GaAs on Si substrate and the results on its analysis are reported. Epitaxy was performed on two different types of the substrate under various grwth conditions, and was analyzed by scanning and transmission electron microscopes, X-ray diffractometer, photoluminescence and Hall measurements. GaAs epitaxial layer has better crystalline quality when it was grown on a tilt-cut substrate. The stress seems to be releaxed more easily when multi-quantum well was introduced in the buffer layer. The epilayer was doped unintentionally with Si during growth due to the diffusion of the substrate. Also observed is that the quantum efficiency of excitonic radiative recombination of the heteroepitaxy is not as good as that of the homoepitaxy in the same doping level.