• Nuclear Engineering and Technology
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• v.38 no.7
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• pp.619-638
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• 2006

Low temperature irradiation can significantly harden metallic materials and often lead to strain localization and ductility loss in deformation. This paper provides a review on the radiation effects on the deformation of metallic materials, focusing on microscopic and macroscopic strain localization phenomena. The types of microscopic strain localization often observed in irradiated materials are dislocation channeling and deformation twinning, in which dislocation glides are evenly distributed and well confined in the narrow bands, usually a fraction of a micron wide. Dislocation channeling is a common strain localization mechanism observed virtually in all irradiated metallic materials with ductility, while deformation twinning is an alternative localization mechanism occurring only in low stacking fault energy(SFE) materials. In some high stacking fault energy materials where cross slip is easy, curved and widening channels can be formed depending on dose and stress state. Irradiation also prompts macroscopic strain localization (or plastic instability). It is shown that the plastic instability stress and true fracture stress are nearly independent of irradiation dose if there is no radiation-induced phase change or embrittlement. A newly proposed plastic Instability criterion is that the metals after irradiation show necking at yield when the yield stress exceeds the dose-independent plastic instability stress. There is no evident relationship between the microscopic and macroscopic strain localizations; which is explained by the long-range back-stress hardening. It is proposed that the microscopic strain localization is a generalized phenomenon occurring at high stress.

• Journal of Powder Materials
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• v.11 no.2
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• pp.149-157
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• 2004

High temperature deformation behavior of activated sintered W powder compacts was investigated. The compression tests were carried out in the temperature range between 900 and 110$0^{\circ}C$ at the strain rate of $10^{-3}s^{-1}$. The sintered specimens of Ni-doped submicron W powder compacts showed decrease in W grain size with increasing the Ni content. As the result, the flow stress was significantly increased with increasing the Ni content. We obtained Ni-activated sintered W compacts with the relative density of 94 $\pm$ l％and the average grain size of less than 5${\mu}{\textrm}{m}$. A moderate true strain up to 0.60 was obtained without fracture even at 110$0^{\circ}C$ with the strain rate of $10^{-3}s^{-1}$ for the activated W compact despite adding the 1.0 wt％Ni to submicron W powder.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.134-139
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• 2015

PolyJet technology is an additive manufacturing (AM) technology commonly used for modeling, prototyping, and production applications. It is one of the techniques used for 3D printing. The PolyJet technique is a process that joins materials to fabricate a product from 3D CAD data in a layer-by-layer manner. The orientation of a layer can affect the mechanical properties of the product manufactured by the PolyJet technique because of its anisotropy. In this paper, tensile and shearing tests of specimens were developed with the PolyJet technique in order to study the mechanical properties according to the orientation of a layer. The mechanical properties of the specimens were determined on the basis of true stress-strain curves from tensile and shearing tests. In addition, the tensile and shearing tests were simulated under the same conditions as those of experiment, and the experiment and simulated results were compared. Through this study, the fracture criteria could be established.

• 한국가스학회:학술대회논문집
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• 1997.09a
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• pp.78-85
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• 1997

Indentation and small punch tests are very powerful methods to monitor the materials reliability since they are very simple, easy and almost non-destructive. First, recently-developed continuous indentation test can provide the more material properties such as hardness, elastic modulus, yield strength, work-hardening exponent, etc., than the conventional hardness test. In our study, the true stress-strain curve was derived from the indentation load-depth curve for spherical indentation. In detail, the strain was able to be obtained from plastic depth/contact radius ratio, and the flow stress was from mean contact pressure through the analysis of elastic-plastic indentation stress field. Secondly, the small punch test was studied to evaluate the fracture toughness and defomation properties such as elastic modulus and yield strength. Like the indentation test, this test can be applied without severe damage of the target structure.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.12
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• pp.1393-1400
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• 2009

The objective of this study is to validate local failure criteria, which were proposed based on the notched-bar specimen tests combining with finite element (FE) simulations, using the results of real-scale pipe failure tests. This study conducted burst test using wall-thinned pipe specimens, which were made of 4 inch Sch.80 ASTM A106 Gr.B carbon steel pipe, under simple internal pressure at ambient temperature and performed associated FE simulations. Failure pressures were estimated by applying the failure criteria to the results of FE simulations and were compared with experimental failure pressures. It showed that the local stress based criterion, given as true ultimate tensile stress of material, accurately estimated the failure pressure of wall-thinned pipe specimens. However, the local strain based criterion, which is fracture strain of material as a function of stress tri-axiality, could not predict the failure pressure. It was confirmed that the local stress based criterion is reliably applicable to estimation of failure pressure of local wall-thinned piping components.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.1
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• pp.41-49
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• 1992

The effects of alloying elements on the superplastic properties of Al-Li based alloys had been investigated. The intermediate thermo-mechanical treated (ITMT) Al-2.0wt%Li, Al-2.0wt%Li-1.0wt%Mg, Al-2.0wt%Li-0.12wt%Zr and Al-2.0wt%Li-1.2wt%Cu-1.0wt%Mg-0.12wt%Zr alloys were tested in tension at various temperature (400, 450, 500 and $550^{\circ}C$) and strain rate($6.7{\times}10^{-3}$, $1.0{\times}10^{-2}$, $1.6{\times}10^{-2}$ and $5.0{\times}10^{-2}/sec$). The results were as follows : The superplasticity in binary, ternary and pentanary alloys appeared at 500 to $550^{\circ}C$, and good strain rate for superplasticity. $1.6{\times}10^{-2}/sec{\sim}1.0{\times}10^{-2}/sec$ for a binary alloy and $1.0{\times}10^{-2}/sec{\sim}6.7{\times}10^{-3}/sec$ for ternary and pentanary alloys. A Zr-added ternary alloy had best value of elongation (730%) in four alloys at $550^{\circ}C$ of tension temperature and $1.0{\times}10^{-2}/sec$ of strain rate. The strain rate was greatly dependent on tension temperature and true strain rate was more than 1.0 at all test temperature and strain rate. In binary and Mg-added teranry alloys. the necks were slightly formed and their fracture surface had lips shape, but Zr-added ternary and pentanary alloy fractured along the grain boundary without necking. Their dislocations moved to grain boundary during superplasticity deformation and arranged perpendicular to grain boundary. Super plastic deformation was made by grain boundary slip of dislocation slip creep and model of core and mantle.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.