• 제목/요약/키워드: Transmission Electron Microscopy

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TDEAT single source를 사용한 TiN막의 특성평가

  • 김재호;이재갑;박상준;신현국;황찬용
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.28-33
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    • 1995
  • TiN 박막은 저온(<$500^{\circ}C$), 저압(1Torr)에서 Tetrakis(diethylamido)titanium[TDEAT, Ti(NEt2)4]single precursor를 사용하여 증착하였다. 증차고딘 박막은 SEM(Scanning Electron Microscopy)으로 surface morphology와 step coverage를 측정하였고, TEM(Transmission Electron Microscopy)분석결과 microcrystalline의 TiN을 확인하였다. XPS(X-ray Photoelectron Spectroscopy)분석결과에 따르면 $200-500^{\circ}C$구간에서는 $\beta$-hydogen elimination에 의한 반응이 일어나고 $600-700^{\circ}C$구간에서는 thermal decomposition에 의한 반응이 일어나고 있음을 알 수 있다. Carbon과 oxygen의 농도는 AES(Auger Electron Spectroscopy)를 사용하여 측정하였으며 온도가 감소할수록 carbon의 농도가 감소하는 경향을 보여주고 있다.

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Comparison of Cell Wall Ultrastructures of Aspergillus nidulans in Presence and Absence of a MnpAp Mannoprotein

  • Jeong, Hyo-Yong;Whang, Sung-Soo;Chae, Keon-Sang
    • Animal cells and systems
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    • v.10 no.3
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    • pp.131-135
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    • 2006
  • The ultrastructure of Aspergillus nidulans cell wall in relation to a mannoprotein was studied by scanning and transmission electron microscopy. An mnpAp null-mutant, DMPV1, was used as a negative control of a wild type VER7. To analyze whether the mannoprotein in the cell wall during the development of an mnpAp null-mutant is present or not, immunogold microscopy was also adopted. The surface sculpturing of various cell types - hyphae, conidium, Hulle cell, and ascospore - were not very different between the wild type and the mnpAp-null mutant (DMPV1) as examined by scanning electron microscopy. These results were comparable to those examined by transmission electron microscopy, in that the hyphal cell wall was not indentical between two strains, probably caused by the MnpA protein (MnpAp). MnpAp was absent in both the hyphal cell wall of the DMPV1 strain and the conidial cell wall of a wide type, but clearly recognized in the hyphal cell wall of a wild type.

Mechanical Property and Corrosion Resistance of Mg-Zn-Y Alloys Containing Icosahedral Phase (준결정상을 포함한 Mg-Zn-Y 합금의 기계적 특성 및 부식 저항성)

  • Kim, Do Hyung;Kim, Young Kyun;Kim, Won Tae;Kim, Do Hyang
    • Korean Journal of Metals and Materials
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    • v.49 no.2
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    • pp.145-152
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    • 2011
  • Mechanical and property corrosion resistance of Mg-Zn-Y alloys with an atomic ratio of Zn/Y of 6.8 are investigated using optical microscopy, scanning electron microscopy, transmission electron microscopy, uniaxial tensile test and corrosion test with immersion and dynamic potentiometric tests. The alloys showed an in-situ composite microstructure consisting of ${\alpha}$-Mg and icosahedral phase (I-phase) as a strengthening phase. As the volume fraction of the I-phase increases, the yield and tensile strengths of the alloys increase while maintaining large elongation (26~30%), indicating that I-phase is effective for strengthening and forms a stable interface with surrounding ${\alpha}$-Mg matrix. The presence of I-phase having higher corrosion potential than ${\alpha}$-Mg, decreased the corrosion rate of the cast alloy up to I-phase volume fraction of 3.7%. However further increase in the volume fraction of the I-phase deteriorates the corrosion resistance due to enhanced internal galvanic corrosion cell between ${\alpha}$-Mg and I-phase.

Applications of the Scanning Electron Microscope (주사형(走査型) 전자현미경(電子顯微鏡)의 응용분야(應用分野))

  • Kim, Yong-Nak
    • Applied Microscopy
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    • v.2 no.1
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    • pp.39-46
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    • 1972
  • There are many kinds of microscopes suitable for general studies; optical microscopes(OM), conventional transmission electron microscopes (TEM), and scanning electron microscopes(SEM). The optical microscopes and the conventional transmission electron microscopes are very familiar. The images of these microscopes are directly formed on an image plane with one or more image forming lenses. On the other hand, the image of the scanning electron microscope is formed on a fluorescent screen of a cathode ray tube using a scanning system similar to television technique. In this paper, the features and some applications of the scanning electron microscope will be discussed briefly. The recently available scanning electron microscope, combining a resolution of about $200{\AA}$ with great depth of field, is favorable when compared to the replica technique. It avoids the problem of specimen damage and the introduction of artifacts. In addition, it permits the examination of many samples that can not be replicated, and provides a broader range of information. The scanning electron microscope has found application in diverse fields of study including biology, chemistry, materials science, semiconductor technology, and many others. In scanning electron microscopy, the secondary electron method. the backscattererd electron method, and the electromotive force method are most widely used, and the transmitted electron method will become more useful. Change-over of magnification can be easily done by controlling the scanning width of the electron probe. It is possible. to continuously vary the magnification over the range from 100 times to 1.00,000 times without readjustment of focusing. Conclusion: With the development of a scanning. electron microscope, it is now possible to observe almost all-information produced through interactions between substances and electrons in the form of image. When the probe is properly focused on the specimen, changing magnification of specimen orientation does not require any change in focus. This is quite different from the conventional transmission electron microscope. It is worthwhile to note that the typical probe currents of $10^{-10}$ to $10^{-12}\;{\AA}$ are for below the $10^{-5}$ to $10^{-7}\;{\AA}$ of a conventional. transmission microscope. This reduces specimen contamination and specimen damage due to heatings. Outstanding features of the scanning electron microscope include the 'stereoscopic observation of a bulky or fiber specimen in high resolution' and 'observation of potential distribution and electromotive force in semiconductor devices'.

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Electron Microscopic Study of Protoplast Formation from the Conidiospore of Trichoderma koningii (Trichoderma koningii의 conidiospore로부터의 원형질체 생성에 관한 전자현미경적 연구)

  • Park, H.M.;Lim, H.M.;Hong, S.W.;Hah, Y.C.
    • Applied Microscopy
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    • v.14 no.2
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    • pp.38-51
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    • 1984
  • Fine structure of dormant and swollen conidiospore from Trichoderma koningii and the mechanism of protoplasting from the conidiospore were studied by scanning and transmission electron microscopy. The cell wall of dormant conidiospore was two-layered structure which consisted of electron dense outer layer and electron transparent inner layer. After 8.5 hrs incubation. the conidiospore was swollen and the outer layer of cell wall shown unequal thickness and partial breakage. Protoplast was released through the pore which has been formed by the breakage of outer layer and dissolution of newly synthesized cell wall for germ-tube formation. Swollen conidiospore and protoplast in releasing process contained various cell organelles and vacuoles with electron dense materials. The protoplast contained looser cytoplasm and had no cell wall materials outside of plasmamembrane.

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Formation of Ultrafine Grains in Cu-Fe-P Alloy by Accumulative Roll-Bonding Process (ARB법에 의한 Cu-Fe-P합금의 초미세결정립 형성)

  • Lee, Seong-Hee;Han, Seung-Zeon;Kim, Hyoung-Wook;Lim, Cha-Yong
    • Korean Journal of Materials Research
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    • v.19 no.8
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    • pp.432-436
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    • 2009
  • A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

Transmission Electron Microscopy Observation of Twin Variant Selection in Austenitic Twinning-Induced Plasticity Steel

  • Han, Jung-Hoon;Oh, Juhyun;Yoon, Sangmoon;Kim, Yanghoo;Han, Heung Nam;Kim, Miyoung
    • Applied Microscopy
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    • v.46 no.4
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    • pp.238-243
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    • 2016
  • Twinning-induced plasticity (TWIP) steels with the austenite structure containing high manganese exhibit both good strength and excellent formability. Such properties originate from crystallographic slip and mechanical twins produced when the austenite structure is under mechanical stress. There are 12 twin systems, referred to as twin variants, when slip is induced. These twin systems include twin planes and twin directions and play an important role in determining strength and ductility of the material by strongly influencing texture formation of the austenite structure. In the present study, twins produced in a high-Mn TWIP steel as a result of uniaxial tension were observed using a transmission electron microscope; a comparative analysis was performed through interaction energy calculations. Electron diffraction was used to determine the twin system with respect to the uniaxial tension direction in each grain. Both the Schmid factors and interacting energies required for the generation of twins were calculated and subsequently compared with experimental results. This approach demonstrated the possibility of predicting the deformation behavior of the material.

Characteristics of the Infection of Tilletia laevis Kuhn (syn. Tilletia foetida (Wallr.) Liro.) in Compatible Wheat

  • Ren, Zhaoyu;Zhang, Wei;Wang, Mengke;Gao, Haifeng;Shen, Huimin;Wang, Chunping;Liu, Taiguo;Chen, Wanquan;Gao, Li
    • The Plant Pathology Journal
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    • v.37 no.5
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    • pp.437-445
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    • 2021
  • Tilletia laevis Kuhn (syn. Tilletia foetida (Wallr.) Liro.) causes wheat common bunt, which is one of the most devastating plant diseases in the world. Common bunt can result in a reduction of 80% or even a total loss of wheat production. In this study, the characteristics of T. laevis infection in compatible wheat plants were defined based on the combination of scanning electron microscopy, transmission electron microscopy and laser scanning confocal microscopy. We found T. laevis could lead to the abnormal growth of wheat tissues and cells, such as leakage of chloroplasts, deformities, disordered arrangements of mesophyll cells and also thickening of the cell wall of mesophyll cells in leaf tissue. What's more, T. laevis teliospores were found in the roots, stems, flag leaves, and glumes of infected wheat plants instead of just in the ovaries, as previously reported. The abnormal characteristics caused by T. laevis may be used for early detection of this pathogen instead of molecular markers in addition to providing theoretical insights into T. laevis and wheat interactions for breeding of common bunt resistance.

Practical Issues on In Situ Heating Experiments in Transmission Electron Microscope (투과전자현미경 내 직접 가열 실험에서의 실험적 문제들)

  • Kim, Young-Min;Kim, Jin-Gyu;Kim, Yang-Soo;Oh, Sang Ho;Kim, Youn-Joong
    • Applied Microscopy
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    • v.38 no.4
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    • pp.383-386
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    • 2008
  • In performing in situ heating transmission electron microscopy (TEM) for materials characterizations, arising concerns such as specimen drifts and unintentional Cu contamination are discussed. In particular, we analysed the thermal and mechanical characteristics of in situ heating holders to estimate thermal drift phenomena. From the experimental results, we suggest an empirical model to describe the thermal drift behavior so that we can design an effective plan for in situ heating experiment. Practical approaches to minimize several hindrances arisen from the experiment are proposed. We believe that our experimental recommendations will be useful for a microscopist fascinated with the powerful potential of in situ heating TEM.

Hole Defects on Two-Dimensional Materials Formed by Electron Beam Irradiation: Toward Nanopore Devices

  • Park, Hyo Ju;Ryu, Gyeong Hee;Lee, Zonghoon
    • Applied Microscopy
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    • v.45 no.3
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    • pp.107-114
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    • 2015
  • Two-dimensional (2D) materials containing hole defects are a promising substitute for conventional nanopore membranes like silicon nitride. Hole defects on 2D materials, as atomically thin nanopores, have been used in nanopore devices, such as DNA sensor, gas sensor and purifier at lab-scale. For practical applications of 2D materials to nanopore devices, researches on characteristics of hole defects on graphene, hexagonal boron nitride and molybdenum disulfide have been conducted precisely using transmission electron microscope. Here, we summarized formation, features, structural preference and stability of hole defects on 2D materials with atomic-resolution transmission electron microscope images and theoretical calculations, emphasizing the future challenges in controlling the edge structures and stabilization of hole defects. Exploring the properties at the local structure of hole defects through in situ experiments is also the important issue for the fabrication of realistic 2D nanopore devices.