• 소성∙가공
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• 제14권7호
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• pp.607-612
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• 2005

In this paper, warm deep drawing process with local heating and cooling technique was attempted to improve the formability of AZ31 magnesium alloy which is impossibly to form by conventional methods at room temperature by finite element method and experiment. For FE analysis, in first model with considering heat transfer, both die and blankholder were heated to 573K while the punch was kept at room temperature by cooling water. Also distribution of thickness and von Mises stress at room temperature and 498k for warm deep drawing were compared by FEM. Uniaxial tension tests at elevated temperature were done in order to obtain the temperature dependence of material constant under temperature of $293K\~573K$ and cross head velocity of $5\~500mm/min$. The phenomenological model for warm deep drawing process in this work was based on the hardening law and power law strain rate dependency. Deep drawing experiment were conducted at temperatures of room temperature, 373K, 423K, 473K, 498K, 523K, and 573K for the blank and deep drawing tools(holder and die) and at a punch speed of 10mm/min.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Design & Manufacturing
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• 제13권1호
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• pp.25-30
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• 2019

This paper presents the design strategy for the optimal RTM molds of Carbon Fiber Reinforced Plastic (CFRP) by carbon fiber draping and resin flow simulation. First, the mold shape and molding condition were determined considering the undercut and die face of the product in the draping simulation, which made the preliminary shape of the product by compressing the carbon fiber. After that, the diffusion behavior during the injection of resin in the mold was predicted by the resin flow simulation. Finally, the optimal mold shape was designed by selecting the locations of resin injection port and vent based on total results of simulations. In this paper, the mold of automotive side mirror case was selected as the representative product. Also, the actual mold was manufactured based on the simulation design to confirm the practicality of it. This study is expected to contribute to the industry as a technology to improve the reliability and productivity of CFRP producted by RTM process.

• 한국주조공학회지
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• 제15권2호
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• pp.156-163
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• 1995

Solidification of aluminum alloys under moderate pressures has been investigated. Interfacial heat transfer coefficient at the casting/mold interface varies with time after pouring the molten metal into the die cavity, and therefore plays an important role in determining solidification sequence. The heat transfer coefficients were evaluated by using an inverse problem method, based on the measured temperature distribution. The calculated heat transfer coefficients were used for solidification simulation in the squeeze casting process. The effects of applied pressure and positions of insulation in the mold have also been investigated on solidification microstructures and on the formation of macrosegregation of Al-4.5wt.%Cu alloys.

• 한국기계가공학회지
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• 제3권1호
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• pp.52-58
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• 2004

The material used is a commercial magnesium based alloy AZ31(Mg-3Al-1Zn)sheet with a thickness of 1.0mm. Uniaxial tension tests at warm temperature were carried out to investigate the material characteristics of K, m, and n. A warm drawing process with a local heating and cooling technique was developed to improve formability in this study with results of uniaxial tension tests because it is very difficult for Mg alloy to deform at room temperature by the conventional method. The die and blank holder were heated up, while the punch was water-cooled during deformation. FE simulations considering heat transfer were executed with Mg alloy to investigate the Improvement of deep drawability. For the assessment of improvement those were compare with the results of no considering heat transfer and room temperature.

• Design & Manufacturing
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• 제16권3호
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• pp.44-49
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• 2022

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

• 한국정밀공학회지
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• 제10권2호
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• pp.30-39
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• 1993

The study is concerned with the thermo-viscoplastic finite element analysis of nonisothermal hot container extrusion through conical dies. The problem is treated as a non-steady state incorporating the nonisothermal heat transfer analysis. The analysis of temperature distribution includes heat transfer though the boundary surface including conduction, convection and radiation. The analysis of heat transfer is decoupled with the analysis of deformation and the material interaction is considered through iteration procedure. The effect of important process parameters including die angle and extrusion ratio in the process is investigated. Due to the geometric feature for the container extrusion through conical dies, automatic remeshing is mandatory. Automatic remeshing is achieved by introducing the modular remeshing technique.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.425-428
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• 2006

A semi-solid forming technology has some advantages compared with conventional forming processes such as die casting, squeeze casting and hot/cold forging. In this study, the numerical analysis of semi-solid filling has been studied with solid fraction fs = 30% of A356 aluminum alloys. The finite difference program of two-phase flow model of Navier Stokes' equation coupled with heat transfer and solidification has been developed to predict a filling pattern, liquid segregation and temperature distribution of semi-solid metals. It gives die filling patterns and final solidification area. It can predict mechanical properties of semi-solid forming processes.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.159-164
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• 1997

The optimal conditions were investigated in order to manufacture the light automotive body parts using the semi-solid forging process by the finite element nalysis. Considering about macro-segregation cause to difference of relative velocity between solid phase and liquid phase, solidificational phenomenon cause to heat transfer from die and export of the latent heat, so solid fraction updating algorithm can be proposed. The rigid thermo-viscoplastic finite element analysis was carried out according to die temperature with proposed algorithm, so availability of forming part were understood. The finite element program can be used to the analysis of semi solid forging process.