• Korean Chemical Engineering Research
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• v.47 no.1
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• pp.79-83
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• 2009

In this study, the characteristics of amorphous silicon etching for the formation of gate electrodes have been evaluated at the variation of several process parameters. When total flow rates composed of $Cl_2/HBr/O_2$ gas mixtures increased, the etch rate of amorphous silicon layer increased, but critical dimension (CD) bias was not notably changed regardless of total flow rate. As the amount of HBr in the mixture gas became larger, amorphous silicon etch rate was reduced by the low reactivity of Br species. In the case of increasing oxygen flow rate, etch selectivity was increased due to the reduction of oxide etch rate, enhancing the stability of silicon gate etching process. However, gate electrodes became more sloped according to the increase of oxygen flow rate. Higher source power induced the increase of amorphous silicon etch rate and CD bias, and higher bias power had a tendency to increase the etch rate of amorphous silicon and oxide.

• Safety and Health at Work
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• v.10 no.3
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• pp.347-354
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• 2019

Background: The aim of this study was to describe the types of diseases that developed in semiconductor workers who have registered with the Korea Workers' Compensation and Welfare Service (KWCWS) and to identify potential common occupational characteristics by the type of claimed disease. Methods: A total of 55 semiconductor workers with cancer or rare diseases who claimed to the KWCWS were compared based on their work characteristics and types of claimed diseases. Leukemia, non-Hodgkin lymphoma, and aplastic anemia were grouped into lymphohematopoietic (LHP) disorder. Results: Leukemia (n = 14) and breast cancer (n = 10) were the most common complaints, followed by brain cancer (n = 6), aplastic anemia (n = 6), and non-Hodgkin lymphoma (n = 4). LHP disorders (n = 24) accounted for 43%. Sixty percent (n = 33) of registered workers (n = 55) were found to have been employed before 2000. Seventy-six percent (n = 42) of registered workers and 79% (n = 19) among the registered workers with LHP (n = 24) were found to be diagnosed at a relatively young age, ${\leq}40years$. A total of 18 workers among the registered semiconductor workers were finally determined to deserve compensation for occupational disease by either the KWCWS (n = 10) or the administrative court (n = 8). Eleven fabrication workers who were compensated responded as having handled wafers smaller than eight inches in size. Eight among the 18 workers compensated (44 %) were found to have ever worked at etching operations. Conclusion: The distribution of cancer and rare diseases among registered semiconductor workers was closely related to the manufacturing era before 2005, ${\leq}8$ inches of wafer size handled, exposure to clean rooms of fabrication and chip assembly operations, and etching operations.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.362-371
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• 1995

The purpose of this study was to evaluate the shear bond strength between composite resin and glass ionomer cement according to surface treatment methods of glass ionomer cement. Sixty round acrylic cylinders were fabricated. And then, a round undercut cavity(8 mm diameter, 2.5mm depth) was prepared in the center of the every acrylic cylinder. After all cavities were restored by using light-cured glass ionomer cement. A total of sixty acrylic cylinders restored with glass ionomer cement were divided into 4 groups according to surface treatment methods of glass ionomer cement. The surface treatment of each group were as follows : control group : no treatment Group 1 : acid etching Group 2 : sandblasting Group 3 : air-podwer abrasive polishing The composite resin was bonded to glass ionomer cement of each specimens. And the shear bond strength was tested with a universal testing machine at a cross-head speed of 1mm/min and 500kg in full scale. The results were as follows : 1. The sandblasting group(group 2) had the highest shear bond strength with $272.50{\pm}24.96\;kg/cm_2$ and the acid etching group(group 1) had the lowest shear bond strength with $192.89{\pm}29.32kg/cm_2$. 2. The no treated group(control group) had higher shear bond strength than acid etching group(group 1) (p<0.05). 3. The sandblasting group(group 2), air-powder abrasive polishing group(group 3) and no treated group(control group) had higher shear bond strength than the acid etching group(group 1) (p<0.05). 4. The sandblasting group(group 2) and air-powder abrasive polishing group(group 3) had higher shear bond strength than the no treatment group(control group), but there was not significant(p>0.05).

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.508-512
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• 2004

An ultra-sharp tungsten electrode for field emission was manufactured by using an electrochemical etching method, and its beam characteristics were investigated. KOH and NaOH were the electrolytes used in this research, and the taper length of the tip varied form 150 $\mu\textrm{m}$ to 250 $\mu\textrm{m}$ according to the applied voltage and the concentration of the electrolyte. The electron-beam stability was measured to be within 5% for a total emission current of 5 ${\mu}\textrm{A}$ during 4 hours of operation, and the Ignition voltages were found to be ∼300 V. The tip radius was experimentally found to be 250${\AA}$ from a linear fitting of Fowler-Nordheim plots, which was in remarkably good agreement with that of the image size from scanning ion-microscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.67-67
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• 2009

본 연구는 강유전체 박막의 buffer 층으로 사용되는 Yttrium oxide($Y_2O_3$) 박막에 대한 $BCl_3$/Ar 혼합가스 식각 특성에 대해 연구하였다. 식각 메카니즘을 해석하기 위해 QMS(Quadrupole Mass Spectrometer), OES(Optical Emission Spectroscopy)를 사용하여 플라즈마 특성을 추출하였다. 공정 조건(source power, bias power, pressure, total gas flow)을 동일하게 유지하고 $BCl_3$/Ar 혼합가스 비율을 변화시키며 실험을 진행 하였다. 혼합가스의 비율이 $BCl_3$(80%)/Ar(20%)일때 가장 높은 식각 속도을 나타냈고, 이후 점차 감소하였다. 이때의 식각 속도는 8.8 nm/min 였다. 이에 $Y_2O_3$는 이온 보조 화학식각 특성을 가짐을 확인하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.195-198
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• 2002

Residual stress of sheet occurs during cold rolling and it is hard to avoid and inevitable. The residual stress in the sheet cause etching curls when it suffers peroration process. The residual stress through the thickness direction in the sheet is a function of a friction coefficient, total reduction, mil size and initial sheet thickness. To estimate the residual stress and deformation due to etching curl, FEM analysis is performed. A numerical analysis is used a ANSYS 5.6 and an elastic-plastic constitutive equations. rho simulation results indicate a distribution of residual stress.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.237-240
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• 2005

The demand of micro electrical mechanical system (MEMS) bio/chemical sensor is rapidly increasing. To prevent the contamination of sensing area, a filtration system is required in on-chip total analyzing MEMS bio/chemical sensor. A nano-filter was mainly applied in some application detecting submicron feature size bio/chemical products such as bacteria, fungi and so on. We suggested a simple nano-filter fabrication process based on replication process. The mother pattern was fabricated by holographic lithography and reactive ion etching process, and the replication process was carried out using polymer mold and UV-imprinting process. Finally the nano-filter is obtained after removing the replicated part of metal deposited replica. In this study, as a practical example of the suggested process, a nano-dot array was replicated to fabricate nano-filter fur bacteria sensor application.

• Restorative Dentistry and Endodontics
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• v.33 no.6
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• pp.545-552
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• 2008

The purpose of this study was to evaluate the influence of sodium ascorbate on microtensile bond strengths of total-etching adhesive system to pulp chamber dentin treated with NaOCl. Pulp chambers of extracted human non-caries permanent molars were treated as follows: group 1, with 0.9% NaCl; group 2, with 5.25% NaOCl; group 3, with 5.25% NaOCl and 10% sodium ascorbate for 1min; group 4, with 5.25% NaOCl and 10% sodium ascorbate for 1 min and 10ml of water; group 5, with 5.25% NaOCl and 10% sodium ascorbate for 5 min; group 6, with 5.25% NaOCl and 10% sodium ascorbate for 5 min and 10ml of water; group 7, with 5.25% NaOCl and 10% sodium ascorbate for 10 min; group 8, with 5.25% NaOCl and 10% sodium ascorbate for 10 min and 10ml of water. Treated specimens were dried, bonded with a total-etching adhesive system (Single bond), restored with a composite resin(Z250) and kept for 24h at 100% humidity to measure the microtensile bond strength. NaOCl-treated group (group 2) demonstrated significantly lower strength than the other groups. No significant difference in microtensile bond strengths was found between NaCl-treated group (group 1) and sodium ascorbatetreated groups (group 3-8). The results of this study indicated that dentin treated with NaOCl reduced the microtensile bond strength of Single bond. Application of 10% sodium ascorbate restored the bond strength of Single bond on NaOCl-treated dentin. Application time of sodium ascorbate did not have a significant effect.

• Restorative Dentistry and Endodontics
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• v.33 no.5
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• pp.443-451
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• 2008

The purpose of this study was to evaluate the effect of additional etching procedure prior to Maxcem resin cement application in indirect restoration cementation using push-out bonding strength. One hundred and two extracted human molars were used to make indirect resin restorations of gold inlay and Synfony. These restorations were cemented using Maxcem and Variolink II. Additional etching procedures were done for one group with Maxcem. Three groups have 17 specimens in both restoration types. Push-out bond strength was measured using multi-purpose tester and calculated for bonding strength per sqaure-millimeter area. The mean bonding strength values were compared using SPSS 12.0K program for one-way ANOVA and Scheffe's Test with 95% significance. Under the condition of this study, the additional etching procedure prior to usage of Maxcem resulted in reduced bond strength for both of restoration types.

• Membrane Journal
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• v.19 no.4
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• pp.317-323
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• 2009

In this study the nanofiltration (NF) membrane treatment of a nitric acid waste solutions containing $Pb^{+2}$ heavy metal ion discharging from the etching processes of an electronics and semiconductors industry has been studied for the purpose of recycling of nitric acid etching solutions. Three kinds of NF membranes (General Electric Co. Duraslick NF-4040 membrane, Dow Co. Filmtec LP-4040 membrane and Koch Co. SelRO MPS-34 4040 membrane) were tested for their separation efficiency (total rejection) of $Pb^{+2}$ ion and membrane stability in nitric acid solution. NF experiments were carried out with a dead-end membrane filtration laboratory system. The membrane permeate flux was increased with the increasing storage time in nitric acid solution and lowering pH of acid solution because of the enhancing of NF membrane damage by nitric acid. The membrane stability in nitric acid solution was more superior in the order of Filmtec LP-4040 < Duraslick NF-4040 < SelRO MPS-34 4040 membrane. The total rejection of Pb+2 ion was decreased with the increasing storage time in nitric acid solution and lowering the pH of acid solution. The total rejection of $Pb^{+2}$ ion after 4 months NF treatment was decreased from 95% initial value to 20% in the case of Duraslick NF-4040 membrane, from 85% initial value to 65% in the case of SelRO MPS-34 4040 membrane and from 90% initial value to 10% in the case of Filmtec LP-4040 membrane. These results showed that SelRO MPS-34 4040 NF membrane was more suitable for the treatment of an acidic etching waste solutions containing heavy metal ions.