• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 1998년도 춘계학술발표회 초록집
• /
• pp.56-56
• /
• 1998

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2000년도 추계학술발표회 초록집
• /
• pp.45-45
• /
• 2000

• Current Photovoltaic Research
• /
• 제11권1호
• /
• pp.18-26
• /
• 2023

Tin perovskite solar cells have attracted a lot of attention due to their potential to address the toxicity of lead, which is the biggest barrier to commercialization of perovskite solar cells. Unlike other lead-free perovskite, tin perovskite have a direct bandgap, which is suitable for use as light harvesting, and relatively good stability, which has led to a lot of attention. Since the first tin perovskite solar cell was reported in 2014, it has achieved an impressive power conversion efficiency of 14.81%. However, this efficiency is still low compared to that of lead perovskite solar cells, and the stability of tin perovskite solar cells is also an issue that needs to be addressed. In this review, we will discuss the basic properties of the tin atom in comparison to the lead atom, and then discuss the crystal structure, phase transition, and basic properties of tin perovskite. We will then discuss the advantages, applications, challenges, and strategies of tin perovskite, In particular, we will focus on how to prevent the oxidation of tin, which is arguably the biggest challenge for using tin perovskite solar cells. At the end, we summarize the key factors that need to be addressed for higher efficiency and stability, emphasizing what is needed to commercialize tin perovskite solar cells.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2001년도 추계학술발표회 초록집
• /
• pp.46-47
• /
• 2001

• Bulletin of the Korean Chemical Society
• /
• 제24권8호
• /
• pp.1219-1222
• /
• 2003

• 대한조선학회지
• /
• 제35권4호
• /
• pp.24-32
• /
• 1998

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.201-209
• /
• 2004

As the European Community's Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment banning lead (Pb) in electronics products will take effect on July 1, 2006, most electronics manufacturers will be commencing with volume production of Pb-free components by the middle of 2004. Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Commensurate with this shift will be a somewhat steep learning curve as manufacturers adapt a variety of equipment and processes to contend with the issues surrounding this critical, industry-wide material conversion. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions be made regarding component finish reliability. This paper investigates the properties of electrodeposited tin that may have an effect on component reliability, namely, grain structure (size and shape), oxide formation, tin whisker formation, and solderability. Data will be presented from laboratory and production settings, with the objective being to enable manufacturers to draw their own conclusions regarding previously established perceptions and misconceptions about electrodeposited tin properties.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
• /
• pp.45-47
• /
• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• 마이크로전자및패키징학회지
• /
• 제12권1호
• /
• pp.47-52
• /
• 2005

전세계 전자패키지 산업에서 납(Pb) 사용에 대한 환경규제 움직임이 본격화되고 있어 새로운 무연솔더의 개발이 활발히 이루어지고 있다. 게다가 무연솔더의 신뢰성에 대한정보가 아직까지 많이 부족한 실정이다 무연솔더의 신뢰성에 영향을 줄수 있는 것 중의 하나가 Sn pest라고 알려진 동소체 변태이다. Sn pest가 형성될 때 동반되는 부피의 증가는 솔더 조인트의 신뢰성을 저하시킨다. 이미 보고된 바에 따르면, Sn 고용도가 있는 원소(Pb, Bi, Sb)들을 첨가시킬 경우 Sn pest가 효과적으로 억제된다. 그러나 Sn pest를 억제하는 합금에 대한 기계적인 특성에 연구가 거의 이루어지지 않았다. 본 연구에서는 Sn과 Sn-0.7Cu를 기반으로 하여 Bi, Sb을 첨가한 솔더 합금을 사용하여 lap shear크리프 실험을 하였다. 본 연구에서 사용한 합금들의 변형율은 전체적으로 Sn-3.5Ag를 기반으로 하는 합금들보다 높았다. 파괴까지 이르는 변형량은 Sn-0.5Bi가 가장 크고 Sn-0.7Cu-0.5Sb 합금이 가장 작았는데 이러한 경향은 Sn-0.5Bi 합금의 파단면에 Sn globules이 길게 늘어나 있고 Sn-0.7Cu-0.5Sb 합금에서는 더 짧은 Sn globules 이 관찰되는 결과와 일치하였다.

• 한국표면공학회지
• /
• 제5권3호
• /
• pp.89-94
• /
• 1972