• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.336-341
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• 2008

Recently, research on a flat panel display(FPD) has focused on organic light-emitting display(OLED) which has wide angle of view, high contrast ratio and low power consumption. ITO(Indium-Tin-Oxide) films are the most widely used material as a transparent electrode of OLED and also in many other display devices like LCD or PDP. The performance and efficiency of OLED is related to the surface condition of ITO coated glass substrate. The typical surface defect of glass substrate is measured for electric characteristics and physical condition for transmittance and roughness. Since ITO coated glass substrate can be destroyed for inspection about surface roughness, sheet resistance, film thickness and transmittance, precise fabrication condition should be made based on the estimated relationship. In this paper, ITO films were prepared on the commercial glass substrate by the Ion-Plating method changing the partial pressure of gas(Ar, 02) and the chamber temperature between $200^{\circ}C$ and $300^{\circ}C$. The characteristics of films were examined by the 4-point probe, supersonic thickness measurement, transmittance measurement and AFM. We estimated the relationship between processing parameters(Ar gas, O2 gas, Temperature) and properties of ITO films (Sheet Resistance, Film Thickness, Transmittance, Surface Roughness).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• The korean journal of orthodontics
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• v.28 no.1 s.66
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• pp.123-133
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• 1998

The effectiveness of TiN ion-plating was examined with TiN ion-plated Co-Cr wires(.016“, .016”x.022“) on three different types of bracket(TiN ion-plated metal bracket ceramic bracket and plastic bracket). Maximum static frictional forces and characteristic curves obtained from the frictional characteristic graph, were compared and surface roughness of wires and bracket slots before and after friction experiment was observed by SEM. The obtained results were as follows $\cdot$The frictional forces of TiN ion-plated wires were significantly lower than those of non ion-plated wires(p<0.05). $\cdot$On the effect of wire shape, the frictional forces of round wires were significantly lower than those of rectangular wires(p<0.05) $\cdot$As the result of the SEM observation on the wires and bracket slots after the friction experiment the surface of non ion-plated wires was rougher than that of TiN ion-plated ones. $\cdot$The difference between the static frictional forces and the kinetic frictional forces was not significant in case of the TiN ion-plated round ins, but the static frictional forces were a little higher than the kinetic frictional forces in the TiN ion-plated rectangular wires. $\cdot$The static frictional forces were much higher than the kinetic frictional forces in the case of non ion-plated wires.

• Resources Recycling
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• v.23 no.3
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• pp.61-70
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• 2014

Tin has been widely used to solder, tin plated steel, bronze alloy, sputtering target for transparent electrode and chemical additives. It has been widely reported to the recycling technologies for tin scraps because of the scarcity and economic efficiency of the reserve. This study was analyzed by using open/registered patents KR, US, CN, JP and EP related to recycling technologies for processing scrap, sludges, waste fluid for plating process and spent alloy containing tin in between 1970 and 2013. Patents were collected using key-words searching and filtered by filtering criteria. The trends of the patents were analyzed by year, country, appliant and technology.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.604-605
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• 2006

Recently the Marangoni convention is supposed to be an important phenomenon that significantly affects the solidification. For understanding the Marangoni convection mechanism, visualizing the convention phenomenon of molten tin with ultrasonic has been conducted. This paper reports developing a tracer material of micro metal balloon that is used in the molten system. We have succeeded in coating the surface of Shirasu-ballons with nickel by plating process. The obtained metal balloon is spherical and some characterizations were conducted.

• Journal of the Korean institute of surface engineering
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• v.23 no.3
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• pp.144-149
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• 1990

X-ray phtoelectron spectroscopy has been used to obtain information on the behavior of the Pb catalysis and Sn sensitizer on the bariumtitanate ceramic substrate. SnF2 sensitization and PbCl2 activation process are used are used to prepare nonconductive substrate for electroless plating. This method of surface preparation is compared to Pd-Sn mixed solu tions and Ag pretreatment process. In all the case, the bonding energy is about 487.5eV for Sn and 336.5~337.5eV for Pb.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.127-128
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• 2014

현재 기술 산업에서 PET위 무전해 도금을 실행하기 위해 다양한 전처리 공정과 Catalyst가 소개되고 있다. 그 중에서 가장 일반적으로 사용되고 있는 Catalyst는 Palladium으로서 Tin과 산화 환원 반응으로 Electroless Copper Deposition 단계에서 구리 도금의 Target으로 작용하고 있다. 하지만 상대적으로 Palladium은 생산 비용이 높으며 Tin은 쉽게 산화되는 문제점이 남아 있다. 이를 대체하기 위한 대안 공정으로서 Palladium 대신 Silver를 이용하여 Catalyst로서의 역할을 하는 공정이다. 이전에 PET위 전처리 공정으로 Ultra Violet을 사용하여 표면을 개질 시키는 방법을 연구했으며, 그 후 Potassium Permanganate와 Silver Catalyst의 Mechanism을 연구 했다. PET 표면 개질을 거치면서 화학 구조가 바뀌어 표면에 Carbon Carbon Double Bond를 형성한다. 이때 Permanganate ion이 새로이 형성된 이중 결합과 반응하여 두 개의 extra-OH functional group을 생성함과 동시에 $MnO_2$를 만들어 표면에 흡착 시킨다. $MnO_2$는 전위차에 의해 Silver Ion과 Redox Reaction을 일으키며 실질적인 Catalyst 역할을 하게 된다. Silver Catalyst는 무전해 구리 도금 용액 안에서 Copper의 Target으로 작용한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.92-93
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• 2014

주석 도금시 발생하는 주석 폐 도금 슬러지로부터 주석을 회수하기 위해 염산 직접 침출방법과 환원 열처리($700^{\circ}C{\sim}1100^{\circ}C$)후 염산 침출방식을 고찰하였다. 폐 슬러지의 염산 직접 침출시 주석의 침출율은 40% 이하였다. 폐 슬러지를 수소분위기하에서 $700^{\circ}C$, $800^{\circ}C$, $900^{\circ}C$, $1100^{\circ}C$로 열처리한 후에 염산을 이용하여 침출시에는 환원된 주석의 침출율이 97% 이상이었고, 온도가 $800^{\circ}C$일 때 침출율이 98.2 %로 가장 효과가 좋았다.