• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2000.11a
• /
• pp.75-76
• /
• 2000

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2003.05a
• /
• pp.76-77
• /
• 2003

• Journal of the Korean institute of surface engineering
• /
• v.8 no.2
• /
• pp.1-6
• /
• 1975

A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

• Journal of the Korean institute of surface engineering
• /
• v.16 no.3
• /
• pp.98-107
• /
• 1983

A study on the improvement of wear resistance of brasses by electroplating and diffusion treatment of tin was carried out. The optimum condition of the treatment obtained was as follows. Plating thickness of tin : 5 - 9 $\mu\textrm{m}$ Condition of diffusion treatment : atmosphere ; fused nitrate bath (KNO3 + NaNO3) temperature and time ; 1st step 320$^{\circ}C$, 60min. and 450$^{\circ}C$, 30min. During the diffusion treatment, internetallic compounds of Cu-Sn were formed and these compounds were identified as η, $\varepsilon$ and $\delta$ phase from the outer tin layer. It was considered that the improvement of wear resistance of brasses by the treatment is because of the formation of intemetallic compounds particalarly $\varepsilon$phase which is very hard, between soft tin layer brass.

• Korean Journal of Materials Research
• /
• v.18 no.3
• /
• pp.163-168
• /
• 2008

The morphology of three-dimensional (3D) cross-linked electrodeposits of copper and tin was investigated as a function of the content of metal sulfate and acetic acid in a deposition bath. The composition of copper sulfate had little effect on the overall copper network structure, whereas that of tin sulfate produced significant differences in the tin network structure. The effect of the metal sulfate content on the copper and tin network is discussed in terms of whether or not hydrogen evolution occurs on electrodeposits. In addition, the hydrophobic additive, i.e., acetic acid, which suppresses the coalescence of evolved hydrogen bubbles and thereby makes the pore size controllable, proved to be detrimental to the formation of a well-defined network structure. This led to a non-uniform or discontinuous copper network. This implies that acetic acid critically retards the electrodeposition of copper.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.17-21
• /
• 2008

The electroless plating of copper and tin were investigated for the fabrication of Sn-Cu bump. Copper and tin were electroless plated in series on $20{\mu}m$ diameter copper via to form approximately $10{\mu}m$ height bump. In electroless copper plating, acid cleaning and stabilizer addition promoted the selectivity of bath on the copper via. In electroless tin plating, the coating thickness of tin was less uniform relative to that of electroless copper, however the size of Sn-Cu bump were uniform after reflow process.

• Resources Recycling
• /
• v.31 no.6
• /
• pp.18-24
• /
• 2022

Dry reduction using natural gas was proposed to recover tin from waste tin oxide generated in a tin bath that was used for controlling the smoothness of architectural glass during production, and the reduction behavior was investigated. The utilized vertical natural gas dry reduction system is capable to process 4 L or 20 kg depending on input raw materials. The system was established by applying the upper intake and lower discharge method. The recovery rate was 97.2% at 800 ℃ and 4 sccm flow rate and increased with the amount of input gas. Hydrogen accounted for 23% of the discharge gas, showing a 16.6% hydrogen conversion rate. The reaction behavior of tin recovered via natural gas reduction provides basic data on the new waste resource reduction/recovery technology.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.1
• /
• pp.34-41
• /
• 2003

Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from $10A/dm^2$ to $30A/dm^2$, however the carbon content was highly increased in the range of $40A/dm^2$$∼50A/dm^2$. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.

• Journal of the Korean institute of surface engineering
• /
• v.26 no.5
• /
• pp.245-254
• /
• 1993

The effects of pulse current electrolysis conditions on the composition and the microstructure of Ag-Sn alloy were studied by using a pyrophosphate bath. Both cathode current efficiency and throwing power of alloy deposits formed under pulse plating conditions, decreased with increasing mean current density, and lower than those under D.C. electrolysis condition. Tin content of Ag-Sn alloy decreased noticebly with in-creasing the mean current density, while it increased with the increase of On-time from 1 to 10 ms. The pre-ferred orientation of Ag-Sn alloy changed with increasing cathode overpotential in the sequence of (100)longrightarrow(100)+(111)longrightarrow(111) at $20^{\circ}C$ and (110)longrightarrow(111)longrightarrow(111)+(100) at $30^{\circ}C$. The effective crystal grain size of the alloy was decreased by decreasing temperature from $30^{\circ}C$ to $20^{\circ}C$ and the surface structure of them was related to the preferred orientation.

• Journal of the Korean institute of surface engineering
• /
• v.34 no.4
• /
• pp.303-312
• /
• 2001

Composition and microstructure of the tin-zinc alloys electroplated in gluconate bath were studied according to pulse current parameters. The cathode current efficiency increased with both the mean current density and the off-time decrease. Zinc content of the alloy deposits increased with increasing mean current density, while it decreased noticebly with increasing the off-time from 10-30ms to 100-150ms. The preferred orientation of the alloy deposits changed with the increase of peak current density in the sequence of (220)longrightarrow(220)+(420) or (220)+(420)+(321) mixed structure. The equiaxed grain size of the alloy increased with the increase of off-time and the decrease of mean current density.