• Title/Summary/Keyword: TiAgN

Search Result 79, Processing Time 0.02 seconds

Deposition $Ba_{1-x}Sr_xTiO_3$Thin Films and Electrical Properties with Various Materials Top Electrodes (강유전체$Ba_{1-x}Sr_xTiO_3$ 박막의 제조 및 상부전극재료에 따른 전기적 특성)

  • Park, Choon-Bae;Kim, Deok-Kyu;Jeon, Jang-Bae
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.48 no.6
    • /
    • pp.410-415
    • /
    • 1999
  • $Ba_{1-x}Sr_xTiO_3$ thin films with various ratio of Sr (X = 0.4, 0.5, 0.6) were grown $Pt/TiN/SiO_2/Si$ subastrate by RF magnetron sputtering deposition. As, Ag, and Cu films were deposited on $Ba_{1-x}Sr_xTiO_3$ thin films as top electrodes by using a thermal evaporator. The electrical properties of $Ba_{1-x}Sr_xTiO_3$ thin films for various compositions were characterized and the physical properties at interface between $Ba_{1-x}Sr_xTiO_3$ thin films and top electrodes were evaluated in terms of the work function difference. At x =0.5, the degradation of capacitance is lower to the other compositions. As negative biasapplied, the specimen with Cu top electrode has board saturation region and low leakage current since work function of Cu is bigger than other electrodes.$ Ba_{0.5}Sr_{0.5}TiO_3$ thin films with Cu top electrode, the dielectric constant was measured to the value of 354 at 1 kHz and the leakage current was obtained to the value of $5.26\times10^{-6}A/cm2$ at the forward bias of 2 V.

  • PDF

High Efficiency Solar Cell(I)-Fabrication and Characteristics of $N^+PP^+$ Cells (고효율 태양전지(I)-$N^+PP^+$ 전지의 제조 및 특성)

  • 강진영;안병태
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.18 no.3
    • /
    • pp.42-51
    • /
    • 1981
  • Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

  • PDF

Nanoscale Longitudinal Normal Strain Behavior of ${Si_3}{N_4}$-to-ANSI 304L Brazed Joints under Pure Bending Condition

  • Seo, D.W.;Lim, J.K.
    • International Journal of Korean Welding Society
    • /
    • v.4 no.1
    • /
    • pp.46-52
    • /
    • 2004
  • To combine the mechanical advantages of ceramics with those of metals, one often uses both materials within one composite component. But, as known, they have different material properties and fracture behaviors. In this study, a four-point bending test is carried out on $Si_3N_4$ joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu interlayer at room temperature to evaluate their longitudinal strain behaviors. And, to detect localized strain, a couple of strain gages are pasted near the joint interfaces of the ceramic and metal sides. The normal strain rates are varied from $3.33{\times}10^5$ to $3.33{\times}10^{-1}s^{-1}$ Within this range, the experimental results showed that the four-point bending strength and the deflection of the interlayer increased with increasing the strain rate.

  • PDF

Lead-free inorganic metal perovskites beyond photovoltaics: Photon, charged particles and neutron shielding applications

  • Srilakshmi Prabhu;Dhanya Y. Bharadwaj;S.G. Bubbly;S.B. Gudennavar
    • Nuclear Engineering and Technology
    • /
    • v.55 no.3
    • /
    • pp.1061-1070
    • /
    • 2023
  • Over the last few years, lead-free inorganic metal perovskites have gained impressive ground in empowering satellites in space exploration owing to their material stability and performance evolution under extreme space environments. The present work has examined the versatility of eight such perovskites as space radiation shielding materials by computing their photon, charged particles and neutron interaction parameters. Photon interaction parameters were calculated for a wide energy range using PAGEX software. The ranges of heavy charged particles (H, He, C, N, O, Ne, Mg, Si and Fe ions) in these perovskites were estimated using SRIM software in the energy range 1 keV-10 GeV, and that of electrons was computed using ESTAR NIST software in the energy range 0.01 MeV-1 GeV. Further, the macroscopic fast neutron removal cross-sections were also calculated to estimate the neutron shielding efficiencies. The examined shielding parameters of the perovskites varied depending on the radiation type and energy. Among the selected perovskites, Cs2TiI6 and Ba2AgIO6 displayed superior photon attenuation properties. A 3.5 cm thick Ba2AgIO6-based shield could reduce the incident radiation intensity to half its initial value, a thickness even lesser than that of Pb-glass. Besides, CsSnBr3 and La0.8Ca0.2Ni0.5Ti0.5O3 displayed the highest and lowest range values, respectively, for all heavy charged particles. Ba2AgIO6 showed electron stopping power (on par with Kovar) better than that of other examined materials. Interestingly, La0.8Ca0.2Ni0.5Ti0.5O3 demonstrated neutron removal cross-section values greater than that of standard neutron shielding materials - aluminium and polyethylene. On the whole, the present study not only demonstrates the employment prospects of eco-friendly perovskites for shielding space radiations but also suggests future prospects for research in this direction.

Synthesis and Characterization of Thiophene-Based Copolymers Containing Urethane and Alkyl Functional Side Chains for Hybrid Bulk Heterojunction Photovoltaic Cell Applications

  • Im, Min-Joung;Kim, Chul-Hyun;Song, Myung-Kwan;Park, Jin-Su;Lee, Jae-Wook;Gal, Yeong-Soon;Lee, Jun-Hee;Jin, Sung-Ho
    • Bulletin of the Korean Chemical Society
    • /
    • v.32 no.2
    • /
    • pp.559-565
    • /
    • 2011
  • The following noble series of statistical copolymers, poly[(2-(3-thienyl)ethanol n-butoxycarbonylmethylurethane)-co-3-hexylthiophene] (PURET-co-P3HT), were synthesized by the chemical dehydrogenation method using anhydrous $FeCl_3$. The structure and electro-optical properties of these copolymers were characterized using $^1H$-NMR, UV-visible spectroscopy, elemental analysis, GPC, DSC, TGA, photoluminescence (PL), and cyclic voltammetry (CV). The statistical copolymers, PURET-co-P3HT (1:0, 2:1, 1:1, 1:2, 1:3), were soluble in common organic solvents and easily spin coated onto indium-tin oxide (ITO) coated glass substrates. Hybrid bulk heterojunction photovoltaic cells with an ITO/G-PEDOT/PURET-co-P3HT:PCBM:Ag nanowires/$TiO_x$/Al configuration were fabricated, and the photovoltaic cells using PURET-co-P3HT (1:2) showed the best photovoltaic performance compared with those using PURET-co-P3HT (1:0, 2:1, 1:1, 1:3). The optimal hybrid bulk heterojunction photovoltaic cell exhibits a power conversion efficiency (PCE) of 1.58% ($V_{oc}$ = 0.82 V, $J_{sc}$ = 5.58, FF = 0.35) with PURET-co-P3HT (1:2) measured by using an AM 1.5 G irradiation (100 mW/$cm^2$) on an Oriel Xenon solar simulator (Oriel 300 W).

Effect of Surface States of the Substrate on the Temperature Rampup Rate During Rapid Thermal Annealing by Halogen Lamps (할로겐 램프에 의한 급속 열처리에서 기판 표면 상태에 따른 온도 상승 효과에 관한 연구)

  • 민경익;이석운;주승기
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.28A no.10
    • /
    • pp.840-846
    • /
    • 1991
  • In case of the rapid thermal process by halogen lamps, an optical pyrometer is generally used to measure the temperature. It is, however, necessary to measure the temperature by the thermocouple when the process temperature is lower than 700$^{\circ}C$ and the correction of the temperature is required. Contact by the PdAg paste is commonly used out but in this case it is impossible to see the effect of surface states of the substrate, which is critical in the rapid thermal process. In this study, real temperature ramping speed of silicon substrates coveredwith various thin films such as SiO$_2$2, Si$_{3}N_{4}$, dopants, and conductive layers (Ti or Co) was investigated by a mechanical contact of the thermocouple. And the results were compared with the case in which the contact was made by the PdAg paste. Effect of process ambient was also studied. It was found that depending on the surface state, overshoot more than 100$^{\circ}C$ could occur. It was also found that in case of the substrate covered with conductive layers, mechanical contact might render the correct temperature.

  • PDF

UHV Materials (초고진공계재료)

  • 박동수
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 1998.02a
    • /
    • pp.24-24
    • /
    • 1998
  • 반도체장비를 포함하는 초고진공장비의 園훌化가 급속히 그리고 절실히 요구되고 있는 것이 현실정이다. 當面해서 실현할 국산진공장비의 대상은 廣範圍하다. 즉, 각종 진공 pump ( (rotary, dry, diffusion, cryo, ion, turbo melecular pump), 진공 chamber, 진공 line, gate valve 를 위 시 한 진공 V머ve, flange, gasket, fl않d야lU, mainpulater 퉁 진공 部品이 다. 진공계 의 핵심 은 適切하고 優良한 진공재료의 선태파 사용이다. 진공장비는 사용자가 원하는 진공도를 원하 는 시간 동안 륨空度를 유지해 주어야 한다. 진공재료 선태의 기준사항은:(1) 기체의 透過성 (2) 薰했훌 (3) 혔體放出특성 - -outgassing과 degassing- (4) 機械的 량훌度 (5) 온도 의존성 (6) 化學톡성 (7) 加I성 및 鎔接 성 (8) 課電특성 (9) 磁氣특성 (10) 高速함子 및 放射線 특성 (11) 經濟성 및 調達생 둥이 다. 우량한 초고진공계재료는 풍부하게 개발되어 왔고, 또 新材料들이 개발되고 있다. 여기에서는 주로 초고진공 내지는 극고진공계의 構造材料, 機能材料, 部品材料 일반파 몇가지 신재료의 특 성에 관해서 記述한다. M Mild SteeHSAE, 1112, 1010, 1020, 1022, etc)., S Stainless SteeHAlSI, 304, 304L, 310, 316, 321, 347): 구조재료, chamber, fl하1ges A Aluminum과 Alloys (1060, 1100, 2014, 4032, 6(뻐1): 구조재료, chamber, flanges, gaskets A AI, Al 떠loy는 SS에 代替하는 역 할올 시 작하고 있다. C Copper, Copper Alloys(C11$\alpha$)0, C26800, C61400, Cl7200): 내장인자, gasket, cryopanel, tubing T Titanium, Ziriconium, Haf띠um 및 Alloys: 특히 Ti은 10n pump 용 getter material 이 외 에 U UHV,XHV용 chamber계로서 관심올 끌고 있다. N Nickel, Nickel Alloys (200, 204, 211, monel, nichrome): 부식 방지 , 전자장치 , 자기 장치 귀 금속(Ag, Au, Pt, Pd, Rh, Ir, Os, Ru): 보조부품, gasket, filament, coating, thermocouple, 접 합부위 T TiC, SiC, zrC, HfC, TaC 둥의 탄화물과, BN, TiN, AlN 동의 질화물, 붕화물이 둥장하고 었 다. 유리: Soda Lime, Borosilicate, Potash Soda Lead: View Port, Chamber envelope C Ceramics: AlZ03, BeO, MgO, zrOz, SiOz, MgOzSiOz, 3Alz032SiOz, Z$textsc{k}$hSiOz S상N4: e electrical, thermal insulators, crucibles, boats, single crystals, sepctr려 windows 저자는 최근 저자들이 발견한 Zr-Ti-Cu-Ni-Be amorphous alloys coated cham뾰r가 radiation p proof로 이용될 수 있는 사실을 점검하고 었다 .. Z.Y. Hua 들은 Cs3Sb를 새로운 photocathode 재료로 보고하고 있다.

  • PDF

AN ELECTROCHEMICAL STUDY ON THE CORROSION RESISTANCE OF THE VARIOUS IMPLANT METALS (수종 임플랜트 금속의 내식성에 관한 전기화학적 연구)

  • Jeon Jin-Young;Kim Yung-Soo
    • The Journal of Korean Academy of Prosthodontics
    • /
    • v.31 no.3
    • /
    • pp.423-446
    • /
    • 1993
  • Titanium and its alloys are finding increasing use in medical devices and dental implants. The strong selling point of titanium is its resistance to the highly corrosive body fluids in which an implant must survive. This corrosion resistance is due to a tenacious passive oxide or film which exists on the metal's surface and renders it passive. Potentiodynamic polarization measurement is one of the most commonly used electro-chemical methods that have been applied to measure corrosion rates. And the potentiodynamic polarization test supplies detailed information such as open circuit, rupture, and passivation potential. Furthermore, it indicates the passive range and sensitivity to pitting corrosion. This study was designed to compare the corrosion resistance of the commonly used dental implant materials such as CP Ti, Ti-6A1-4V, Co-Cr-Mo alloy, and 316L stainless steel. And the effects of galvanic couples between titanium and the dental alloys were assessed for their useful-ness-as. materials for superstructure. The working electrode is the specimen , the reference electrode is a saturated calomel electrode (SCE), and the counter electrode is made of carbon. In $N_2-saturated$ 0.9% NaCl solutions, the potential scanning was performed starting from -800mV (SCE) and the scan rate was 1 mV/sec. At least three different polarization measurements were carried out for each material on separate specimen. The galvanic corrosion measurements were conducted in the zero-shunt ammeter with an implant supraconstruction surface ratio of 1:1. The contact current density was recorded over a 24-hour period. The results were as follows : 1. In potential-time curve, all specimens became increasingly more noble after immersion in the test solution and reached between -70mV and 50mV (SCE) respectively after 12 hours. 2. The Ti and Ti alloy in the saline solution were most resistant to corrosion. They showed the typical passive behavior which was exhibited over the entire experimental range. Therefore no breakdown potentials were observed. 3. Comparing the rupture potentials, Ti and Ti alloy had the high(:st value (because their break-down potentials were not observed in this study potential range ) followed by Co-Cr-Mo alloy and stainless steel (316L). So , the corrosion resistance of titanium was cecellent, Co-Cr-Mo alloy slightly inferior and stainless steel (316L) much less. 4. The contact current density sinks faster than any other galvanic couple in the case of Ti/gold alloy. 5. Ag-Pd alloy coupled with Ti yielded high current density in the early stage. Furthermore, Ti became anodic. 6. Ti/Ni-Cr alloy showed a relatively high galvanic current and a tendency to increase.

  • PDF

고밀도 유도 결합 플라즈마를 이용한 박막 증착 장치 개발

  • 주정훈
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
    • /
    • 2003.12a
    • /
    • pp.26-30
    • /
    • 2003
  • 안테나 내장형 유도결합 플라즈마를 마그네트론 스퍼터링 장치에 추가하고 플라즈마의 생성 조건을 제어함으로써 고품질의 박막을 증착할 수 있는 장치의 개발 연구를 수행하였다. 정확한 장치의 성능을 평가하고 앞으로의 개선점을 찾기 위하여 Langmuir probe, OES, RF impedance probe, QMS 등의 플라즈마 진단 도구들을 사용하여 기본 동작 특성 및 공정중 플라즈마의 전자 온도, 밀도, 방출 파장 분석을 통한 입자 상태 분석, 부하 임피던스와 시스템 임피던스 분석을 통한 파워 전달 특성을 평가하고 이에 따라서 장치의 구성 및 동작 조건을 변경 개선하였다. 실험 대상 박막계는 기본 물성 측정을 위한 Al, Ag, TiN, MgO, Si, $SiO_2$, 등이며 타겟의 크기는 2인치 직경의 원형, 12인치 원형, 5인치 * 25인치 사각형 3가지 이다.

  • PDF

Light-managing Techniques at Front and Rear Interfaces for High Performance Amorphous Silicon Thin Film Solar Cells (고성능 비정질실리콘 박막태양전지를 위한 전후면 계면에서의 빛의 효율적 관리 기술)

  • Kang, Dong-Won
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.66 no.2
    • /
    • pp.354-356
    • /
    • 2017
  • We focused on light management technology in amorphous silicon solar cells to suppress increase in absorber thickness for improving power conversion efficiency (PCE). $MgF_2$ and $TiO_2$ anti-reflection layers were coated on both sides of Asahi VU ($glass/SnO_2:F$) substrates, which contributed to increase in PCE from 9.16% to 9.81% at absorber thickness of only 150 nm. Also, we applied very thin $MgF_2$ as a rear reflector at n-type nanocrystalline silicon oxide/Ag interface to boost photocurrent. By reinforcing rear reflection, we could find the PCE increase from 10.08% up to 10.34% based on thin absorber about 200 nm.