• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.7
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• pp.344-348
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• 2006

The effect of x on microwave dielectric properties of the $(1-x)Mg_4Ta_2O_9-x(TiO_2,\;CaTiO_3,\;SrTiO_3)$ ceramics for microwave components were investigated. All spcecimens prepared by the conventional mixed oxied method and sintered at $1450^{\circ}C$. Microwave dielectric properties of the $(1-x)Mg_4Ta_2O_9-xTiO_2$ ceramics were influenced by $MgTi_2O_5$ phase. Also the microwave dielectric properties of the $(1-x)Mg_4Ta_2O_9-x(TiO_2,\;CaTiO_3,\;SrTiO_3)$ ceramics were dominated with an addition of $CaTiO_3\;and\;SrTiO_3$. The dielectric constant $(\varepsilon_r)$, quality factor $(Q{\times}f_r)$ and temperature coefficient of the resonant frequency $(TCRF,\;\tau_f)$ of the $(1-x)Mg_4Ta_2O_9-x(TiO_2,\;CaTiO_3,\;SrTiO_3)$ ceramics were $12.96\sim70.98,\;5,132\sim186,410GHZ$ and $-35.82\sim+75.96ppm/^{\circ}C$, respectively, and depend on x and addition materials.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.484-488
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• 2007

Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4＋NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.5
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• pp.510-515
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• 1999

Synthesize of anatase type $TiO_2$ from $TiCl_4$ solution was studied. KOH was used on dehydration reaction of $TiCl_4$ solution. Products of dehydration reaction was calcined at 300, 500, 700, 900, $1000^{\circ}C$ during 1hour. Calcined products was studied by XRD, DTA, and FT-IR for effect of calcined temperature. The results are as follow. \circled1 Product pf dehydration reaction at$ 90^{\circ}C$ was semicrystalline anatase type $TiO_2$ because it has a peak vary broad and low at the position of anatase crysral XRD pattern. \circled2 Pure titanium oxide semi-crystalline products were produced at acid pH condition which convert to anatase crystal at $300^{\circ}C$ and to rutile crystal at $700^{\circ}C$. \circled3 The chemical composition of semicrystalline products which was produce at alkali pH conditions, were potasium titante. Potasium-titanate semi-crystalline products crystallized at 630~$640^{\circ}C$ \circled4 The transition temperature of potassium dopped titanium oxide semi-crystalline products was increased with the contents of potasium. \circled5 The optimum synthesise condition of anatase $TiO_2$ products from $TiCl_4$ and KOH are pH 3~5 and $300^{\circ}C$ calcination.

• Journal of the Korean Ceramic Society
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• v.33 no.4
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• pp.418-424
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• 1996

(Ti.W)C complex carbide was synthesized by self-propagating high temperature synthesis (SHS) chemical furnace. Attempt to find the optimal condition for synthesis of (Ti.W)C the effects of molar ratio of Ti:W:C on the synthesized powders and mechanical properties were investigated, Optimum molar ratio of these synthe-sized powder was Ti:W:C=0.7:0.2:1.0 The bulk density M,O.R Hardness Fracture toughness of (Ti.W)C complex carbide sintered at 200$0^{\circ}C$ for 60 min by hot-pressing under the pressure of 20 MPa were 7.6g/cm3, 475 MPa, 17,.7 GPa respectively.

• Journal of the Korean institute of surface engineering
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• v.42 no.2
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• pp.73-78
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• 2009

Quinary Ti-Al-Si-C-N films were successfully synthesized on SUS 304 substrates and Si wafers by a hybrid coating system combining an arc ion plating technique and a DC reactive magnetron sputtering technique. In this work, the effect of Si content on the microstructure and mechanical properties of Ti-Al-C-N films were systematically investigated. It was revealed that the microstructure of Ti-Al-Si-C-N coatings changed from a columnar to a nano-composite by the Si addition. Due to the nanocomposite microstructure of Ti-Al-Si-C-N coatings, the microhardness of The Ti-Al-Si-C-N coatings significantly increased up to 56 GPa. In addition the average friction coefficients of Ti-Al-Si-C-N coatings were remarkably decreased with Si addition. Therefore, Ti-Al-Si-C-N coatings can be applicable as next-generation hard-coating materials due to their improved hybrid mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.834-837
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• 2003

In this study, Ohmic contacts make on 3C-SiC using TiN. Ohmic contact resistivity of TiN/3C-SiC was evaluated. Specific contact resistance was calculated by Circular-TLM(transmission line model) method and physics properties were measured using XRD, SEM, respectively. TiN contact is stable at high temperatures and a good diffusion barrier material. The TiN/3C-SiC contacts are thermally stable to annealing temperatures up to $1000^{\circ}C$. The TiN thin-film depostied on 3C-SiC substraes have good electrical properties. Therefore, the TiN/3C-SiC contact can be usefully applied for high-temperature MEMS applications over $500^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.35 no.2
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• pp.196-200
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• 1998

Effect of diffusion induced recrystallization(DIR) on mechanical properties of hot-pressed TiC was in-vestigated. The TiC specimen was electroplated with Cr and then heat-treated at 1550. Through the DIR process a new set of (Ti, Cr) C mixed carbide grains with uniform and small size was formed at the surface. As a consequence the scattering in fracture strength decreased and the toughness increased.

• Journal of the Korean Ceramic Society
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• v.45 no.9
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• pp.544-548
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• 2008

The formation of $TiB_2-SiC$ ceramics from $TiB_2$-Polycarbosilane (PCS) mixtures was investigated. The powder mixture of $TiB_2$ with PCS was pressed at $300^{\circ}C$ with 200 MPa and sintered at $1700{\sim}2000^{\circ}C$ for 1 h in a flowing Ar atmosphere. The sintered density of $TiB_2$ with PCS is 93.7% after sintering at $2000^{\circ}C$ for 1 h, which is slightly smaller than that of the specimen without PCS. The microstructure of $TiB_2$ with PCS consists of small and uniform $TiB_2$ particles with well dispersed SiC particles derived from PCS. It is believed that the addition of PCS was effective to suppress the grain growth of $TiB_2$.

• Journal of Powder Materials
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• v.23 no.1
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• pp.33-37
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• 2016

10 wt.% and 20 wt.%$Li-TiO_2$ composite powders are synthesized by a sol-gel method using titanium isopropoxide and $Li_2CO_3$ as precursors. The as-received amorphous 10 wt.%$Li-TiO_2$ composite powders crystallize into the anatase-type crystal structure upon calcination at $450^{\circ}C$, which then changes to the rutile phase at $750^{\circ}C$. The asreceived 20 wt%$Li-TiO_2$ composite powders, on the other hand, crystallize into the anatase-type structure. As the calcination temperature increases, the anatase $TiO_2$ phase gets transformed to the $LiTiO_2$ phase. The peaks for the samples obtained after calcination at $900^{\circ}C$ mainly exhibit the $LiTiO_2$ and $Li_2TiO_3$ phases. For a comparison of the photocatalytic activity, 10 wt.% and 20 wt.% $Li-TiO_2$ composite powders calcined at $450^{\circ}C$, $600^{\circ}C$, and $750^{\circ}C$ are used. The 20 wt.%$Li-TiO_2$ composite powders calcined at $600^{\circ}C$ show excellent efficiency for the removal of methylorange.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.