• Title/Summary/Keyword: Ti-Ni-Cu-Mn alloys

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The B2-B19-B19' Transformation in Ti-(45-x)Ni-5Cu-xMn (at%) (x = 0.5-2.0) Alloys

  • Jeon, Yeong-Min;Kim, Min-Gyun;Kim, Min-Su;Lee, Yong-Hee;Im, Yeon-Min;Nam, Tae-Hyun
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.1
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    • pp.24-27
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    • 2011
  • Effect of substitution of Mn for Ni on transformation behavior, shape memory characteristics and superelasticity of Ti45Ni-5Cu alloy has been investigated by means of electrical resistivity measurements, X-ray diffraction, thermal cycling tests under constant load and tensile tests. The one-stage B2-B19' transformation occurred when Mn content was 0.5 at%, above which the two-stage B2-B19-B19' transformation occurred. A temperature range where the B19 martensite exists was expanded with increasing Mn content because decreasing rate of Ms (60 K / % Mn) was larger than that of Ms' (40 K / % Mn). Ti-(45-x)Ni-5Cu-xMn alloys were deformed in plastic manner with a fracture strain of 60 % ~ 32 % depending on Mn content. Clear superelasticity was found in fully annealed Ti-(45-x)Ni-5Cu-xMn alloys with Mn content more than 1.0 at%, which was ascribe to a solid solution hardening by substitution of Mn for Ni.

Electrochemical Properties of Zr0.8Ti0.2Mn0.4V0.6Ni1-xFex Alloy Electrodes (Zr0.8Ti0.2Mn0.4V0.6Ni1-xFex 합금 전극의 전기화학적 특성)

  • Song, MyoungYoup;Kwon, IkHyun;Lee, DongSub
    • Journal of Hydrogen and New Energy
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    • v.13 no.3
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    • pp.181-189
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    • 2002
  • A series of multicomponent $Zr_{0.8}Ti_{0.2}Mn_{0.4}V_{0.6}Ni_{1-x}Fe_{x}$ (x=0.00, 0.08, 0.15, 0.22, and 0.30) alloys are prepared and their oystal structure and P-C-T curves are examined. The electrochemical properties of these allqys such as activation conditions, discharge capacity, cycling performance are also investigated. $Zr_{0.8}Ti_{0.2}Mn_{0.4}V_{0.6}Ni_{1-x}Fe_{x}$ (x=0.00, 0.08, 0.15, 0.22 and 0.30) have the C14 Laves phase hexagonal structure. The electrode was activated by the hot-charging treatment. The best activation conditions were the current density 120 mA/g and the hot-charging time 12h at $80^{\circ}C$ in the case of the alloy with x=0.00. The discharge capacity increased rapidly until the fourth cycle and then decreased. The discharge capacity increased again from the 13th cycle, arriving at 234 mAh/g at the 50th cycle. The discharge capacily just after activation decreases with the increase in the amount of the substituted Fe but the cycling performance is improved. The discharge capacity after activation of the alloy with x=0.00 is 157 mAh/g at the current density 120 mA/g. $Zr_{0.8}Ti_{0.2}Mn_{0.4}V_{0.6}Ni_{0.85}Fe_{0.15}$ is a good composition with a medium quantity of discharge capacities and a good cycling performance. The ICP analysis of the electrolyte for these electrodes after 50 charge-discharge cycles shows that the concentrations of V and Zr are relatively high. Another series of multicomponent $Zr_{0.8}Ti_{0.2}Mn_{0.4}V_{0.6}Ni_{0.85}M_{0.15}$ (M = Fe, Co, Cu, Mo and Al) alloys are prepared. They also have the C14 Laves phase hexagonal structure. The alloys with M = Co and Fe have relatively larger hydrogen storage capacities. The discharge capacities just after activation are relatively large in the case of the alloys with M = Al and Cu. They are 212 and 170 mAh/g, respectivety, at the current density 120mA/g. The $Zr_{0.8}Ti_{0.2}Mn_{0.4}V_{0.6}Ni_{0.85}Co_{0.15}$ alloy is the best one with a relatively large discharge capacity and a good cycling performance.

The Influence of Alloying Elements Addition on the Electrical and Mechanical Properties of Cu-Ni-Si-P Alloy (Cu-Ni-Si-P 합금의 기계적 및 전기적 성질에 미치는 첨가원소의 영향)

  • Kim, Seung-Ho;Yum, Young-Jin;Park, Dong-Hwan
    • Journal of the Korean Society for Heat Treatment
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    • v.27 no.1
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    • pp.1-9
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    • 2014
  • For connector material applications, the influence alloying elements of Mn, Cr, Fe, and Ti and cold rolling reduction on the mechanical property, electrical conductivity and bendiability of Cu-Ni-Si-P alloy was investigated. The hot rolled plates were solution treated at $980^{\circ}C$ for 1.5 h, quenched into water, cold rolled by 10% and 30% reduction in thickness, and then aged at $440{\sim}500^{\circ}C$ for 3, 4, 5 times. respectively. Cu-Ni-Si-P-x alloys cold rolled by 10 reduction before heat treatment have a good bendability compare to cold rolled by 30 reduction. Cu-3.4Ni-0.8Si-0.03P-0.1Ti shows the peak strength value of 759 MPa, an electrical conductivity of 39%IACS, an elongation of 10% and a hardness of 256 Hv aged at $440^{\circ}C$ for 6 hrs. Thus it is suitable for lead frame and connector.

High Strength Nanostructured Metastable Alloys

  • Eckert, Jurgen;Bartusch, Birgit;Schurack, Frank;He, Guo;Schultz, Ludwig
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.394-408
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    • 2002
  • Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

Brazing of Aluminium Nitride(AlN) to Copper with Ag-based Active Filler Metals (은(Ag)계 활성금속을 사용한 질화 알미늄(AlN)과 Cu의 브레이징)

  • Huh, D.;Kim, D.H.;Chun, B.S.
    • Journal of Welding and Joining
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    • v.13 no.3
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    • pp.134-146
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    • 1995
  • Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

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Thermal Stability of $\textrm{Fe}_{80-x}\textrm{P}_{10}\textrm{C}_{6}\textrm{B}_{4}\textrm{M}_{x}$(M=Transition Metal) Amorphous Alloys ($\textrm{Fe}_{80-x}\textrm{P}_{10}\textrm{C}_{6}\textrm{B}_{4}\textrm{M}_{x}$(M=Transition Metal) 비정질합금의 열적안정성)

  • Guk, Jin-Seon;Jeon, U-Yong;Jin, Yeong-Cheol;Kim, Sang-Hyeop
    • Korean Journal of Materials Research
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    • v.7 no.3
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    • pp.218-223
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    • 1997
  • At the aim of finding a Fehased amorphous alloy with a wide supercooled liquid region (${\Delta}T_{x}=T_{x}-T_{g}$) before crystallization, the changes in glass transition temperatudfI$T_{g}$ and crystallization temperature ($T_{x}$) by the dissolution of additional M elements were examined for the $Fe_{80}P_{10}C_{6}B_{4}$(x~6at%. M= transition metals) amorphous alloys. The ${\Delta}T_{x}$ value is 27K for the Fe,,,P,,,C,,R, alloy and increases to 40K for the addition of M=4at%Hf, 4at%Ta or 4at%Mo. The increase in ${\Delta}T_{x}$ is due to the increase of $T_{x}$ exceeding the degree in the increase in $T_{g}$. The $T_{g}$ and $T_{x}$ increase with decreasing electron concentration (e/a) from about 7 38 to 7.05. The decrease of e/a also implies the increase in the attractive bonding state between the M elements and other constitutent elements. It is therefore said that $T_{g}$ and $T_{x}$ increase kith increasing attractive bonding force.

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