• Title/Summary/Keyword: Thin-wall Molding

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Improvement of Moldability for Ultra Thin-Wall Molding with Micro-Patterns (마이크로 패턴을 가진 초박육 사출성형의 성형성 개선)

  • Yun, Jae-Ho;Park, Keun;Kwon, Oh-Kyung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.5
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    • pp.556-561
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    • 2007
  • The rapid thermal response(RTR) molding is a novel process developed to raise the temperature of mold surface rapidly in the injection stage and then cool rapidly to the ejection temperature by air or water. The objectives of this paper are to investigate the effect of mold temperature, pressure and thickness of micro pattern molding and to provide a optimization of RTR injection molding for micro pattern from Moldflow simulation. Optimal minimum temperature and pressure was found without shortcut according to thickness. Filling percentage was influenced by glass transition temperature with the kinds of resin. Optimal temperature is slightly higher than glass transition temperature irrespectively of pressure, thickness, the kinds of resin in the micro pattern molding.

Development of Film Fixing System for Improving Overlap Defects in the Film Insert Injection Molding Process (필름 인서트 사출성형 공정의 오버랩 불량 개선을 위한 필름 고정 시스템 개발)

  • Kim, Jung-Ho;Mun, Ji-Hun;Park, Hong-Seok
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.3
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    • pp.472-479
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    • 2013
  • We carried out research into an environmentally friendly injection molding process that involves filling the mold with polymer after thin films are fixed into the cavity, without the coating, plating process. Film insert injection molding is a new technique in which molten plastic resin is injected into the cavity after films are precisely attached to the side of the mold wall. In the film insert injection molding process, the insert film is moved by the flow of the molten plastic resin. Overlap defects cause a decline in the productivity and the quality of the manufactured goods. To reduce overlap defects, new injection mold parts are proposed to produce automotive exterior parts using thin films. It is suggested that the best possible method would be to fix the thin films to one side of the mold wall, and develop interior pins to fix the films in the mold. Based on this new pin fixing system, the problem of the film being moved by the flow of the molten resin was improved.

Cycle Time Reduction with Automated Gate Cutting Mechanism and Injection/Compression Molding for Producing Mobile LGP (모바일용 도광판의 게이트 자동절삭 및 사출/압축 성형법을 적용한 사이클 타임 저감에 관한 연구)

  • Min, I.K.;Kim, J.S.;Yoon, K.H.
    • Transactions of Materials Processing
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    • v.21 no.2
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    • pp.96-100
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    • 2012
  • Conventional injection molding system for producing extremely thin-wall parts such as Light Guide Plates(LGP's) for mobile displays is at the limit of its capability due to its tendency to develop frozen layers and the critical speed of injection. The molten polymer in the cavity freezes quickly as its heat is rapidly transferred to the mold base. Many attempts have been tried in the past to overcome this problem. The present study used the injection/compression molding technology to produce a thin-wall part, with enhanced features such as an automated mechanism for cutting gates. As a result, the total cycle time was reduced by almost 35 seconds, resulting in a productivity increase by 30%.

Molding Stability of Hydro-Mechanical High Speed Injection Molding for Thin-Wall(0.3mm) LGP (박판(0.3mm) 도광판 성형을 위한 유압식 고속사출성형의 성형 안정성 연구)

  • Hwang, C.J.;Kim, J.S.;Oh, J.G.;Jeong, C.;An, H.J.;Heo, Y.M.;Kim, J.D.;Yoon, K.H.
    • Transactions of Materials Processing
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    • v.17 no.8
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    • pp.657-661
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    • 2008
  • Recently, products of electronic industry and related parts are required to have the thickness thinner and thinner to reduce the part weight. To go with this trend, LGP(light guide plate) of LCD-BLU(Liquid Crystal Display-Back Light Unit: It is one of kernel parts of LCD) for cell phone has the thickness of ${\sim}0.3mm$ and the battery case of cell phone has ${\sim}0.25mm$. Accordingly, high speed injection molding is required to mold products which have thinner parts. To achieve high speed injection and proper control of hydraulic unit, various design was applied to conventional injection unit. In the present paper, we concentrated on the molding stability of hydro-mechanical high speed injection machine to make an LGP of 0.3mm thickness.

A study on the injection molding technology for thin wall plastic part (초정밀 박육 플라스틱 제품 성형기술에 관한 연구)

  • Heo, Young-Moo;Shin, Kwang-Ho
    • Design & Manufacturing
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    • v.10 no.2
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    • pp.50-54
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    • 2016
  • In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

Measurement of Viscosity and Numerical Analysis of High Speed Injection Molding for Thin-Walled LGP (박형 도광판의 고속사출성형을 위한 수지 점도 측정 및 수치해석)

  • Jung, T.S.;Kim, J.S.;Ha, S.J.;Cho, M.W.
    • Transactions of Materials Processing
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    • v.23 no.1
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    • pp.41-48
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    • 2014
  • The light guide plate has become the major component for the backlight module in general information technology products (e.g. mobile phones, monitors, etc.). High speed injection molding has been adopted for thin walled LGP giving advantages such as weight, shape, size, and reduction in production costs. In the current study, the rheological characteristics of high liquidity plastic resin PC(HL8000) were measured using a capillary rheometer to improve the reliability of the numerical analysis for high speed injection molding. With the measured viscosity and PVT of PC(HL8000), numerical analysis of injection molding was conducted using the simulation software(Moldflow). Filling time and deflection were predicted and compared with those of traditional PC resins(H3000, H4000). The results show that PC(HL8000) has significantly different rheological characteristics during high speed injection molding. Hence proper properties of the resin should be used to improve the accuracy of numerical predictions.

Data Acquisition of Thin-wall Injection Molding Cavity with Micro Pattern (미세 패턴을 가진 박판 사출 성형에서의 금형내 압력 온도 측정 및 분석)

  • Hwang E.J.;Yoo Y.E.;Jae T.J.;Choi D.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1601-1604
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    • 2005
  • The demand increasing of optical applications like as display devices derives interest for fabrication process. The product s development is apt to fabricate numerous thin and wide surfaces with micro pattern. Naturally that needs injection molding fabrication for the mass production. In existing manufacturing, the product quality is controlled by input fabrication condition from the outside. That can be called as a try and error method and not fundamentally solve the troubles; imperfect replication, war page, short shot, etc. To understand the cause and bring a solution, it is needed that check of changing in the cavity. This study can catch them. Data acquisition system about temperature and pressure distribution is settled and can get some data. From this research, other studies related with DAQ in cavity can start on the easier step.

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Injection Molding Technology for Thin Wall Plastic Part - II. Side Gate Removal Technology Using Cold Press Cutting Process (초정밀 박육 플라스틱 제품 성형기술- II. 냉간 절단 공정 활용 사이드 게이트 제거기술)

  • Heo, Young-Moo;Shin, Kwang-Ho;Choi, Bok-Seok;Kwon, Oh-Keun
    • Design & Manufacturing
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    • v.10 no.3
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    • pp.1-7
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    • 2016
  • In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. After injection molding process the side gates were needed to remove for further assembly process. ln this study, the cold press cutting process was applied to remove the gates. For design of punch and die, the cold press cutting analysis was implemented by$DEFORM-2D^{TM}$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.

A Study on Rapid Mold Heating System using High-Frequency Induction Heating (고주파 유도가열을 사용한 급속 금형가열에 관한 연구)

  • Jeong, Hui-Tack;Yun, Jae-Ho;Park, Keun;Kwon, Oh-Kyung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.5
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    • pp.594-600
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    • 2007
  • Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat a conductive workpiece by means of high-frequency electric current caused by electromagnetic induction. Because the induction heating is a convenient and efficient way of indirect heating, it has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers an experimental investigation on the rapid heating using the induction heating and rapid cooling using a vortex tube in order to eliminate an excessive cycle time increase. Experiments are performed in the case of a steel cup mold core with various heating and cooling conditions. Temperature is measured during heating and cooling time, from which appropriate mold heating and cooling conditions can be obtained.