• Textile Coloration and Finishing
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• v.18 no.4
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• pp.11-19
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• 2006

Black-dyed PET fabrics were sputtered with stainless steel through DC-magnetron type device to investigate the possibility of coloration effect, and then considered the morphological structure and physical characteristics such as water permeation ability and washing fastness. Change in color was estimated on the basis of CIELAB color system. The color coordination of metal plated PET was shifted to yellow-red from red-blue. Colour difference$({\Delta}E^*)$ was increased by sputtering conditions with increasing ion current and treatment time. Especially, $Lightness(L^*)$ value of PET was remarkably increased by sputtering, whereas $Chroma(C^*)$ increased gradually. From SEM analysis, rough and uneven craters were found and thickened on the fiber surfaces with longer sputtering time. And washing fastness was a little poor and absorption ability slightly decreased. There were little changes of breaking load and breaking extension. It was evident that observed uneven craters in the plated thin layer resulted in the colour change of PET fabrics by sputtering treatments.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.2-25.2
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• 2011

Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.1
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• pp.135-147
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• 2000

Section design of vehicle structure has been developed by two methods. One is the section property method which uses section property as a design variable. This method shows the tendency of an optimum section approximately. The other method is the section shape method which utilizes geometric parameter of section as a design variable. Practical solutions are obtained by this method. However, it is very expensive for large-scale problems due to the large number of geometric parameters. These two methods are compared through several sample problems. The finite element method is used for the structural and sensitivity analyses. The results are analyzed based on the number of function evaluations, the quality of cost function, the complexity of programing, and etc. The applications of both methods are also discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.100-103
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• 2001

In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

• Textile Coloration and Finishing
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• v.31 no.2
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• pp.65-76
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• 2019

A multi-point touch input sensor having different sizes or different capacitance touch points connected by only one pair of signal transmission lines was fabricated using a polyimide film coated with a thin copper plate. The capacitance increases with the decrease in the number of sheets of fabric spacers placed between the two sheets of the polyimide film. Therefore, the touch input sensor could be manufactured without fabric spacers, which was possible by the action of the polyimide film as a dielectric material in the capacitor. On the multi-point touch sensor, higher capacitance was obtained when pressing wider-area touch points with 10mm to 25mm diameter on average. However, the capacitance of a system comprising two sheets of touch sensors was considerably low, causing a serious overlap of the capacitance values according to the data collected from the reliability test. Although the capacitance values could be increased by stacking several sheets of touch sensors, the overlap of data was still observed. After reducing the size of all touch points to 10mm and stacking up to eight sheets of sensors, reliable and consistent capacitance data was obtained. Five different capacitance signals could be induced in the sensors by pushing touch points simultaneously.

• Korean Journal of Materials Research
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• v.21 no.6
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• pp.309-313
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• 2011

The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.31-37
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• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• Journal of Korean Society of Steel Construction
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• v.9 no.2 s.31
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• pp.193-204
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• 1997

In order to quantify the relationships of the important physical factors relating failure to strong earthquake loading, the plastic fatigue problems for structural components under repeated loading were reviewed first. A new concept of very low cycle fatigue failure for structural components under severe cyclic excitations as in strong earthquakes was represented. Also, an experimental study was made of the very low cycle fatigue failure of structural steel elements. It was attempted to realize the ultimate failure in the course of loading repetitions of the order of several to twenty. The test specimen had a form of rectangular plate, representing a thin-plated element in a steel member as wide-flange cross section. It was subjected to uniaxial loading repeatedly, until complete failure takes place after undergoing inelastic buckling, plastic elongation and/or their combination. It was seen as a result that the state of the ultimate failure is closely related to the maximum strain at the extreme fiber in the cross section.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.18-24
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• 2006

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.