• 제목/요약/키워드: Thin-plated Structure

검색결과 11건 처리시간 0.026초

Sputter 착색에 의한 Black-dyed PET 직물의 색상 및 물성변화 (Colour Change of Black-dyed PET Fabrics by Sputter Coloration and Their Physical Properties)

  • 구강;원은희;박영미
    • 한국염색가공학회지
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    • 제18권4호
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    • pp.11-19
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    • 2006
  • Black-dyed PET fabrics were sputtered with stainless steel through DC-magnetron type device to investigate the possibility of coloration effect, and then considered the morphological structure and physical characteristics such as water permeation ability and washing fastness. Change in color was estimated on the basis of CIELAB color system. The color coordination of metal plated PET was shifted to yellow-red from red-blue. Colour difference$({\Delta}E^*)$ was increased by sputtering conditions with increasing ion current and treatment time. Especially, $Lightness(L^*)$ value of PET was remarkably increased by sputtering, whereas $Chroma(C^*)$ increased gradually. From SEM analysis, rough and uneven craters were found and thickened on the fiber surfaces with longer sputtering time. And washing fastness was a little poor and absorption ability slightly decreased. There were little changes of breaking load and breaking extension. It was evident that observed uneven craters in the plated thin layer resulted in the colour change of PET fabrics by sputtering treatments.

Improvement of Electrical Properties by Controlling Nickel Plating Temperatures for All Solid Alumina Capacitors

  • Jeong, Myung-Sun;Ju, Byeong-Kwon;Oh, Young-Jei;Lee, Jeon-Kook
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.25.2-25.2
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    • 2011
  • Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

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차체단면설계를 위한 단면계수법 및 단면형상법의 성능비교에 관한 연구 (A Study on the Comparison of Performances between Section Property Method and Section Shape Method for the Section Design of Vehicle Structure)

  • 서명원;이정환
    • 한국자동차공학회논문집
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    • 제8권1호
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    • pp.135-147
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    • 2000
  • Section design of vehicle structure has been developed by two methods. One is the section property method which uses section property as a design variable. This method shows the tendency of an optimum section approximately. The other method is the section shape method which utilizes geometric parameter of section as a design variable. Practical solutions are obtained by this method. However, it is very expensive for large-scale problems due to the large number of geometric parameters. These two methods are compared through several sample problems. The finite element method is used for the structural and sensitivity analyses. The results are analyzed based on the number of function evaluations, the quality of cost function, the complexity of programing, and etc. The applications of both methods are also discussed.

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무전해도금 구리배선재료의 열적 및 접착 특성 (Thermal and Adhesive Properties of Cu Interconnect Deposited by Electroless Plating)

  • 김정식;허은광
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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    • pp.100-103
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    • 2001
  • 본 연구에서는 무전해도금으로 증착된 구리박막의 열적 및 접착특성에 관하여 고찰하였다. Si 기판에 MOCVD 방법으로 TaN 확산방지막을 증착한 후, 무전해 도금으로 구리박막을 증착하여 Cu/TaN/Si 다층구조를 제조공정하였다. 그리고, Ar 분위기에서 열처리시켰으며, 열처리온도에 따른 비저항 변화를 고찰함으로서 Cu/TaN/Si 계의 열적 특성을 분석하였다. 무전해도금 구리박막의 접착특성은 스크래치 테스트에 의해 평가하였으며, 열적 증착방법과 스퍼터 방법으로 증착된 구리 박막과 비교하였다. 스크래치 테스트 결과, 무전해도금 구리 박막의 접착력이 열적 증착과 스퍼터 방법으로 증착된 구리 박막보다 더 우수하였다.

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Multi-point Flexible Touch Sensor Based on Capacitor Structure Using Thin Copper-Plated Polyimide Film for Textile Applications

  • Lee, Junheon;Kim, Taekyeong
    • 한국염색가공학회지
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    • 제31권2호
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    • pp.65-76
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    • 2019
  • A multi-point touch input sensor having different sizes or different capacitance touch points connected by only one pair of signal transmission lines was fabricated using a polyimide film coated with a thin copper plate. The capacitance increases with the decrease in the number of sheets of fabric spacers placed between the two sheets of the polyimide film. Therefore, the touch input sensor could be manufactured without fabric spacers, which was possible by the action of the polyimide film as a dielectric material in the capacitor. On the multi-point touch sensor, higher capacitance was obtained when pressing wider-area touch points with 10mm to 25mm diameter on average. However, the capacitance of a system comprising two sheets of touch sensors was considerably low, causing a serious overlap of the capacitance values according to the data collected from the reliability test. Although the capacitance values could be increased by stacking several sheets of touch sensors, the overlap of data was still observed. After reducing the size of all touch points to 10mm and stacking up to eight sheets of sensors, reliable and consistent capacitance data was obtained. Five different capacitance signals could be induced in the sensors by pushing touch points simultaneously.

금속 전극 알루미나 박막 캐패시터의 전기적 특성에 미치는 미세구조의 영향 (Effect of Microstructure on Electrical Properties of Thin Film Alumina Capacitor with Metal Electrode)

  • 정명선;주병권;오영제;이전국
    • 한국재료학회지
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    • 제21권6호
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    • pp.309-313
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    • 2011
  • The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

집적회로용 무전해도금 Cu배선재료의 열적 특성에 관한 연구 (Study on the Thermal Properties of the Electroless Copper Interconnect in Integrated Circuits)

  • 김정식;이은주
    • 마이크로전자및패키징학회지
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    • 제6권1호
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    • pp.31-37
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    • 1999
  • 본 연구에서는 집적회로의 배선공정에 적용될 무전해도금된 Cu박막의 열적 특성과 접착특성에 대하여 고찰하였다. 시편은 Si 기판에 MOCVD법으로 TaN 확산방지막을 증착시킨 후 그 위에 무전해도금법으로 Cu 막을 증착시켜 Cu/TaN/Si 구조의 다층박막을 제조하였다. 이렇게 제조된 Cu/TaN/Si 시편을 수소와 Ar 분위기에서 각각 열처리시킨 후 열처리온도에 따른 비저항을 측정함으로써 Cu박막의 열적 안정성을 분석하였다. Cu박막과 TaN확산방지막과의 접착특성을 분석하기 위하여 scratch test를 사용하였으며, TaN 확산방지막에 대한 무전해도금된 Cu배선막의 접착력은 일반적인 Thermal evaporation과 Sputturing 방법으로 증착된 Cu 박막의 경우와 비교함으로써 평가되었다. TaN 박막에 대한 Cu박막의 접착성을 평가하기 위해 scratch test를 행한 결과 무전해도금된 Cu박막의 경우 다른 방법으로 증착된 Cu 박막과 비슷한 접착특성을 나타내었으며, acoustic emission분석과 microscope 관찰 결과 sputtering이나 evaporation 방법으로 증착된 Cu박막 보다 무전해도금된 Cu박막이 상대 적으로 우수한 접착력을 나타내었다.

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반복하중을 받는 강구조 요소의 소성피로에 관한 연구 (A Study on Plastic Fatigue of Structural Steel Elements under Cyclic Loading)

  • 박연수;박선준;강성후;윤영필
    • 한국강구조학회 논문집
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    • 제9권2호통권31호
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    • pp.193-204
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    • 1997
  • 본 연구에서는 먼저 강한 지진하중에 의해 발생되는 구조물의 파괴와 관련되어 있는 중요한 물리적 인자들의 상호관계를 정량화하기 위하여 반복하중을 받는 구조성분들에 대한 소성피로 문제에 대해서 검토하였으며, 강한 지진과 같은 극심한 반복하중하에서 구조성분들에 대한 극저사이클 피로파괴의 새로운 개념이 도입되었다. 또한 강구조물 요소에 대한 극저사이클 피로파괴 실험을 실시하였다. 실험은 수회에서 20회사이의 반복하중재하 과정에서 궁극적인 파괴를 실현하기 위하여 시도 되었다. 시험체는 H형강의 플랜지 단면처럼 강부재내의 않은 평판요소를 의미하는 직사각형 평판을 사용하였다. 이 시험체에는 비탄성좌굴, 소성신장 또는 이들 2가지의 조합이 발생한 후 부재가 완전히 파괴에 이를때까지 축방향 반복하중을 가하였다. 그 결과 극저사이클 피로하중에 의한 극한파괴상태는 구조요소단면 최외단에서의 최대변형율과 밀접하게 관련되어 있슴을 알 수 있었다.

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Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성 (Brazing Adhesion Properties of Ag Coated W-Ag Electric Contact on the Cu Substrate)

  • 강현구;강윤성;이재성
    • 한국분말재료학회지
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    • 제13권1호
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    • pp.18-24
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    • 2006
  • The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

무연솔더 도금된 리드프레임에서 Sn 위스커의 성장과 구조 (Structure and Growth of Tin Whisker on Leadframe with Lead-free Solder Finish)

  • 김경섭;임영민;유정희
    • 마이크로전자및패키징학회지
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    • 제11권3호
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    • pp.1-7
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    • 2004
  • 주석 도금은 특정 환경하에서 위스커를 발생시키며, 이는 전자부품의 불량을 초래한다. 최근 세계곳곳에서는 환경보호를 위해 "무연"의 사용을 권고하고 있다. 본 논문에서는 두 종류 무연 도금 재료에서 도금 온도와 신뢰성시험 하에서 성장하는 위스커를 평가하였다. 도금 온도가 높아질수록 표면에 형성되는 도금 입자의 크기는 커지고, 위스커의 성장은 작아진다. 또한 온도 순환시험에서 성장한 위스커는 무광택 Sn 도금은 굽은 모양을, 무광택 Sn-Bi에서는 줄무의 모양이 관찰되었고, Sn 도금에 비해 Sn-Bi에서 위스커가 작게 성장하였다. 무광택 Sn 도금된 FeNi42 리드프레임은 TC 300 사이클에서 직경이 $7.0{\~}10.0{\mu}m$이고, 길이가 $25.0{\~}45.0{\mu}m$인 위스커가 성장하였다. 또한 Cu는 300 사이클에서는 표면에 노듈(핵 상태)만이 관찰되었고, 600 사이클에서 길이가 $3.0{\~}4.0{\mu}m$의 위스커로 성장하였다. TC 600 사이클 후 FeNi42는 계면에서 ${\~}0.34{\mu}m$의 얇은 $Ni_3Sn_4$가, Cu에서는 두께가 $0.76{\~}l.14{\mu}m$$Cu_6Sn_5$${\~}0.27{\mu}m$$Cu_3Sn$ 화합물들이 두껍게 성장하였다. 따라서 FeNi42 리드프레임은 열팽창계수의 차이, Cu에서는 금속간 화합물의 형성이 위스커의 성장에 영향을 미치는 주요 인자이다.

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