• 지능정보연구
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• 제28권4호
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• pp.135-155
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• 2022

본 연구는 Organic Light-Emitting Diodes(OLEDs) 산업의 하위기술 분야를 도출하여 특허 동향을 분석하고 각 하위기술 분야별 기술 가치, 독창성, 다양성을 분석한다. 특허 자료 수집을 위해 OLED 기술과 관련된 국제 특허 분류(International Patent Classification) 집합을 정의하고, 이를 활용해 2005년부터 2017년까지 출원된 OLED 연관 특허를 수집하였다. 이어서 토픽모델을 이용하여 대량의 특허 문서를 12가지 주요 기술로 구분하고 각 기술에 대한 동향을 조사하였다. 그중 터치 센서, 모듈, 이미지 처리, 회로 구동 관련 특허는 증가 추세를 보였으나 가상 현실, 사용자 인터페이스 관련 특허는 최근 감소하였고, 박막 트랜지스터, 지문 인식, 광학필름 관련 특허는 지속적인 추세를 보였다. 이후 각 기술 그룹에 포함된 특허의 전방 인용 수, 독창성, 다양성을 조사하여 기술적 가치를 비교하였다. 결과로부터 전방 인용 수, 독창성, 다양성이 높은 이미지 처리기술, UI/UX, 모듈 기술, 점착 기술 분야가 상대적으로 높은 기술적 가치를 보여주었다. 본 연구를 통해 기업의 기술 전략 수립과정에서 활용 가치가 높은 정보를 제공한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.287.1-287.1
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• 2016

Three-dimensional (3-D) semiconductor nanoarchitectures, including nano- and micro- rods, pyramids, and disks, are emerging as one of the most promising elements for future optoelectronic devices. Since these 3-D semiconductor nanoarchitectures have many interesting unconventional properties, including the use of large light-emitting surface area and semipolar/nonpolar nano- or micro-facets, numerous studies reported on novel device applications of these 3-D nanoarchitectures. In particular, 3-D nanoarchitecture devices can have noticeably different current spreading characteristics compared with conventional thin film devices, due to their elaborate 3-D geometry. Utilizing this feature in a highly controlled manner, color-tunable light-emitting diodes (LEDs) were demonstrated by controlling the spatial distribution of current density over the multifaceted GaN LEDs. Meanwhile, for the fabrication of high brightness, single color emitting LEDs or laser diodes, uniform and high density of electrical current must be injected into the entire active layers of the nanoarchitecture devices. Here, we report on a new device structure to inject uniform and high density of electrical current through the 3-D semiconductor nanoarchitecture LEDs using metal core inside microtube LEDs. In this work, we report the fabrications and characteristics of metal-cored coaxial $GaN/In_xGa_{1-x}N$ microtube LEDs. For the fabrication of metal-cored microtube LEDs, $GaN/In_xGa_{1-x}N/ZnO$ coaxial microtube LED arrays grown on an n-GaN/c-Al2O3 substrate were lifted-off from the substrate by wet chemical etching of sacrificial ZnO microtubes and $SiO_2$ layer. The chemically lifted-off layer of LEDs were then stamped upside down on another supporting substrates. Subsequently, Ti/Au and indium tin oxide were deposited on the inner shells of microtubes, forming n-type electrodes of the metal-cored LEDs. The device characteristics were investigated measuring electroluminescence and current-voltage characteristic curves and analyzed by computational modeling of current spreading characteristics.

• 한국전자파학회논문지
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• 제19권6호
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• pp.621-629
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• 2008

본 논문에서는 위성 탑재 부품의 중요한 요구 특성 중의 하나인 부품의 소형화를 위해 LTCC를 이용하여 Ka-대역 OBS 위성 중계기용 주파수 상향 변환기를 개발하였다. 주파수 상향 변환기 내에 적층으로 S-대역 저역통과 여파기와 K-대역 대역 통과 여파기를 배치 하였으며, 주파수 상향 변환 MMIC 혼합기를 조립 하였다. S-대역 저역 통과 여파기 설계에서는 수정된 엘립틱(Elliptic) 저역 통과 여파기 구조를 이용하여 임의의 주파수에 폴을 형성함으로써 임의의 스퓨리어스 신호를 선택적으로 제거할 수 있는 방법을 제시하였다. K-대역 대역 통과 여파기의 경우, 층간 커플링을 이용한 구조를 채택하였다. 주파수 상향 변환 혼합기에는 MMIC 이중 평형 다이오드 혼합기를 사용하였다. 제작된 LTCC 주파수 상향 변환기의 삽입 손실은 9 dB, 격리도는 51 dBc이며, 크기는 $8{\times}7{\times}0.6mm^3$로 기 개발된 Ka-대역 OBS 위성 중계기용 주파수 상향 변환기에 비해 1/3 크기의 소형화를 이룰 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.537-539
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• 2006

We developed an 4.5" $192{\times}64$ active matrix organic light-emitting diode display on a glass using organic thin-film transistor (OTFT) switching-arrays with two transistors and a capacitor in each sub-pixel. The OTFTs has bottom contact structure with a unique gate insulator and pentacene for the active layer. The width and length of the switching OTFT is $800{\mu}m$ and $10{\mu}m$ respectively and the driving OTFT has $1200{\mu}m$ channel width with the same channel length. On/off ratio, mobility, on-current of switching OTFT and on-current of driving OTFT were $10^6,0.3{\sim}0.5\;cm^2/V{\cdot}sec$, order of 10 ${\mu}A$ and over 100 ${\mu}A$, respectively. AMOLEDs composed of the OTFT switching arrays and OLEDs made using vacuum deposition method were fabricated and driven to make moving images, successfully.

• 대한전자공학회논문지SD
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• 제45권5호
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• pp.12-18
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• 2008

본 연구는 PC(polycarbonate) 기판 위에 소스(source)/드레인(drain) 전극으로 Ag 페이스트를 스크린 인쇄하여 OTFT(organic thin film transistor)를 제작하였다. 또한 이렇게 제작된 OTFT를 적용하여 OTFT-OLED(organic light emitting diode) 어레이를 제작하였으며 OTFT의 소스 및 드레인 전극과 더불어 데이터 배선전극을 Ag 페이스트를 이용하여 형성하였다. Ag 페이스트는 스크린 마스크의 mesh에 따라 325 mesh용과 500 mesh용을 사용하였으며, 325 mesh용 페이스트는 선폭 60 ${\mu}m$, 500 mesh용 페이스트는 선폭 40 ${\mu}m$까지 인쇄가 가능하였다. 그리고 면저항은 각각 $60m{\Omega}/\square,\;133.1m{\Omega}/\square$이었다. 제작된 OTFT의 성능은 이동도가 자각 0.35 $cm^2/V{\cdot}sec$와 0.12 $cm^2/V{\cdot}sec$, 문턱전압 -4.7 V와 0.9 V이었으며, 전류 점멸비는 ${\sim}10^5$이었다. OTFT-OLED 어레이는 인쇄성이 우수한 500 mesh용 Ag 페이스트를 사용하였으며 OTFT의 채널길이를 50 ${\mu}m$로 설계하여 제작하였다. OTFT-OLED 어레이의 화소는 2개의 OTFT, 1개의 캐패시터 그리고 1개의 OLED로 구성하였고, 크기는 $2mm{\times}2mm$이며, 해상도는 $16{\times}16$ 이다. 제작된 어레이는 일부 불량 화소를 포함하고 있지만 능동형 모드로 동작함을 확인할 수 있었다.

• 센서학회지
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• 제7권3호
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• pp.171-178
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• 1998

SDB 웨이퍼를 이용하여 실리콘 압저항형 절대압센서를 제조하고 이를 가스누출 감지시스템에 응용하였다. 이 경우 센서는 $0{\sim}600\;mmH_{2}O$, $0{\sim}100^{\circ}C$의 압력, 온도범위에서 정상적으로 동작하여야 하고 다이아프램이 파괴되었을 때 가스가 소자 외부로 누출되어서는 안된다. 따라서 다이아프램 내의 공극을 유리(Pyrex7740)와 진공중($10^{-4}$ torr)에서 양극 접합을 행하였다. 제조된 센서는 압력에 대하여 우수한 선형특성을 보였고, 압력감도는 대기압이상 $0{\sim}600\;mmH_{2}O$의 압력범위에서 $4.06{\mu}V/VmmH_{2}O$ 이었다. 온도보상 일체화 조건을 조사하기 위해 Al 박막저항을 제조하여 온도보상을 행하였는데 오프셋의 온도 drift는 80 %이상, 감도의 온도의존성은 95 %이상 보강 효과를 얻었다. 또한 다이오드(PXIN4001)를 이용한 온도보상시 오프셋의 온도 drift는 98 %이상, 감도의 온도의존성은 90%이상 보상 효과를 나타내었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.99-99
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• 2013

In this talk, I will present two research works in progress, which are: i) mapping of piezoelectric polarization and associated charge density distribution in the heteroepitaxial InGaN/GaN multi-quantum well (MQW) structure of a light emitting diode (LED) by using inline electron holography and ii) in-situ observation of the polarization switching process of an ferroelectric Pb(Zr1-x,Tix)O3 (PZT) thin film capacitor under an applied electric field in transmission electron microscope (TEM). In the first part, I will show that strain as well as total charge density distributions can be mapped quantitatively across all the functional layers constituting a LED, including n-type GaN, InGaN/GaN MQWs, and p-type GaN with sub-nm spatial resolution (~0.8 nm) by using inline electron holography. The experimentally obtained strain maps were verified by comparison with finite element method simulations and confirmed that not only InGaN QWs (2.5 nm in thickness) but also GaN QBs (10 nm in thickness) in the MQW structure are strained complementary to accommodate the lattice misfit strain. Because of this complementary strain of GaN QBs, the strain gradient and also (piezoelectric) polarization gradient across the MQW changes more steeply than expected, resulting in more polarization charge density at the MQW interfaces than the typically expected value from the spontaneous polarization mismatch alone. By quantitative and comparative analysis of the total charge density map with the polarization charge map, we can clarify what extent of the polarization charges are compensated by the electrons supplied from the n-doped GaN QBs. Comparison with the simulated energy band diagrams with various screening parameters show that only 60% of the net polarization charges are compensated by the electrons from the GaN QBs, which results in the internal field of ~2.0 MV cm-1 across each pair of GaN/InGaN of the MQW structure. In the second part of my talk, I will present in-situ observations of the polarization switching process of a planar Ni/PZT/SrRuO3 capacitor using TEM. We observed the preferential, but asymmetric, nucleation and forward growth of switched c-domains at the PZT/electrode interfaces arising from the built-in electric field beneath each interface. The subsequent sideways growth was inhibited by the depolarization field due to the imperfect charge compensation at the counter electrode and preexisting a-domain walls, leading to asymmetric switching. It was found that the preexisting a-domains split into fine a- and c-domains constituting a $90^{\circ}$ stripe domain pattern during the $180^{\circ}$ polarization switching process, revealing that these domains also actively participated in the out-of-plane polarization switching. The real-time observations uncovered the origin of the switching asymmetry and further clarified the importance of charged domain walls and the interfaces with electrodes in the ferroelectric switching processes.