• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.214-221
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• 2003

Tension mask assembly is positioned right behind the glass-made front panels of CRT type display devices. The frame-supported thin metal sheet contains numerous slits, through which electron beams are focused to enhance definition. Pretension is imposed on the masks, especially for enlarged flat screens, in order to avoid vibration due to acoustic or mechanical impact. High temperature assembly process subsequent to pretensioning, however, degenerates the creep resistance of common mask materials, and if tensile stress is high enough, tension on the mask may be loosened substantially due to creep deformation. In this study, the assembly is modeled as a combined structure of beams and wire array, and a numerical simulation is attempted for pretensioning followed by high temperature process. According to a model study, small amount of creep strain is likely to be generated, but its adverse influence is not negligible. Some structural modification measures to reduce the creep-induced tension loosening are proposed and evaluated. Also, optimal configuration of frame structure is sought for, which maintains high tension of masks and minimizes the possible creep of frame simultaneously.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.471-476
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• 2001

Milli-structure components ate classified as a component group whose size is between macro and micro scales, that is, about less than 20mm and larger than 1mm. The forming of these components has a typical phenomenon of bulk deformation with thin sheets because of the forming size. In this study, milli-structure rectangular cup drawing is analyzed and measured using the finite element method and experiment. Generally, milli-structure containers or cases like cellular phone vibrator consist of rectangular-shaped drawing to save installation space. A systematic approach is established for the design and the experiment of the forming processes for rectangular milli-structure cases. To verify the simulation results, the experimental investigations were also carried out on a real industrial product. The numerical analysis by FEM shows good agreement with the experimental results in view of the deformation shape of the product.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.296-299
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• 2002

The precision blanking of thin sheet metal is important process on production of precision electronic machine parts such as IC leadframe. In the blanking process, the factors that friction coefficient, tool clearance, material properties are the most important factors in the precision blanking process, because these factors affect the sheared face of product, side forces to punch during blanking process and surface condition after blanking process. So, many investigations have been performed. But, the former studies did not take up the characteristic of material. In this paper, in order to investigate the characteristic of blank, such as K(strength coefficient) and n(strain hardening coefficient), on the sheared face of blank and the side force to punch, FE-simulation has been analyzed by means of DEFORM-2D. To obtain input Parameters on FE-simulation, tensile and friction test has been done.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.299-300
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• 2005

Surface friction welding (SFW) is a newly developed technology fur joining thin metal sheets, which utilizes friction between tool and weldment. In the present study, the 5052 and 1050 Al sheets were locally surface-modified using SFW technology. Formability of the locally surface-modified sheets was superior to that of the parent material. Yield or tensile strengths of the locally surface-modified specimens were lower then those of the parent material, but elongations of the locally surface-modified specimens were higher then that of the parent material.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.700-705
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• 2004

Shell finite elements are widely used for the analysis of thin section objects such as sheet metal parts, automobile bodies and et al. due to their computational efficiency. Since many of input data for finite element analysis are given as solid models or triangulated surface models, one should extract midsurface information from these input data initially and then construct shell meshes on the extracted midsurfaces. In this paper, a method of generating shell elements on midsurfaces directly from input models have been proposed. In order to construct shell meshes, the input models should be triangulated on surfaces first, and then tetrahedral elements are generated by using an advancing front method, and finally mid shell surfaces are obtained from tetrahedral meshes. Some examples are given to demonstrate the efficiency of the proposed method.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.35-41
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• 2003

The multihole blanking of thin sheet metal using progressive die set is an important process on production of precision electronic machine parts such as IC leadframe. In this paper, in order to investigate the influence of blanking order on the final lead profile and deformed configuration, simulation technique for progressive blanking process is proposed and analyzed by LS-DYNA. The results of FE-simulations are in good agreement with the experimental results. Consequently, from the results of FE-analysis based on the procedure proposed in this paper, it is possible to predict the deformation of lead and to manufacture high precision leadframes in progressive blanking process and these results might be used as a guideline to develop layout design system in multihole blanking process.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.3
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• pp.133-138
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• 2020

As HMR (home meal replacement) food market grows rapidly, a new packaging with more HMR specialized functions is highly required to promote consumers' convenience. A susceptor is defined as a material generating heat by absorbing electromagnetic energy such typically as radiofrequency or microwave radiation. In microwave cooking, susceptors are made of conductive metal thin film deposited on paper or plastic sheet and have generally been used to help crispen or brown foods by converting microwave energy into heat. This mini review article deals with current status of microwave susceptor packaging including commercial products, technical theory, types of susceptor and a test method for heating performance.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.217.2-217.2
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• 2014

We prepared a flexible and transparent CuO/Cu/CuO multilayer electrodes on a polyethylene terephthalate (PET) substrate using a specially designed roll-to-roll sputtering system at room temperature for GFF-type touch screen panels (TSPs). By the continuous roll-to-roll sputtering of the CuO and Cu layer, we fabricated a flexible CuO(150nm)/Cu(150nm)/CuO(150nm) multilayer electrodes with a sheet resistance of $0.289{\Omega}/square$, resistivity of $5.991{\times}10^{-23}{\Omega}-cm$, at the optimized condition without breaking the vacuum. To investigate the feasibility of the CuO/Cu/CuO multilayer as a transparent electrode for GFF-type TSPs, we fabricated simple GFF-type TSPs using the diamond patterned CuO/Cu/CuO electrode on PET substrate as function of mesh line width. Using diamond patterned CuO/Cu/CuO electrode of mesh line $5{\mu}m$ with sheet resistance of 38 Ohm/square, optical transmittance of 90% at 550 nm and an average transmittance of 89% at wavelength range from 380 to 780 nm, we successfully demonstrated GFF-type touch panel screens (TPSs). The successful operation of GFF-type TPSs with CuO/Cu/CuO multilayer electrodes indicates that the CuO/Cu/CuO multilayer is a promising transparent electrode for large-area capacitive-type TPSs due to its low sheet resistance and high transparency.

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.543-549
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• 2014

A zinc oxide (ZnO) hybrid structure was successfully fabricated on a glass substrate by metal organic chemical vapor deposition (MOCVD). In-situ growth of a multi-dimensional ZnO hybrid structure was achieved by adjusting the growth temperature to determine the morphologies of either film or nanorods without any catalysts such as Au, Cu, Co, or Sn. The ZnO hybrid structure was composed of one-dimensional (1D) nanorods grown continuously on the two-dimensional (2D) ZnO film. The ZnO film of 2D mode was grown at a relatively low temperature, whereas the ZnO nanorods of 1D mode were grown at a higher temperature. The change of the morphologies of these materials led to improvements of the electrical and optical properties. The ZnO hybrid structure was characterized using various analytical tools. Scanning electron microscopy (SEM) was used to determine the surface morphology of the nanorods, which had grown well on the thin film. The structural characteristics of the polycrystalline ZnO hybrid grown on amorphous glass substrate were investigated by X-ray diffraction (XRD). Hall-effect measurement and a four-point probe were used to characterize the electrical properties. The hybrid structure was shown to be very effective at improving the electrical and the optical properties, decreasing the sheet resistance and the reflectance, and increasing the transmittance via refractive index (RI) engineering. The ZnO hybrid structure grown by MOCVD is very promising for opto-electronic devices as Photoconductive UV Detectors, anti-reflection coatings (ARC), and transparent conductive oxides (TCO).

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.438-439
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• 2013

Microelectronic devices의 접촉저항의 향상을 위해 Metal silicides의 형성 mechanism과 전기적 특성에 대한 연구가 많이 이루어지고 있다. 지난 수십년에 걸쳐, Ti silicide, Co silicide, Ni silicide 등에 대한 개발이 이루어져 왔으나, 계속적인 저저항 접촉 소재에 대한 요구에 의해 최근에는 Rare earth silicide에 관한 연구가 시작되고 있다. Rare-earth silicide는 저온에서 silicides를 형성하고, n-type Si과 낮은 schottky barrier contact (~0.3 eV)를 이룬다. 또한, 비교적 낮은 resistivity와 hexagonal AlB2 crystal structure에 의해 Si과 좋은 lattice match를 가져 Si wafer에서 high quality silicide thin film을 성장시킬 수 있다. Rare earth silicides 중에서 ytterbium silicide는 가장 낮은 electric work function을 갖고 있어 낮은 schottky barrier 응용에서 쓰이고 있다. 이로 인해, n-channel schottky barrier MOSFETs의 source/drain으로써 주목받고 있다. 특히 ytterbium과 molybdenum co-deposition을 하여 증착할 경우 thin film 형성에 있어 안정적인 morphology를 나타낸다. 또한, ytterbium silicide와 마찬가지로 낮은 면저항과 electric work function을 갖는다. 그러나 ytterbium silicide에 molybdenum을 화합물로써 높은 농도로 포함할 경우 높은 schottky barrier를 형성하고 epitaxial growth를 방해하여 silicide film의 quality 저하를 야기할 수 있다. 본 연구에서는 ytterbium과 molybdenum의 co-deposition에 따른 silicide 형성과 전기적 특성 변화에 대한 자세한 분석을 TEM, 4-probe point 등의 다양한 분석 도구를 이용하여 진행하였다. Ytterbium과 molybdenum을 co-deposition하기 위하여 기판으로 $1{\sim}0{\Omega}{\cdot}cm$의 비저항을 갖는 low doped n-type Si (100) bulk wafer를 사용하였다. Native oxide layer를 제거하기 위해 1%의 hydrofluoric (HF) acid solution에 wafer를 세정하였다. 그리고 고진공에서 RF sputtering 법을 이용하여 Ytterbium과 molybdenum을 동시에 증착하였다. RE metal의 경우 oxygen과 높은 반응성을 가지므로 oxidation을 막기 위해 그 위에 capping layer로 100 nm 두께의 TiN을 증착하였다. 증착 후, 진공 분위기에서 rapid thermal anneal(RTA)을 이용하여 $300{\sim}700^{\circ}C$에서 각각 1분간 열처리하여 ytterbium silicides를 형성하였다. 전기적 특성 평가를 위한 sheet resistance 측정은 4-point probe를 사용하였고, Mo doped ytterbium silicide와 Si interface의 atomic scale의 미세 구조를 통한 Mo doped ytterbium silicide의 형성 mechanism 분석을 위하여 trasmission electron microscopy (JEM-2100F)를 이용하였다.