• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.837-841
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• 2008

Propulsion of gene coated micro-particles is desired for non-intrusive drug delivery inside biological tissue. This has been achieved by the development of a device that uses high power laser pulses. The present paper looks at the mechanisms of micro-particle acceleration. Initially, a high power laser pulse is focused onto the front side of a thin aluminium foil leading to its ablation. The ablation front drives a compression wave inside the foil, thus leading to the formation of a shock wave, which will later reflect from the rear side of the foil, due to acoustic impedance mismatch. The reflected wave will induce an opposite motion of the foil, characterized by a very high speed, of the order of several millimeters per microsecond. Micro-particles, which are deposited on the rear side of the foil, thus get accelerated and ejected as micro-projectiles and are able to penetrate several hundreds of micrometers inside tissue-like material. These processes have been observed experimentally by using high-speed shadowgraphy and considered analytically.

• Journal of Electrochemical Science and Technology
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• v.1 no.1
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• pp.45-49
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• 2010

$Li_2PtO_3$ thin film electrodes, which might be possible candidate for the cathode materials for implantable batteries, were synthesized using an electrostatic spray deposition (ESD) technique onto a platinum foil substrate. Single phase $Li_2PtO_3$with a structure similar to layered $LiCoO_2$ structure were synthesized by spraying a precursor solution of $CH_3CO_2Li2H_2O$ in ethanol onto a Pt substrate at temperatures ranging from 200 to $400^{\circ}C$ followed by annealing at above $600^{\circ}C$. Lithium carbonate was the only major phase at temperatures up to $500^{\circ}C$. The X-ray diffraction (XRD) peaks of the Pt foil substrate and lithium carbonate disappeared at temperatures >$600^{\circ}C$. The volumetric capacity of the $Li_2PtO_3$ thin film synthesized using the ESD technique was approximately 817 mAh/$cm^3$, which exceeded that of $LiCoO_2$ (711 mAh/$cm^3$).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.89-90
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• Applied Microscopy
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• v.50
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• pp.8.1-8.7
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• 2020

Two thickness measurement methods using an electron energy loss spectroscopy (EELS) and 10a convergent beam electron diffraction (CBED) were compared in an Fe-18Mn-0.7C alloy. The thin foil specimen was firstly tilted to satisfy 10a two-beam condition. Low loss spectra of EELS and CBED patterns were acquired in scanning transmission electron microscopy (STEM) and TEM-CBED modes under the two-beam condition. The log-ratio method was used for measuring the thin foil thickness. Kossel-Möllenstedt (K-M) fringe of the $13{\ba{1}}$ diffracted disk of austenite was analyzed to evaluate the thickness. The results prove the good coherency between both methods in the thickness range of 72 ~ 113 nm with a difference of less than 5%.

• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.89-96
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• 2004

Micro-tensile testing system, consisting of a micro tensile loading system and micro-ESPI(Electronic Speckle Pattern Interferometry) system, has been developed for measurement of micro-tensile properties of thin micro-materials. Micro-tensile loading system had a load cell with the maximum capacity of 50N and micro actuator with resolution of 4.5nm in stroke. The system was used to apply a tensile load to the micro-sized specimen. During tensile loading, the micro-ESPI system acquired interferornetric speckle patterns in the deformed specimen and measured the in-plane tensile strain. The ESPI system consisted of a CCD-camera with a lens and the window-based program developed for this experiment. Using this system, stress-strain curves for 4 kinds of electrolytic copper foil 18$\square$m thick were obtained. From these curves, tensile properties, including the elastic modulus. yielding strength and tensile strength, were determined and also values of the plastic exponent and coefficient based on Ramberg-Osgood relationship were evaluated.

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.56-59
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• 2007

Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.566-569
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• 2008

Recently, the biolistic process is emerging as an effective needle-free drug delivery technique to transfer adequate concentrations of pharmacologic agents to soft living tissues with minimum side effects. We have started developing an effective method for delivering drug coated particles using laser ablation. A thin metal foil with deposited micro-particles on one side is irradiated with laser beam on the opposite side so that a shock wave is generated. This shock wave travels through the foil and is reflected, which causes and instantaneous deformation of the foil. Due to such a sudden deformation, the micro-particles are ejected at a very high speed. Here we present the experimental results of direct and confined laser ablation, which correspond to the initial stage of the whole experiment.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.