• Proceedings of the Korean Vacuum Society Conference
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• 1994.06a
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• pp.92-92
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• 1994

Relative intensities of photons emitted from tilted carbon foils have been measured in the wavelength region 300800 nm by 0,6-2,4 MeV $H^{+}\;and\;He^{+}$ ion impacts, Ions were directed onto target surfaces at tilt angles with respect to the sllrface normal, Experimental results support the model that the observed continuum radiation is emitted from the exited carbon foil itself. At each incident projectile energy, the photon intensities of continuum spectra for tilted carbon foi Is were compatred to the stoppi ng powers of carbon for $H^{+}\;and\;He^{+}$ ions, It was found that the photon emission intensity for $H^{+}$ ion is linearly proportional to the stopping power, whereas that for $He^{+}$ ions is proportional to a higher power of the stopping power, and that this tendency increases wi th decreasing velocity of the projectiIes[1, 2].[1, 2].

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.495-498
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• 2002

Recently, the advent of electro-active papers (EAPap) actuators has been reported. In this paper, the possibility of the actuators is demonstrated. EAPap is a paper that produces large displacement with small force under an electrical excitation. EAPap is made with a chemically treated paper by constructing thin electrodes on both sides of the paper. When electrical voltage is applied on the electrodes the EAPap produces bending displacement. To improve the bending performance of EAPap, different paper fibers-softwood, hardwood, bacteria cellulose, cellophane, carbon mixture paper, electrolyte containing paper and Korean traditional paper, in conjunction with additive chemicals were tested. Two attempts were made to construct the electrodes: the direct use of aluminum foil and the gold sputtering technique. It was found that a cellophane paper exhibits a remarkable bending performance. When 2MV/m of excitation voltage was applied on the paper actuator, more than 3mm of tip displacement was observed out of the 30 mm long paper beam. This is quite low excitation voltage compared to that of other EAPs. The actuation principle of electro-active paper (EAPap) and possible applications are addressed.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.

• Applied Microscopy
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• v.26 no.4
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• pp.447-456
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• 1996

Fracture surfaces of materials contain useful information ranging from crack path to the mechanism of fracture. Since limitation of electron transparency requires a sample in the form of thin foil for TEM observations, it is impossible to extract such information directly from the fracture surfaces. In this study, the method of surface replication from the ceramic fracture surface is employed to characterize the process of crack propagation in ceramic matrix composites using TEM analysis. The surface replica from the fracture surface in ceramic materials provides detailed surface morphology and more importantly, loosened particles on the fracture surface are collected. Electron diffraction and chemical composition analyses of these particles reveal crack path in the specimen. Furthermore, one can determine the mode of fracture by observing the fracture surface morphology from the image of replica. Two examples are given to illustrate the potential of the surface replication technique. In the first example, apparent toughness increase in $B_{4}C-Al$ composites at high strain rate is investigated by surface replication to elucidate the mechanism of fracture at different strain rates. The polytypes of SiC formed during the sintering of SiC-AlN composite and their effect on the fracture behavior of SiC-AlN composite are analyzed in the second example.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.262-263
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• 2011

Flexible electronics, a future technology of electronics, require a low cost integrated circuit that can be built on various types of the flexible substrates. As a potential candidate for this application, a single walled carbon nanotube network is studied as an active device with a scheme of thin film transistor. Transistors are formed on a plastic foil by the Roll-to-Roll (R2R) and the Roll-to-Device (R2D) printing method. For both printing methods, electrical transports for the transistors are presented with the temperature dependence of threshold voltage (V_Th) and mobility from the measured transfer curves at temperatures ranging from 10 K to 300 K. It is observed that ${\mu}=0.044cm^2/V{\cdot}sec$ and V_Th=7.28V for R2R and ${\mu}=0.025cm^2/V{\cdot}sec$ and V_Th=3.10V for R2D, both for the temperature at 300K. Temperature dependence of mobility and V_Th is observed. However for R2R, the temperature dependence of V_Th is constant. It is the difference between, R2R and R2D.

• Journal of the Korean institute of surface engineering
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• v.43 no.1
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• pp.7-11
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• 2010

Solid phase crystallization (SPC) is a simple method in producing a polycrystalline phase by annealing amorphous silicon (a-Si) in a furnace environment. Main motivation of the crystallization technique is to fabricate low temperature polycrystalline silicon thin film transistors (LTPS-TFTs) on a thermally susceptible glass substrate. Studies on SPC have been naturally focused to the low temperature regime. Recently, fabrication of polycrystalline silicon (poly-Si) TFT circuits from a high temperature polycrystalline silicon process on steel foil substrates was reported. Solid phase crystallization of a-Si films proceeds by nucleation and growth. After nucleation polycrystalline phase is propagated via twin mediated growth mechanism. Elliptically shaped grains, therefore, contain intra-granular defects such as micro-twins. Both the intra-granular and the inter-granular defects reflect the crystallinity of SPC poly-Si. Crystallinity and SPC kinetics of high temperatures were compared to those of low temperatures using Raman analysis newly proposed in this study.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.7
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• pp.481-485
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• 2003

Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.48-52
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• 2009

Micro-hole targets are studied to generate energetic protons from laser-thin foil targets by using 2-dimensional particle-in-cell simulations. By using a small hole, the maximum energy of the accelerated proton is increased to 4 times higher than that from a simple planar target. The main proton acceleration mechanism of the hole-targets is the electrostatic field created between the fast electrons accelerated by the laser pulse ponderomotive force combined with the vacuum heating and the target rear surface. But in this case, the proton angular distribution shows double-peak shape, which means poor collimation and low current density. By using a small cone-shaped hole, the maximum proton energy is increased 3 times higher than that from a simple planar target. Furthermore, the angular distribution of the accelerated protons shows good collimation.

• Transactions on Electrical and Electronic Materials
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• v.1 no.4
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• pp.20-24
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• 2000

This study aimed to develop ITO(Indium Tim Oxide) tin films ablation with a pulsed type KrF excimer laser required for the electrode patterning application in flat panel display into small geometry on a large substrate are. The threshold fluence for ablating ITO on glass substrate is about 0.1 J/㎠. And its value is much smaller than that using 3 .sup rd/ harmonic Nd:YAG laser. Through the optical microscope measurement the surface color of the ablated ITO is changed into dark brown due to increase of surface roughness and transformation of chemical composition by the laser light. The laser-irradiated regions were all found to be electrically isolating from the original surroundings. The XPS analysis showed that the relative surface concentration of Sn and In was essentially unchanged (In:Sn=5:1)after irradiating the KrF excimer laser. Using Al foil made by 2$\^$nd/ harmonic Na:YAG laser, the various ITO patterning is carried out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.