• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.46.2-46.2
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• 2010

For use of superstrate thin-film solar cells, surface texture of the transparent conductive oxide (TCO) has been used to enhance short-circuit currents by increasing light trapping into the cell. ZnO:Al films were deposited by using DC magnetron sputtering on glass substrates with ceramic (ZnO:$Al_2O_3$) target. The as-deposited TCO before texturing exhibited high transparencies (T > 85% for visible light including all reflection losses) and excellent electrical properties ($r=3-6{\times}10^{-4}{\Omega}.cm$). The optical and electrical properties of the TCO are influenced by the texturing conditions such as not only etchant dilutions but also etching time. We obtained the haze value of 14-16 resulting in increase in light trapping and short-circuit currents also.

• Journal of information and communication convergence engineering
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• v.4 no.3
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• pp.105-107
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• 2006

Amorphous silicon is a kind of optical to electric conversion material with current or voltage type after generating a numerous free electron and hole when it is injected by light. It is very effective technology to make schottky diode by bonding thin film to use optical diode. In this paper, we have fabricated optical diode device by forming chrome silicide film through thermal processing with thin film($100{\AA}$) having optimal amorphous silicon. The optimal condition is that we make a thin film by using PECVD(Plasma Enhanced Chemical Vapor Deposition) to improve reliability and characteristics of optical diode. We have obtained high quality diode by using chrome silicide optical diode from dark current and optical current measurement compared to previous method. It makes a simple process and improves a good reliability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.2
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• pp.190-193
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• 2022

In this work, the effect of sputtering working pressure for the tellurium film and its thin-film transistor was investigated. The transfer characteristics of tellurium thin-film transistors were improved by increasing the working pressure during sputtering process. As increasing working pressure, physical and optical properties of Te films such as crystallinity, transmittance, and surface roughness were improved. Therefore, the improved transfer characteristics of Te thin-film transistors may originate from both improved interface properties between the silicon oxide gate dielectric layer and the tellurium active layer with an improved quality of Te film. In conclusion, the control of working pressure during sputtering would be important for obtaining high-performance tellurium-based thin film transistor

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.9-13
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• 2019

In this study, a miniature thin film-patterned heater was fabricated on a silicon substrate using semiconductor process technology and the thermal characteristics of the applied voltage, power, and temperature of the thin film heater were measured and analyzed. The temperature of the thin film pattern heater increased with increasing power, but the temperature increase rate was gradual at high power intervals. The characteristics of the high temperature section of the platinum thin film-patterned heater were analyzed using the heat resistance model under atmospheric and vacuum conditions. The thermal resistance measured in a vacuum atmosphere was 0.79 [K/mW] higher than the heat resistance value 0.69 [K/mW] in air. The temperature of the thin film pattern heater can be maintained at a low power in a vacuum rather than in air, and these results are expected to be utilized in the structural design of a thin film-patterned heater element.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.13-16
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• 2012

Zinc oxide (ZnO) films were deposited by an RF magnetron sputtering system with the RF power of 200W and 300W and flow rate of oxygen gases of 20 and 30 sccm, in order to research the growth of ZnO on carbon doped silicon oxide (SiOC) thin film. The reflectance of SiOC film on Si film deposited by the sputtering decreased with increasing the oxygen flow rate in the range of long wavelength. In comparison between ZnO/Si and ZnO/SiOC/Si thin film, the reflectance of ZnO/SiOC/Si film was inversed that of ZnO/Si film in the rage of 200~1000 nm. The transmittance of ZnO film increased with increasing the oxygen gas flow rate because of the transition from conduction band to oxygen interstitial band due to the oxygen interstitial (Oi) sites. The low reflectance and the high transmittance of ZnO film was suitable properties to use for the front electrode in the display or solar cell.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.85-88
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• 2004

Mono-crystalline silicon(mono-Si) is both abundant in our environment and an excellent material for Si device applications. However, single crystalline silicon solar cell has been considered to be expensive for terrestrial applications. For that reason, the last few years have seen very rapid progress in the research and development activities of layer transfer(LT) processes. Thin film Si layers which can be detached from a reusable mono-Si wafers served as a substrate for epitaxial growth. The epitaxial films have a very high efficiency potential. LT technology is a promising approach to reduce fabrication cost with high efficiency at large scale since expensive Si substrate can be recycled. Low quality Si can be used as a substrate. Therefore, we propose one of the major technologies on fabricating thin film Si substrate using a LT. In this paper, we study the LT method using the electrochemical etching(ECE) and solid edge.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.343-343
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• 2011

저온에서의 Thin Film Transistor (TFT) 혹은 Nonvolatile memory (NVM) 등의 MOS 구조 소자들의 높은 전기적 특성에 관한 연구들이 진행 되면서 mobility와 stability 그리고 구조화의 용이성에 대한 연구가 진행됨에 따라 amorphous silicon의 결정화를 통해 전기적 특성을 향상 시킨 Nanocrystalline silicon (nc-Si)/Microcrystalline silicon (${\mu}c$-Si)에 대한 연구가 관심을 받고 있다. 본 논문에서는 ${\leq}300^{\circ}C$에서 Inductively coupled plasma chemical vapor deposition를 이용한 TFT을 제작하였다. 가스비, 온도, 두께에 따른 결정화 정도를 Raman spectra를 통해 확인한 후 Bottom gate와 Top gate 구조의 TFT를 제작 하고 결정화에 따른 전기적 특성 향상과 그의 덧붙여 플라즈마 처리를 통한 특성 향상을 확인 하였다.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.503-509
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• 2001

Thin films of hydrogenated amorphous silicon (a-Si : H) and hydrogenated amorphous silicon carbide (a-SiC:H) of different compositions were deposited on Si(100) wafer and glass by RF plasma-enhanced chemical vapor deposition (RF-PECVD). In the present work, we have investigated the effects of the RF power on the properties, such as optical band gap, transmittance and crystallinity. The Raman data show that the a-Si:H material consists of an amorphous and crystalline phase for the co-presence of two peaks centered at 480 and $520 cm^{-1}$ . The UV-VIS data suggested that the optical energy band gap ($E_{g}$ ) is not changed effectively with RF power and the obtained $E_{g}$(1.80eV) of the $\mu$c-Si:H thin film has almost the same value of a-Si:H thin film (1.75eV), indicating that the crystallity of hydrogenated amorphous silicon thin film can mainly not affected to their optical properties. However, the experimental results have shown that$ E_{g}$ of the a-SiC:H thin films changed little on the annealing temperature while $E_{g}$ increased with the RF power. The Raman spectrum of the a-SiC:H thin films annealed at high temperatures showed that graphitization of carbon clusters and microcrystalline silicon occurs.

• Journal of the Korean Chemical Society
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• v.38 no.7
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• pp.473-479
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• 1994

Tungsten thin film was deposited on p-(100) silicon substrate by using the LPCVD(low pressure chemical vapor deposition) technique. $WF_6$ was used as a source gas for tungsten and $SiH_4$ was used as a reducing gas for $WF_6$. Tungsten thin film was deposited by either SiH4 or Si substrate reduction of $WF_6$ under cold-wall condition and it was deposited by $SiH_4$ reduction of $WF_6$ under hot-wall condition. The crystal structure of deposited thin film under both conditions were identified to be bcc (body centered cubic). The physical and electrical properties of deposited thin films were investigated. The deposited film under hot-wall condition changed to $WSi_2$ film by the annealing under $800^{\circ}C.$ From the experimental results and theoretical considerations, the change of the crystal structure of the thin film by annealing was discussed. $WSi_2$ thin film, which was known to have good compatibility with Si substrate, could be produced under hot-wall condition although the film properties were superior under cold-wall condition.