• Title/Summary/Keyword: Thin film evaporation

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Growth Model of Bi-Superconducting Thin Film Fabricated by Co-sputtering Method (동시 스퍼터법으로 제작한 Bi 초전도 박막의 성장 모델)

  • Chun, Min-Woo;Park, Yong-Pil
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.11a
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    • pp.796-799
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    • 2002
  • BSCCO thin films are fabricated via a co-deposition process at an ultra-low growth rate using ion beam sputtering. The sticking coefficient of Bi element exhibits a characteristic temperature dependence. This temperature dependence of the sticking coefficient was explained consistently on the basis of the evaporation and sublimation processes of Bi$_2$O$_3$.

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Optical Transmittance of PdHx Thin Film (PdHx 박막의 광투과도)

  • Cho, Young sin
    • Transactions of the Korean hydrogen and new energy society
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    • v.12 no.3
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    • pp.201-209
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    • 2001
  • The change of optical transmittance of $PdH_x$ thin film due to hydrogen concentration change was measured at room temperature. Pd film($312{\AA}$ thick) was made by thermal evaporation on glass substrate. Hydrogen absorption and desorption cycling effect on optical transmittance was measured 4 times in the pressure range between 0 and 640 torr. Ratio of optical transmittance to the change of ln pressure(torr) increases with increasing number of hydrogen A-D cyclings in the ${\beta}$ phase.

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Study on Evaporating Process Modeling for Estimation of Thin-film Thickness Distribution (박막두께 예측을 위한 증착 공정 모델링에 관한 연구)

  • Lee Eung-Ki;Lee Dong-Eun;Lee Sook-Han
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.156-159
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    • 2006
  • In order to design an evaporation system, geometric simulation of film thickness distribution profile is required. In this paper, a geometric modeling algorithm is introduced for process simulation of the evaporating process. The physical fact of the evaporating process is modeled mathematically. Based on the developed method, the thickness of the thin-film layer can be successfully controlled.

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Low Temperature Preparation of Hafnium Oxide Thin Film for OTFT by Atomic Layer Deposition

  • Choi, Woon-Seop
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.6
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    • pp.247-250
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    • 2008
  • Hafnium dioxide ($HfO_2$) thin film as a gate dielectric for organic thin film transistors is prepared by plasma enhanced atomic layer deposition (PEALD). Mostly crystalline of $HfO_2$ film can be obtained with oxygen plasma and with water at relatively low temperature of $200^{\circ}C$. $HfO_2$ was deposited as a uniform rate of $1.2\;A^{\circ}$/cycle. The pentacene TFT was prepared by thermal evaporation method with hafnium dioxide as a gate dielectric. The electrical properties of the OTFT were characterized.

Effect of Heating Medium and Evaporation Temperatures on Concentration of Garlic Juice (가열 매체 및 증발온도가 마늘즙의 농축에 미치는 영향)

  • Kim, Byeong-Sam;Park, Noh-Hyun;Park, Moo-Hyun;Han, Bong-Ho
    • Korean Journal of Food Science and Technology
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    • v.24 no.4
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    • pp.301-305
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    • 1992
  • Effect of heating medium and evaporation temperatures on a concentration ratio, a evaporation rate and a overall heat transfer coefficient during concentration of garlic juice by a centrifugal thin film evaporator were investigated. At constant feeding rate and evaporation temperature, the concentration ratio, the evaporation rate and the overall heat transfer coefficient increased with the increase of the steam temperature but those values increased slowly or decreased as a steam temperature exceeded $110^{\circ}C$. At the feeding rate of 50 kg/h and the steam temperature of $100^{\circ}C$ and below, those values decreased with the increase of evaporation temperature. But if a steam temperature became $100^{\circ}C$ and up, those values increased slowly and then decreased with the increase of the evaporation temperature until the evaporation temperature reached a critical value. At constant feeding rate, those values increased until the temperature difference between steam and evaporation temperatures became $70^{\circ}C$. But if they become larger than $70^{\circ}C$, those values increased slowly and then decreased.

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A Study on Cu(In,Ga)Se2 Thin Film with Substrate Temperature Change (기판 온도 변화에 따른 Cu(In,Ga)Se2 박막에 관한 연구)

  • Park, Jung-Cheul;Chu, Soon-Nam
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.12
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    • pp.888-893
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    • 2013
  • In this paper, we prepared $Cu(In,Ga)Se_2$ thin films by using co-evaporation method, and analyzed the properties of the thin films. During the thin film preparation process, we confirmed $InGaSe_2$ phase was formed at $400^{\circ}C$ in first stage, and also confirmed the thin films showed the vacancy decrease. In second and third stage, we confirmed the density increase of crystalline structure at over $480^{\circ}C$ and the formation of $Cu(In_{0.7}Ga_{0.3})Se_2$ phase. As the result of SEM and XRD analysis of the films which were before and after heat-treated, we confirmed the disappearance of $Cu_2Se_2$ and the formation of $Cu(In_{0.7}Ga_{0.3})Se_2$ single phase after the heat-treatment, We, therefore, confirmed the heat-treatment did not affect the absorbency spectra of the thin films.

진공석영 전기로에서 열처리한 $CuInS_2$ 박막특성연구

  • Yang, Hyeon-Hun;Lee, Seok-Ho;Kim, Yeong-Jun;Na, Gil-Ju;Baek, Su-Ung;Han, Chang-Jun;Kim, Han-Ul;So, Sun-Yeol;Park, Gye-Chun;Lee, Jin;Jeong, Hae-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.03b
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    • pp.17-17
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    • 2010
  • Polycrystalline $CuInS_2$ thin films were performed from S/In/Cu Stacked elemental layer(SEL) method with post annealing. In thin method, the thin films were annealed in Vacuum of $10^{-3}$ torr or in S ambient. $CuInS_2$ thin films were manufctured by using the evaporation and the annealing with vacuum quartz furnace of sulfurization process was used in the vacuum chamber to the substrate temperature on the glass substrate the annealing temperature and characteristics thereof were investigated. The physical properties of the thin film were investigated under various fabrication conditions including the substrate temperature annealing time by XRD, FE-SEM, and Hall measurement system.

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