• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.10
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• pp.2273-2279
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• 2012

This research is based on fabricating Cu(In,Ga)$Se_2$ thin-film by co-evaporation method. On $1^{st}$ - stage, $In_2Se_3$ phase appeared when the substrate temperature reached to $400^{\circ}C$, however, there was small effect between the substrate temperature and absorbency spectrum on $2^{nd}$, $3^{rd}$ - stage because the average thickness of the thin-film was $1{\mu}m$ or higher. SEM and XRD was measured on $2^{nd}$ and $3^{rd}$ stage and it showed as the substrate temperature increases, the density of the crystal structure increased with the decreament of the vacancy. Furthermore, the formation of Cu(In0.7Ga0.3)$Se_2$ phase showed at $480^{\circ}C$ and $500^{\circ}C$.

• Journal of the Korean Electrochemical Society
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• v.8 no.1
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• pp.32-36
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• 2005

[ $WO_3$ ] and $NiO-WO_3$ thin films were deposited on a Si (100) substrate by using high vacuum thermal evaporation. The effects of various film thicknesses on the surface morphology $WO_3$ and $NiO-WO_3$ thin films were investigated. X-ray diffraction (XRD), Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy(XPS) were employed to characterize the deposited films. The results suggest that as $WO_3$ thin films became thick, their grain grew up to a $0.6{\mu}m$. On the other hand, NiO-doping to $WO_3$ thin films inhibited the grain growth five times less than undoped $WO_3$ thin films. This results show that NiO doping inhibited the grain growing of $WO_3$ thin films. Also, the variation of NOx sensitivity $(R_{NOx}/R_{air})$ to the thickness of $WO_3$ and $NiO-WO_3$ thin films were measured according to the thickness change of thin films and the working temperature of sensor in 5ppm NOx gas. As a result, $NiO-WO_3$ thin films showed more excellent properties than $WO_3$ thin films for NOx sensitivity.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.436-437
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• 2008

Flexible CIGS thin film solar cell was fabricated using STS430 plate as a flexible substrate in this work. A diffusion barrier layer of $SiO_2$ thin film was deposited on STS430 substrate by PECVD followed by deposition of double layered Mo back contact. After depositing CIGS absorber layer by co-evaporation, CdS buffer layer by chemical bath deposition, ZnO window layer by RF sputtering and Al electrode by thermal evaporation, the solar cell fabrication processes were completed and its performance was evaluated. Corresponding solar cell showed an conversion efficiency of 8.35 % with $V_{OC}$ of 0.52 V, $J_{SC}$ of 26.06 mA/$cm^2$ and FF of 0.61.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.153-155
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• 2009

In this study, we fabricated the $Cu(In,Ga)Se_2$ (CIGS) thin-film solar cells by using a polyimide substrate. The CIGS thin-film was deposited on Mo coated polyimide substrate by a 3-stage co-evaporation technique. Because the polyimide shows thermal transformation at about $400^{\circ}C$, the substrate temperature of co-evaporation process was set to below $400^{\circ}C$. Corresponding solar cell showed a conversion efficiency of 7.08 % with $V_{OC}$ of 0.58 V, $J_{SC}$ of 24.99 $mA/cm^2$ and FF of 0.49.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.2
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• pp.171-175
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• 2014

In this study, we suggest a method to measure the thickness of thin films nondestructively using the dispersion characteristics of a surface acoustic wave propagating along the thin film surface. To measure the thickness of thin films, we deposited thin films with different thicknesses on a Si (100) wafer substrate by controlling the deposit time using the E-beam evaporation method. The thickness of the thin films was measured using a scanning electron microscope. Subsequently, the surface wave velocity of the thin films with different thicknesses was measured using the V(z) curve method of scanning acoustic microscopy. The correlation between the measured thickness and surface acoustic wave velocity was verified. The wave velocity of the film decreased as the film thickness increased. Therefore, thin film thickness can be determined by measuring the dispersion characteristics of the surface acoustic wave velocity.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.78-85
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• 2012

Aluminum nitride(AlN) is a compound (III-V group) of hexagonal system with a crystal structure. Its Wurzite phase is a very wide band gap semiconductor material. It has not only a high thermal conductivity, a high electrical resistance, a high electrical insulating constant, a high breakdown voltage and an excellent mechanical strength but also stable thermal and chemical characteristics. This study is on the preferred orientation characteristics of AlN thin films by reactive evaporation using $NH_3$. We have manufactured an AlN thin film and then have checked the crystal structure and the preferred orientation by using an X-ray diffractometer and have also observed the microstructure with TEM and AlN chemical structure with FT-IR. We can manufacture an excellent AlN thin film by reactive evaporation using $NH_3$ under 873 K of substrate temperature. The AlN thin film growth is dependent on Al supplying and $NH_3$ has been found to be effective as a source of $N_2$. However, the nuclear structure of AlN did not occur randomly around the substrate a particle of the a-axis orientation in fast growth speed becomes an earlier crystal structure and is shown to have an a-axis preferred orientation. Therefore, reactive evaporation using $NH_3$ is not affected by provided $H_2$ amount and this can be an easy a-axis orientation method.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.59-64
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• 2001

The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration dependent viscosity and the binary diffusivity of the coating liquid are used in the analysis. The time variational velocity components of the coating liquid and the film thickness are analyzed according to the various spin speed. When the evaporation is considered, the flow decease in the early times due to the increase of the viscosity and the resultant flow resistance. Effects of the two film thinning mechanism, the flow-out and evaporation are also considered in the analysis.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.754-758
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• 2002

In order to reach the high quality of organic thin films such as high mobility for device applications, it is strongly desirable to study the growth properties of pentacene film as a function of evaporation condition. Here, we report the structure and morphology of thermal evaporated pentacene thin film by AFM, SEM, and XRD as a function of the evaporation rate and substrate temperature. These results play a key role in determining the electric performance of organic thin film transistor devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1024-1027
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• 2005

By using $45^{\circ}$ obliqued evaporation method with electron beam system, uniformly vertical liquid crystal (LC) alignment was achieved. And a high pretilt angles of about $2.5^{\circ}$ were measured. Also, it was verified that there are no variations of pretilt angle as a function of $SiO_x$ thin film thickness 20 nm and 50 nm. A good LC alignment states were observed at annealing temperature of $250^{\circ}C$. Consequently, the high pretilt angle and the good thermal stability of LC alignment by $45^{\circ}$ obliqued electron beam evaporation method on the $SiO_x$ thin film can be achieved.