• Title/Summary/Keyword: Thin Film Thickness

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GHz Bandwidth Characteristics of Rectangular Spiral type Thin Film Inductors (사각 나선형 박막 인덕터의 GHz 대역 특성)

  • Kim, J.;Jo, S.
    • Journal of the Korean Magnetics Society
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    • v.14 no.1
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    • pp.52-57
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    • 2004
  • In this research, characteristics of air core rectangular spiral type inductors of ㎓ band are numerical analyzed. The basic structure of inductors is a rectangular spiral having 390${\mu}{\textrm}{m}$${\times}$390${\mu}{\textrm}{m}$ size, 5.5 turns, line width of 10 ${\mu}{\textrm}{m}$ and line space of 10 ${\mu}{\textrm}{m}$. Frequency characteristics were simulated up to 10 ㎓. The substrate was modeled as Si, Sapphire, glass and GaAs and the conductor as Cu. The thickness of the conductor was fixed at 2. The number of turns was n.5 to make the input and output terminals to be on the opposite sides. The initial inductance of the basic inductor structure was 13.0 nH, maximum inductance 60.0 nH and resonance frequency 4.25 ㎓. As the dielectric constant of the substrate was increased, the initial inductance varied only slightly, but the resonance frequency decreased considerably. As the number of turns was varied from 1.5 to 9.5, the initial inductance was increased linearly from 2.9 nH to 15.9 nH and, then, saturated at 16.9 nH. The Q factor increased only slightly. The line width and line space of inductors were varied from 5 ${\mu}{\textrm}{m}$ to 20 ${\mu}{\textrm}{m}$, which resulted in the decrease of the initial and maximum inductances. But the resonance frequency was increased. Q factor displayed an increase and a decrease, respectively, when the line width and line space were increased.

High Frequency Properties of Fe93.5Si6.5 Magnetic Powder/Epoxy Composite Film (Fe93.5Si6.5 자성분말/에폭시 복합재 필름의 고주파 특성)

  • Hong, Seon-Min;Kim, Cheol-Gi
    • Journal of the Korean Magnetics Society
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    • v.18 no.5
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    • pp.195-199
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    • 2008
  • Composites of $Fe_{93.5}Si_{6.5}$ powder and epoxy were prepared using a thermal curing process. Scanning electron microscope (SEM), vibrating sample magnetometer (VSM) and network analyzer were used to analyze the structure, electromagnetic properties and microwave absorption of the composites. Results show that the saturation magnetization depends on the fraction of the $Fe_{93.5}Si_{6.5}$ powder in the composite, which affects initial permeability. It is believed that the eddy current loss is a dominant factor over 1 GHz and that the resonance frequency of the composite decreases with increasing fractions of $Fe_{93.5}Si_{6.5}$ powder. Finally, reflection loss was calculated from the permeability and permittivity of these composites. Composite with 50 wt.% $Fe_{93.5}Si_{6.5}$ powder fractions and 5 mm thickness showed reflection loss below -20 dB from 3.66 GHz to 4.16 GHz. Therefore, it is believed that thin Fe-Si/epoxy composites may be a good candidate for microwave absorption application.

Study on Low-Temperature Solid Oxide Fuel Cells Using Y-Doped BaZrO3 (Y-doped BaZrO3을 이용한 저온형 박막 연료전지 연구)

  • Chang, Ik-Whang;Ji, Sang-Hoon;Paek, Jun-Yeol;Lee, Yoon-Ho;Park, Tae-Hyun;Cha, Suk-Won
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.9
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    • pp.931-935
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    • 2012
  • In this study, we fabricate and investigate low-temperature solid oxide fuel cells with a ceramic substrate/porous metal/ceramic/porous metal structure. To realize low-temperature operation in solid oxide fuel cells, the membrane should be fabricated to have a thickness of the order of a few hundreds nanometers to minimize IR loss. Yttrium-doped barium zirconate (BYZ), a proton conductor, was used as the electrolyte. We deposited a 350-nm-thick Pt (anode) layer on a porous substrate by sputter deposition. We also deposited a 1-${\mu}m$-thick BYZ layer on the Pt anode using pulsed laser deposition (PLD). Finally, we deposited a 200-nm-thick Pt (cathode) layer on the BYZ electrolyte by sputter deposition. The open circuit voltage (OCV) is 0.806 V, and the maximum power density is 11.9 mW/$cm^2$ at $350^{\circ}C$. Even though a fully dense electrolyte is deposited via PLD, a cross-sectional transmission electron microscopy (TEM) image reveals many voids and defects.

A Study of Photoelectrolysis of Water by Use of Titanium Oxide Films (산화티타늄 피막의 광 전기분해 특성에 관한 연구)

  • Park, Seong-Young;Cho, Byung-Won;Ju, Jeh-Beck;Yun, Kyung-Suk;Lee, Eung-Cho
    • Applied Chemistry for Engineering
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    • v.3 no.1
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    • pp.88-99
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    • 1992
  • For the development of semiconducting photoelectrode to be more stable and efficient in the process of photoelectrolysis of the water, pure titanium rods were oxidized by anodic oxidation, furance oxidation and flame oxidation and used as electrodes. The Indium islands were formed by electrodeposition of "In" thin film on $TiO_2$ and Ti by electrodeposition. Also $A1_2O_3$ and NiO islands were coated on Ti by the electron-beam evaporation technique. The maximum photoelectrochemical conversion efficiency(${\eta}$) was 0.98% for flame oxidized electrode($1200^{\circ}C$ for 2min in air). Anodically oxidized electrodes have photoelectrochemical conversion efficiency of 0.14%. Furnace oxidized electrode($800^{\circ}C$ for 10min in air) has 0.57% of photoelectrochemical efficiency and shows a band-gap energy of about 2.9eV. The $In_2O_3$ coated $TiO_2$ exhibits 0.8% of photoelectrochemical efficiency but much higher value of ${\eta}$ was obtained with the Increase of applied blas voltage. However, $Al_2O_3$ or NiO coated $TiO_2$ shows much low value of ${\eta}$. The efficiency was dependent on the presence of the metallic interstitial compound $TiO_{0+x}$(x<0.33) at the metal-semiconductor interface and the thickness of the suboxide layer and the external rutile scale.

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Effect of gas composition on the characteristics of a-C:F thin films for use as low dielectric constant ILD (가스 조성이 저유전상수 a-C:F 층간절연막의 특성에 미치는 영향)

  • 박정원;양성훈;이석형;손세일;오경희;박종완
    • Journal of the Korean Vacuum Society
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    • v.7 no.4
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    • pp.368-373
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    • 1998
  • As device dimensions approach submicrometer size in ULSI, the demand for interlayer dielectric materials with very low dielectric constant is increased to solve problems of RC delay caused by increase in parasitic resistance and capacitance in multilevel interconnectins. Fluorinated amorphous carbon in one of the promising materials in ULSI for the interlayer dielectric films with low dielectric constant. However, poor thermal stability and adhesion with Si substrates have inhibited its use. Recently, amorphous hydrogenated carbon (a-C:H) film as a buffer layer between the Si substrate and a-C:F has been introduced because it improves the adhesion with Si substrate. In this study, therfore, a-C:F/a-C:H films were deposited on p-type Si(100) by ECRCVD from $C_2F_6, CH_4$and $H_2$gas source and investigated the effect of forward power and composition on the thickness, chemical bonding state, dielectric constant, surface morphology and roughness of a-C:F films as an interlayer dielectric for ULSI. SEM, FT-IR, XPS, C-V meter and AFM were used for determination of each properties. The dielectric constant in the a-C:F/a-C:H films were found to decrease with increasing fluorine content. However, the dielectric constant increased after furnace annealing in $N_2$atomosphere at $400^{\circ}C$ for 1hour due to decreasing of flurorine content. However, the dielectric constant increased after furnace annealing in $N_2$atmosphere at $400^{\circ}C$ for 1hour due to decreasing of fluorine concentration.

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Sn-Ag-Cu Solder Joint Properties on Plasma Coated Organic Surface Finishes and OSP (플라즈마 유기막과 OSP PCB 표면처리의 Sn-Ag-Cu 솔더 접합 특성 비교)

  • Lee, Tae-Young;Kim, Kyoung-Ho;Bang, Jung-Hwan;Park, Nam-Sun;Kim, Mok-Soon;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.3
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    • pp.25-29
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    • 2014
  • Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.

SiGe Alloys for Electronic Device Applications (실리콘-게르마늄 합금의 전자 소자 응용)

  • Lee, Seung-Yun
    • Journal of the Korean Vacuum Society
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    • v.20 no.2
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    • pp.77-85
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    • 2011
  • The silicon-germanium (SiGe) alloy, which is compatible with silicon semiconductor technology and has a smaller band gap and a lower thermal conductivity than silicon, has been used to fabricate electronic devices such as transistors, photodetectors, solar cells, and thermoelectric devices. This paper reviews the application of SiGe alloys to electronic devices and related technical issues. Since the SiGe alloy comprises germanium whose band gap is smaller than silicon, its band gap is also smaller than that of silicon irrespective of the ratio of silicon to germanium. This narrow band gap of SiGe enables the base thickness of bipolar transistors to decrease without a loss in current gain so that it is possible to improve the speed of bipolar transistors by adopting the SiGe-base. In addition, the conversion efficiency of solar cells is enhanced by the absorption of long-wavelength light in the SiGe absorption layer. Phonon scattering caused by the irregular distribution of alloying elements induces the lower thermal conductivity of SiGe than those of pure silicon and germanium. Because a thin film layer with a low thermal conductivity suppresses thermal conduction through a thermal sink, the SiGe alloy is considered to be a promising material for silicon-based thermoelectric systems.

Thermal Stability of Ti-Si-N as a Diffusion Barrier (Cu와 Si간의 확산방지막으로서의 Ti-Si-N에 관한 연구)

  • O, Jun-Hwan;Lee, Jong-Mu
    • Korean Journal of Materials Research
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    • v.11 no.3
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    • pp.215-220
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    • 2001
  • Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

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Development and Performance Evaluation of Anti-cavitation Paint with a Lamella Glass-flake (판상형 Glass-flake를 이용한 내캐비테이션 도료 개발 및 성능평가)

  • Park, Hyeyoung;Kim, Sung-gil;Kim, Sang-suk;Choi, I-chan;Kim, Byungwoo;Kim, Seung-jin
    • Korean Chemical Engineering Research
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    • v.54 no.2
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    • pp.145-151
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    • 2016
  • In response to the cavitation caused by the partial vacuum caused by the fluid flow, a paint was developed by dispersing the lamella-shaped glass-flake in resin for anti-cavitation. This composite paint was developed by using the inorganic filler (lamella shaped glass-flake) and the NBR (Acrylonitrile-butadiene rubber) which was modified epoxy resin. Especially, the glass-flake was a thin film with a thickness of about 100~200 nm and length of about $20{\sim}30{\mu}m$, the aspect ratio was about 200 to 300 times that of the plate-shaped. So the paint for anti-cavitation have shown excellent performance in corrosion resistance. The results of evaluating anti-cavitation performance was below, tensile strength $4.8{\sim}6N/mm^2$ or more, rupture elongation 30% or higher, abrasive speed $10mm^2/h$ or less. In particular, it showed more than twice the superior performance compared to existing advanced foreign products in anti-cavitation performance evaluation.

Dye-sensitized Solar Cells Utilizing Core/Shell Structure Nanoparticle Fabrication and Deposition Process (코어/쉘 구조의 나노입자 제조 및 증착 공정을 활용한 염료감응 태양전지)

  • Jeong, Hongin;Yoo, Jhongryul;Park, Sungho
    • Korean Chemical Engineering Research
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    • v.57 no.1
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    • pp.111-117
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    • 2019
  • This study proposed the fabrication and deposition of high purity crystalline $core-TiO_2/shell-Al_2O_3$ nanoparticles. Morphological properties of $core-TiO_2$ and coated $shell-Al_2O_3$ were confirmed by transmission electron microscope (TEM) and transmission electron microscope - energy dispersive spectroscopy (TEM-EDS). The electrical properties of the prepared $core-TiO_2/shell-Al_2O_3$ nanoparticles were evaluated by applying them to a working electrode of a Dye-Sensitized Solar Cell (DSSC). The particle size, growth rate and the main crystal structure of $core-TiO_2$ were analyzed through dynamic light scattering system (DLS), scanning electron microscope (SEM) and X-ray diffraction (XRD). The $core-TiO_2$, which has a particle size of 17.1 nm, a thin film thickness of $20.1{\mu}m$ and a main crystal structure of anatase, shows higher electrical efficiency than the conventional paste-based dye-sensitized solar cell (DSSC). In addition, the energy conversion efficiency (6.28%) of the dye-sensitized solar cell (DSSC) using the $core-TiO_2/shell-Al_2O_3$ nanoparticles selectively controlled to the working electrode is 26.1% higher than the energy conversion efficiency (4.99%) of the dye-sensitized solar cell (DSSC) using the conventional paste method.