• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.3
• /
• pp.472-479
• /
• 2013

We carried out research into an environmentally friendly injection molding process that involves filling the mold with polymer after thin films are fixed into the cavity, without the coating, plating process. Film insert injection molding is a new technique in which molten plastic resin is injected into the cavity after films are precisely attached to the side of the mold wall. In the film insert injection molding process, the insert film is moved by the flow of the molten plastic resin. Overlap defects cause a decline in the productivity and the quality of the manufactured goods. To reduce overlap defects, new injection mold parts are proposed to produce automotive exterior parts using thin films. It is suggested that the best possible method would be to fix the thin films to one side of the mold wall, and develop interior pins to fix the films in the mold. Based on this new pin fixing system, the problem of the film being moved by the flow of the molten resin was improved.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.12
• /
• pp.28-32
• /
• 2010

Technical demands for aspheric glass lens formed in market increases its application from simple camera lens module to fiber optics connection module in optical engineering. WC is often used as a metal core of the aspheric glass lens, but the long life time is issued because it fabricated in high temperature and high pressure environment. High hard thin film coating of lens core increases the core life time critically. Diamond Like Carbon(DLC) thin film coating shows very high hardness and low surface roughness, i.e. low friction between a glass lens and a metal core, and thus draw interests from an optical manufacturing industry. In addition, DLC thin film coating can removed by etching process and deposit the film again, which makes the core renewable. In this study, DLC films were deposited on the SiC ceramic core. The process variable in FVA(Filtered Vacuum Arc) method was the substrate bias-voltage. Deposited thin film was evaluated by raman spectroscopy, AFM and nano indenter and measured its crystal structure, surface roughness, and hardness. After applying optimum thin film condition, the life time and crystal structure transition of DLC thin film was monitored.

• Proceedings of the SAREK Conference
• /
• 2008.06a
• /
• pp.1128-1133
• /
• 2008

Drying process in the thin film layer of sludge with the thickness less than a few millimeters has been investigated using the simple one-dimensional model. Thin film drying is usually used to dry the viscous materials like sewage sludge. The thin film layer of sludge is dried on the metallic surface through which thermal energy is supplied to the layer during drying. In order to solve the equations, the mass transfer rate on the drying surface should be determined. The mass flux of evaporated water vapor on the surface is estimated with the formulation given in the literature. The effect of heating temperature, film thickness, and air velocity on drying has been examined to figure out the drying characteristics of the sludge layer.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.274-274
• /
• 2013

We fabricate encapsulation-layer of OLED panel from organic-inorganic hybrid thin film by atomic layer deposition (ALD) molecular layer deposition (MLD) using Al2O3 as ALD process and Adipoyl Chloride (AC) and 1,4-Butanediamine as MLD process. Ellipsometry was employed to verify self-limiting reaction of MLD. Linear relationship between number of cycle and thickness was obtained. By such investigation, we found that desirable organic thin film fabrication is possible by MLD surface reaction in monolayer scale. Purging was carried out after dosing of each precursor to eliminate physically adsorbed precursor with surface. We also confirmed roughness of the organic thin film by atomic force microscopy (AFM). We deposit AC and 1,4-Butanediamine at $70^{\circ}C$ and investigated surface roughness as a function of increasing thickness of organic thin film. We confirmed precursor's functional group by IR spectrum. We calculated WVTR of organic-inorganic hybrid super-lattice epitaxial layer using Ca test. WVTR indicates super-lattice film can be possibly use as encapsulation in flexible devices.

• Journal of the Semiconductor & Display Technology
• /
• v.5 no.2 s.15
• /
• pp.47-49
• /
• 2006

Various methods of making thin film is being used in semiconductor manufacturing process. The most common method in this field includes CVD(Chemical Vapor Deposition) and PVD(Physical Vapor Deposition). Thin film is deposited on both the backside and the frontside of wafers. The thin film deposited on the backside has poor thickness profile, and can contaminate wafers in the following processes. If wafers with the thin film remaining on the backside are immersed in batch type process tank, the thin film fall apart from the backside and contaminate the nearest wafer. Thus, it is necessary to etch the backside of the wafer selectively without etching the frontside, and chemical injection nozzle positioned under the wafer can perform the backside etching. In this study, the backside chemical injection nozzle with optimized chemical injection profile is built for single wafer tool. The evaluation of this nozzle, performed on $Si_3N_4$ layer deposited on the backside of the wafer, shows the etching rate uniformity of less than 5% at the etching rate of more than $1000{\AA}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.382-383
• /
• 2006

The tungsten bronze type of strontium barium niobate(SBN) thin film was synthesized by metal organic decomposion method for SBN stock solution and the SBN thin film process were deposited by spin-coating process on Pt-deposited si-wafer(100) by magnetron sputtering system. The thickness of SBN thin film was 150~200 nm and were optimized for rpm of spin-coater system. The structural variation of SBN thin film was studied by TG-DTA and XRD. The deposited SBN stock solution on annealing at $400{\sim}800^{\circ}C$ a pure tungsten bronze SBN phase and the corresponding. average grain size about 500~1000 nm influenced by annealing temperature. The piezoelectric properties of prepared SBN thin film, the remanent polarization value(2Pr) and coercive field was $1.2{\mu}C/cm^2$ and 2.15V/cm, respectively.

• Proceedings of the KIEE Conference
• /
• 2006.10a
• /
• pp.103-104
• /
• 2006

$Pb(Zr,Ti)O_3(PZT)$ is very attractive ferroelectric materials for ferroelectric random access memory (FeRAM) applications because of its high polarization ability and low process temperature. However, Chemical Mechanical Polishing (CMP) pressure and velocity must be carefully adjusted because FeRAM shrinks to high density devices. The contaminations such as slurry residues due to the absence of the exclusive cleaning chemicals are enough to influence on the degradation of PZT thin film capacitors. The surface characteristics of PZT thin film were investigated by the change of process parameters and the cleaning process. Both the low CMP pressure and the cleaning process must be employed, even if the removal rate and the yield were decreased, to reduce the fatigue of PZT thin film capacitors fabricated by damascene process. Like this, fatigue characteristics were partially controlled by the regulation of the CMP process parameters in PZT damascene process. And the exclusive cleaning chemicals for PZT thin films were developed in this work.

• Korean Journal of Materials Research
• /
• v.26 no.8
• /
• pp.438-443
• /
• 2016

We developed an Al sputtering process by varying the plasma power, process temperature, and film thickness. We observed an increase of hillock distribution and average diameter with increasing plasma power, process temperature, and film thickness. Since the roughness of a film increases with the increase of the distribution and average size of hillocks, the control of hillock formation is a key factor in the reduction of Al corrosion. We observed the lowest hillock formation at 30 W and $100^{\circ}C$. This growth characteristic of sputtered Al thin films will be useful for the reduction of Al corrosion in the future of the electronic packaging field.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.250-250
• /
• 2009

Thin film of $SnO_2$ was fabricated from plasma enhanced atomic layer deposition technology with bubbler type injector system by using TEMASn (tetrakisethylmethylamino tin) precursor. Mostly crystalline of $SnO_2$ films can be obtained with oxygen plasma and with water at relatively low temperature of $150^{\circ}C$. $SnO_2$ was deposited as an uniform rate of $1.0A^{\circ}$/cycle. In order to obtain uniform film, a seed oxide material was used before TEMASn deposition in ALD process. The process parameters were controlled to obtain dense thin film by atomic deposition methodology. The morphology and characterization of thin film with optimized process condition will be discussed.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2007.04a
• /
• pp.147-148
• /
• 2007

In this study, the technology to grow oriented nanotube thin film from dip-coated $TiO_2$ using hydrothermal method has been successfully developed. The effects of preparation parameters, such as reaction temperature, duration and post treatment conditions on the film morphologies and the adherence to the substrate, have been examined. A general formation mechanism of oriented titanate nanotube thin film is proposed in terms of the detailed observation of the products via two dimensional surface FESEM studies and HRTEM images. The overall formation of $TiO_2-based$ nanotube thin film can be summarized with three successive steps: (1) $TiO_2$ dissolving and amorphous $Na_2TiO_3$ deposition process; (2) layered $Na_2Ti_3O_7$ formation via spontaneous crystallization and rapid growth process; (3) formation of nanotube thin film via $Na_2Ti_3O_7$ splitting and multilayer scrolling process of (100) planes around the c axis of $Na_2Ti_3O_7$.