• 제목/요약/키워드: Thin Film Patterning Process

검색결과 86건 처리시간 0.023초

Multiform Oxide Optical Materials via the Versatile Pechini-type Sol-Gel Process

  • Lin, J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.1247-1250
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    • 2008
  • This presentation highlights work from the authors' laboratories on the various kinds of oxide optical materials, mainly luminescence and pigment materials with different forms (powder, core-shell structures, thin film and patterning) prepared by the Pechini-type sol-gel (PSG) process. The PSG process which uses the common metal salts (nitrates, acetates, chlorides etc) as precursors and citric acid (CA) as chelating ligands of metal ions and polyhydroxy alcohol (such as ethylene glycol or poly ethylene glycol) as cross-linking agent to form a polymeric resin on molecular level, allowing the preparation of many forms of luminescent materials.

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Templated solid-state dewetting of thin films

  • 예종필
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.54.2-54.2
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    • 2012
  • Solid-state dewetting of thin films is a process through which continuous solid films decay to form islands. Dewetting of thin films has long been a critical issue in microelectronics and much effort has been made to prevent the process and enhance the stability of films. On the other hand, dewetting has also been purposely induced to create arrays of particles and other structures for applications, including plasmonic structures and catalysts for growing nanotube and nanowire. We have investigated ways of producing regular structures via templated dewetting of thin films. Mainly, two different approaches have been used in our works to template dewetting of thin films: periodic topographical templating and planar patterning of epitaxially-grown films. Dewetting of topographically-patterned thin films results in the formation of nanoparticle arrays with spatial and crystallographic orders. Morphological evolution during templated-dewetting of single crystal films occurs in deterministic ways because of geometric and crystallographic constraints, and leads to the formation of regular structures with smaller sizes and more complex shapes than the initial patches. These results will be reviewed in this presentation.

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레이저를 이용한 차세대 평판 디스플레이 공정 (Laser Microfabrications for Next-Generation Flat Panel Display)

  • 김광열
    • 한국재료학회지
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    • 제17권7호
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    • pp.352-357
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    • 2007
  • Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

연마제 첨가를 통한 BTO Film의 CMP (CMP of BTO Thin Films using Mixed Abrasive slurry)

  • 김병인;이기상;박정기;정창수;강용철;차인수;정판검;신성헌;고필주;이우선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 영호남 합동 학술대회 및 춘계학술대회 논문집 센서 박막 기술교육
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    • pp.101-102
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    • 2006
  • BTO ($BaTiO_3$) thin film is one of the high dielectric materials for high-density dynamic random access memories (DRAMs) due to its relatively high dielectric constant, It is generally known that BTO film is difficult to be etched by plasma etching, but high etch rate with good selectivity to pattern mask was required. The problem of sidewall angle also still remained to be solved in plasma etching of BTO thin film. In this study, we first examined the patterning possibility of BTO film by chemical mechanical polishing (CMP) process instead of plasma etching. The sputtered BTO film on TEOS film as a stopper layer was polished by CMP process with the sell-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS). respectively. The removal rate of BTO thin film using the $BaTiO_3$-mixed abrasive slurry ($BaTiO_3$-MAS) was higher than that using the $TiO_2$-mixed abrasive slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%.

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UV를 사용한 SAMs 패터닝과 PEDOT의 선택적 증착에 관한 연구 (Patterning of poly(3,4-ethylenedioxythiophene)(PEDOT) Thin Films by Using Self-assembled Monolayers(SAMs) Patterns Formed by Ultra-violet(UV) Lithography)

  • 권태욱;이정길;이재갑
    • 한국재료학회지
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    • 제16권10호
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    • pp.619-623
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    • 2006
  • Selective vapor deposition of conductive poly(3,4-ethylenedioxythiophene) (PEDOT), thin films has been carried out on self assembled monolayers patterned oxide substrate. Since the 3,4-ethylenedioxythiophene(EDOT) monomer can be polymerized only in the presence of oxidant such as $FeCl_3$, the PEDOT thin film is selectively deposited on patterned $FeCl_3$, which only adsorbs on the partly removed SAMs region due to the inability of $FeCl_3$ to adsorb on SAMs. Therefore, the partly removed SAMs can act as an adsorption layer for the $FeCl_3$ and also as a glue layer for the deposition of PEDOT, resulting in the significantly increased adhesion of PEDOT to $SiO_2$ substrate. The use of UV lithography and Cr patterned quartz mask provided the formation of SAMs patterns on oxide substrates, which allowed for the selective deposition of conductive PEDOT thin films.$^{oo}The$ new process was successfully developed for the selective deposition of PEDOT thin films on SAMs patterned oxide substrate, providing a new way for the patterning of vapor phase deposition of PEDOT thin films with accurate alignment and addressing the inherent adhesion issues between PEDOT and dielectrics.

직접패턴형 SnO2 박막의 전도성 나노구조체 첨가연구 (Direct-Patternable SnO2 Thin Films Incorporated with Conducting Nanostructure Materials)

  • 김현철;박형호
    • 한국재료학회지
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    • 제20권10호
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    • pp.513-517
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    • 2010
  • There have been many efforts to modify and improve the properties of functional thin films by hybridization with nano-sized materials. For the fabrication of electronic circuits, micro-patterning is a commonly used process. For photochemical metal-organic deposition, photoresist and dry etching are not necessary for microscale patterning. We obtained direct-patternable $SnO_2$ thin films using a photosensitive solution containing Ag nanoparticles and/or multi-wall carbon nanotubes (MWNTs). The optical transmittance of direct-patternable $SnO_2$ thin films decreased with introduction of nanomaterials due to optical absorption and optical scattering by Ag nanoparticles and MWNTs, respectively. The crystallinity of the $SnO_2$ thin films was not much affected by an incorporation of Ag nanoparticles and MWNTs. In the case of mixed incorporation with Ag nanoparticles and MWNTs, the sheet resistance of $SnO_2$ thin films decreased relative to incorporation of either single component. Valence band spectral analyses of the nano-hybridized $SnO_2$ thin films showed a relation between band structural change and electrical resistance. Direct-patterning of $SnO_2$ hybrid films with a line-width of 30 ${\mu}m$ was successfully performed without photoresist or dry etching. These results suggest that a micro-patterned system can be simply fabricated, and the electrical properties of $SnO_2$ films can be improved by incorporating Ag nanoparticles and MWNTs.

로이유리의 전도성 금속박막을 이용한 발열유리 제작에 관한 연구 (A study on the fabrication of heatable glass using conductive metal thin film on Low-e glass)

  • 오재곤
    • 한국산학기술학회논문지
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    • 제19권1호
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    • pp.105-112
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    • 2018
  • 본 논문은 로이유리(Low emissivity glass) 표면에 증착되어 있는 금속박막의 전도 특성을 이용하여 발열유리(Heatable glass)를 제작하는 방법에 대해 제안한다. 로이유리의 발열량은 로이유리 표면저항에 의한 주울(Joule) 열에 의존하므로 소재의 표면저항을 측정함으로써 예측 및 설계가 가능하다. 본 연구에서는 저방사층이 11nm인 소프트로이유리 시료에 각 50mm 간격으로 은(Ag) 전극을 형성시키고, 4단자법으로 면저항을 측정하여 로이유리의 소비전력과 발열량을 예측한 후에, 제작 및 실험을 통해 발열성능을 확인하였다. 기존의 발열유리 제작방법은 크게 두 가지로 일반유리(Normal glass)에 니크롬(Nichrome) 열선을 삽입하는 방법과, 일반유리에 전도성 투명박막을 증착하는 방법이 있다. 니크롬 열선 삽입 방식은 발열성능은 우수하나 유리 고유의 투명성을 저해하고, 전도성 투명박막을 증착하는 방법은 투명성은 양호하나 공정이 복잡하여 실용성이 저하된다. 본 논문에서는 주로 건축물의 단열효과 향상을 위해 사용되는 로이유리를 이용하여 로이유리 전면에 코팅되어 있는 전도성 금속박막에 레이저 빔을 조사하여 원하는 발열성능을 가지는 발열유리를 제작하는 방법을 제안한다. 제안된 방법은 기존의 니크롬 열선을 삽입하는 방법에 비해 투명성이 양호하고, 전도성 투명박막을 증착하는 방법에 비해 제작과정이 보다 수월함을 확인하였다. 아울러, 레이저를 조사하여 로이유리의 표면 박막을 패터닝(Patterning) 하는 형태에 따른 발열특성의 비교와 로이유리에 적합한 레이저 출력조건을 제시하고자 한다.

LIFT 방법에 의한 전도성 미세 패터닝 공정 연구 (Micro patterning of conductor line by laser induced forward transfer(LIFT))

  • 이제훈;한유희
    • 한국레이저가공학회지
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    • 제2권3호
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    • pp.52-61
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    • 1999
  • The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

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Fabrication of Infrared Filters for Three-Dimensional CMOS Image Sensor Applications

  • Lee, Myung Bok
    • Transactions on Electrical and Electronic Materials
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    • 제18권6호
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    • pp.341-344
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    • 2017
  • Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

탄성 몰드 변형을 이용한 은 이온 잉크의 원-스텝 나노스케일 패터닝 (One-Step Nanoscale Patterning of Silver Ionic Ink via Elastic Mold Deformation)

  • 오용석
    • 센서학회지
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    • 제32권4호
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    • pp.252-256
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    • 2023
  • A one-step method for nanoscale patterning of silver ionic ink on a substrate is developed using a microscale, elastic mold deformation. This method yields unique micro/nanoscale metallic structures that differ from those produced using the original molds. The linewidth of these metallic structures is significantly reduced (approximately 10 times) through the sidewall deformation of the original mold cavity on a thin liquid film, as verified by finite element analysis. The process facilitates the fabrication of various, isolated and complex micro/nanoscale metallic structures with negligible residual layers at low cost and high throughput. These structures can be utilized for various applications, including optoelectronics, wearable sensors, and metaverse-related devices. Our approach offers a promising tool for manipulation and fabrication of micro/nanoscale structures of various functional materials.