• 한국세라믹학회지
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• 제46권2호
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• pp.175-180
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• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권6호
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• pp.297-301
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• 2006

In the present work, we investigate the characteristics of new composition material, chalcogenide $Ge_1Se_1Te_2$ material in order to overcome the problems of conventional PRAM devices. The Tc of $Ge_1Se_1Te_2$ bulk was measured $231.503^{\circ}C$ with DSC analysis. For static DC test mode, at low voltage, two different resistances are observed. depending on the crystalline state of the phase-change resistor. In the first sweep, the as-deposited amorphous $Ge_1Se_1Te_2$ showed very high resistance. However when it reached the threshold voltage(about 11.8 V), the electrical resistance of device was drastically reduced through the formation of an electrically conducting path. The phase transition between the low conductive amorphous state and the high conductive crystal]me state was caused by the set and reset pulses respectively which fed through electrical signal. Set pulse has 4.3 V. 200 ns. then sample resistance is $80\sim100{\Omega}$. Reset pulse has 8.6 V 80 ns, then the sample resistance is $50{\sim}100K{\Omega}$. For such high resistance ratio of $R_{reset}/R_{set}$, we can expect high sensing margin reading the recorded data. We have confirmed that phase change properties of $Ge_1Se_1Te_2$ materials are closely related with the structure through the experiment of self-heating layers.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.623-627
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• 1999

We report a new in-situ fluorine passivation method without in implantation by employing excimer laser annealing of $SiO_{x}F_{y}$/a-Si structure and its effects on p-channel poly-Si TFTs. The proposed method doesn't require any additional annealing step and is a low temperature process because fluorine passivation is simultaneous with excimer-laser-induced crystallization. A in-situ fluorine passivation by the proposed method was verified form XPS analysis and conductivity measurement. From experimental results, it has been shown that the proposed method is effective to improve the electrical characteristics, specially field-effect mobility, and the electrical stability of p-channel poly-Si TFTs. The improvement id due to fluorine passivation, which reduces the trap state density and forms the strong Si-F bonds in poly-Si channel and $SiO_2/poly-Si$ interface. From these results, the high performance poly-Si TFTs canbe obtained by employing the excimer-laser-induced fluorine passivation method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1424-1426
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• 1997

저전압 구동이 가능한 교류구동형 박막전기발광소자를 구현하기 위해 높은 유전상수를 가지며 특히 광학적 굴절률이 발광박막과 유사하여 광학적 특성 개선에도 효과적인 것으로 알려져 있는 $Ta_2O_5$를 제조하였다. $Ta_2O_5$박막은 rf-magnetron sputtering방법으로 형성하였으며 기판온도, working pressure, 박막의 두께에 따른 전기적인 특성을 조사하였다. 10mTorr에서 제조된 $Ta_2O_5$박막은 $22{\sim}26$의 비유전율을 보였고, 유전손실은 $0.007{\sim}0.03(1kHz{\sim}10kHz)$의 값을 보였다. $100^{\circ}C$에서 제조된 박막의 전하저장용량은 $7.9{\mu}C/cm^2$이었다. 제조된 박막의 항복전압은 인가 전압의 극성에 의존하며, 전류특성은 기판온도와 200nm와 300nm의 두께에서는 $V^{1.95}{\sim}V^{2.35}$에 비례하는 space charge limited current특성을 보였고, 400nm에서는 Poole Frenkel특성을 보였다. 이상의 결과로 TFEL소자에 응용에 적합한 $Ta_2O_3$ 박막은 $200^{\circ}C$에서 증착되고 200nm와 300nm인 것으로 나타났으며, 제조된 MIS구조(ITO-$Ta_2O_5$-ZnS-Al)의 ACTFEL소자에서의 전도전하는 각각 $13uC/cm^2$, $8.3uC/cm^2$로 조사되었다.

• 한국세라믹학회지
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• 제40권1호
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• pp.77-80
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• 2003

수용액 내에서 질화물 박막의 산화저항성 흡착 피막의 형성을 확인하기 위하여 Si$_3$N$_4$분말 표면의 glycine 흡착 거동을 조사하였다. 염기성분위기에서 glycine은 Si$_3$N$_4$ 분말 표면에 포화 흡착되었으며 이러한 흡착거동은 Si$_3$N$_4$ 박막의 경우에도 동일하게 일어날 것으로 예상되었다. Glycine을 첨가한 CeO$_2$ 슬러리를 제조하고 PH에 따른 Si$_3$N$_4$와 SiO$_2$ 박막의 연마시험을 수행하여 연마율은 감소하고 선택비는 증가하는 것을 확인하였다. 실험에서 얻은 최대 선택비는 pH=12에서 35 이상이었다. 이는 염기성 분위기에서 glycine이 해리하여 막 표면에 화학흡착하고 산화와 용해를 억제함으로써 연마율을 낮추고 선택비 향상에 기여하였기 때문으로 판단된다. 아미노산 계열의 첨가제를 CeO$_2$계 CMP용 슬러리에 적용하는 경우 산화물/질화물 박막의 선택비를 향상시키는데 효과적임을 확인하였다.

• 한국재료학회지
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• 제23권3호
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• pp.183-189
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• 2013

$Cu_2ZnSn(S,Se)_4$ material is receiving an increased amount of attention for solar cell applications as an absorber layer because it consists of inexpensive and abundant materials (Zn and Sn) instead of the expensive and rare materials (In and Ga) in $Cu(In,Ga)Se_2$ solar cells. We were able to achieve a cell conversion efficiency to 4.7% by the selenization of a stacked metal precursor with the Cu/(Zn + Sn)/Mo/glass structure. However, the selenization of the metal precursor results in large voids at the absorber/Mo interface because metals diffuse out through the top CZTSe layer. To avoid the voids at the absorber/Mo interface, binary selenide compounds of ZnSe and $SnSe_2$ were employed as a precursor instead of Zn and Sn metals. It was found that the precursor with Cu/$SnSe_2$/ZnSe stack provided a uniform film with larger grains compared to that with $Cu_2Se/SnSe_2$/ZnSe stack. Also, voids were not observed at the $Cu_2ZnSnSe_4$/Mo interface. A severe loss of Sn was observed after a high-temperature annealing process, suggesting that selenization in this case should be performed in a closed system with a uniform temperature in a $SnSe_2$ environment. However, in the experiments, Cu top-layer stack had more of an effect on reducing Sn loss compared to $Cu_2Se$ top-layer stack.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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• pp.36-41
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• 2011

BIPV system that can alternate building envelope by making materials of PV module should be considered in initial design step for applying PV system efficiently in office building. Mean while, area of the building skin also increases as the number of floors increases, but the valid area that can apply BIPV system in effect decreases relatively. Despite of this weak point, installing BIPV system is still being evaluated as the only measure left that can reduce electronic energy consumption in the building. Therefore, the impact on building energy consumption according to the increase of the number of floors when BIPV system is applied in the building was analyzed. And it will be used as basic information for application of BIPV in office building. Conomic about application of BIPV is interpreted to be secured within the 10 story high. Forover the 11 floors, the methods of increasing the contribution ratio produced by BIPV system through the optimization of install angle and increase in install area of south, high efficiency should be considered. The ways to reduce basic load by integrated design with another renewable energy besides BIPV should be found. Later, the study on the total building energy comsumption with PV generation according to the various type of the basic load and ratio of the width and depth will be performed based on this study.

• 한국광학회지
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• 제31권4호
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• pp.169-175
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• 2020

격자의 구조가 간단하고 격자의 대조비가 낮은 SBC 시스템 구성을 위한 무편광 유전체 다층박막 회절격자를 설계하였다. SBC 방법으로 결합한 빔의 빔 품질을 높게 유지하기 위하여 회절격자의 파면 왜곡이 최소화되는 구조를 제안하였으며, 오염에 의한 흡수가 발생하지 않고 회절격자를 제작할 수 있는 구조로 회절격자를 최적화 설계하였다. 설계된 회절격자는 1055 nm 중심파장에서 Littrow 각도로 입사하는 경우 무편광 -1차 회절 효율이 99.36%이었으며, 96% 이상의 무편광 회절 효율을 나타내는 공정 여분이 확보되어 있음을 확인하였다.

• 대한화학회지
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• 제37권12호
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• pp.1019-1024
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• 1993

상온에서 다결정 니켈 표면에서의 CO와 산소의 공동흡착을 XPS를 이용하여 연구하였다. 산소가 미리 흡착된 다결정 니켈 표면에서의 CO 흡착은 다음의 세 단계로 일어나고 있음을 발견하였다. 즉 초기의 낮은 CO 노출량에서는 니켈 표면에 미리 흡착된 산소와 CO가 일부 반응하여 $CO_2$가 형성되어 $CO_2$로 탈착하며, CO 노출량이 점차적으로 증가함에 따라 CO가 산소와 공동흡착을 일으키며, CO 노출량이 높아지면 미리 흡착된 산소의 양이 적을수록 더 많은 CO가 흡착됨을 관측하였다. 이것은 니켈 표면에 미리 존재하는 산소의 덮임율이 증가함에 따라 CO의 점차율이 감소하고 동시에 CO의 상대적인 흡착자리가 감소하기 때문으로 해석하였다. 한편 CO가 미리 흡착된 다결정 니켈 표면에 산소를 흡착시키면 산소 노출량이 낮을 때는 미리 흡착된 CO가 산소의 흡착을 저해하며, 산소 노출량이 증가하면 CO가 해리흡착되고, 이와 동시에 산소가 니켈 표면에서 해리흡착되어 NiO층을 빠른 속도로 형성함을 관측하였다. CO의 해리흡착은 흡착된 CO와 기체상의 $O_2$의 충돌에 의한 에너지 전이 때문인 것으로 해석된다.

• Corrosion Science and Technology
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• 제17권4호
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• pp.154-165
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• 2018

During the process of sulfur dioxide removal, flue gas desulfurization equipment provides a serious internal corrosion environment in creating sulfuric acid dew point corrosion. Therefore, the utilities must use the excellent corrosion resistance of steel desulfurization facilities in the atmosphere. Until now, the trend in developing anti-sulfuric acid steels was essentially the addition of Cu, in order to improve the corrosion resistance. The experimental alloy used in this study is Fe-0.03C-1.0Mn-0.3Si-0.15Ni-0.31Cu alloys to which Ru, Zn and Ta were added. In order to investigate the effect of $H_2SO_4$ concentration and the alloying elements, chemical and electrochemical corrosion tests were performed. In a low concentration of $H_2SO_4$ solution, the major factor affecting the corrosion rate of low alloy steels was the exchange current density for $H^+/H_2$ reaction, while in a high concentration of $H_2SO_4$ solution, the major factors were the thin and dense passive film and resulting passivation behavior. The alloying elements reducing the exchange current density in low concentration of $H_2SO_4$, and the alloying elements decreasing the passive current density in high concentration of $H_2SO_4$, together play an important role in determining the corrosion rate of Cu-bearing low alloy steels in a wide range of $H_2SO_4$ solution.