• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.563-565
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• 2009

We introduce the new modification approaches of photocrosslinkable poly (4-vinylphenol) (PVP) for low hysteresis organic thin film transistors (OTFTs). The dielectric layers were composed of different PVP resin, low molecular melamine, and halogen free photo-initiator. The low hysteresis OTFT from one of the organic gate dielectrics has been realized. The electrical performance of low hysteresis OTFT with photocrosslinkable PVP exhibited a field-effect mobility of 0.2 cm2/Vs, a threshold voltage of - 0.04V, hysteresis of 0.4V.

• 한국정밀공학회지
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• 제21권6호
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• pp.15-21
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• 2004

반도체 제조산업과 나노, 바이오 산업의 비약적 발전에 따라 게이트 산화막(gate oxide)과 같이 반도체 제조공정에서 사용되는 유전체 박막(dielectric film)의 두께는 수 $\mu\textrm{m}$에서 수 nm 에 이르기까지 다양할 뿐 아니라 얇아지고 있으며, 또한 이러한 박막들이 다층으로 복잡하게 적층된 다층 박막의 응용이 높아지는 추세이다. 따라서, 반도체 및 광통신 소자, 발광소자, 바이오 칩 어레이 등과 같은 나노박막을 이용하는 산업에서는 박막의 두께 측정을 더욱 정확하고, 보다 빠르며 효율적으로 측정할 수 있는 박막 두께 측정용 계측기가 요구된다.(중략)

• 센서학회지
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• 제4권2호
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• pp.58-63
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• 1995

$SiH_{4}$와 $NH_{3}$의 RF 글로우방전 분해에 의한 PECVD법으로 a-SiNx:H박막을 제조하고 기판온도, RF 전력, 그리고 $NH_{3}/SiH_{4}$ 유량비 등의 변화에 따른 a-SiNx:H 박막의 유전상수와 광학적 밴드갭 등을 조사하였다. a-SiNx:H막의 유전상수와 광학적 밴드갭은 기판온도, RF 전력 및 $NH_{3}/SiH_{4}$ 유량비 등의 증착변수에 따라 크게 변화하였다. 기판온도가 증가할수록 a-SiNx:H막의 유전상수는 증가하였으며 광학적 밴드갭은 감소하였다. 기판온도, RF 전력, 가스압력, $NH_{3}/SiH_{4}$ 유량비 및 두께를 각각 $250^{\circ}C$, 20 W, 500 mTorr, 10 및 $1500\;{\AA}$로 하였을 때 a-SiNx:H막의 유전상수, 절연파괴전장 및 광학적 밴드갭은 각각 4.3, 1 MV/cm 및 2.9 eV로 나타났다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.117-120
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• 2004

The dielectric and piezoelectric properties of silver doped $Pb(Zr,Ti)O_3-Pb(Mn,W,Sb,Nb)O_3$ ceramics was examined. By varying the contents of silver(0.0, 0.4, 1.0 mol%), the effect of doped silver on PZT-PMWSN thin film was investigated at various sintering temperature(900, 1000, $1100^{\circ}C$). As increasing silver contents, the relative dielectric constant is increased and sinterbility is enhanced. At the specimen with 0.4 mol% Ag and sintered at $1100^{\circ}C$, electromechanical coupling factor(kp), mechanical quality factor(Qm), dielectric constant(${\varepsilon}r$) and dielectric loss were 0.502, 811, 991, 0.006, respectively. The results show that the PZT-PMWSN/Ag composites have enhanced piezoelectic and dielectric properties and processing condition is improved.

• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.610-615
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• 2022

BaTiO₃ is one of the ferroelectric materials with excellent dielectric properties such as high dielectric constant, low dielectric loss, and is widely used for the manufacturing of capacitors, piezoelectric converters, microsensors, and ferroelectric memories. Inkjet printing is a technology which uses digital and contactless methods which significantly improves flexibility associated with material and structural design, reducing manufacturing costs. Therefore, the top and bottom electrodes, BaTiO₃ ink, and photocurable resin were all printed by an inkjet to produce a BaTiO₃ capacitor. The properties of the printed thin film were analyzed. It was confirmed that the photocurable resin ink was well-infiltrated between the BaTiO₃ powder particles printed by inkjet. The dielectric properties of the capacitor such as dielectric constant which varies in accordance with frequency, polarization and tunability that changes with voltage, were measured.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권4호
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• pp.159-163
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• 2003

ln this work, we studied electrical characteristics and leakage current mechanism of $Ta_2O_{5}$ MOS(Metal-Oxide-Semiconductor) devices. $Ta_2O_{5}$ thin film (63 nm) was deposited by ALD(Atomic Layer Deposition) method at temperature of 235 $^{\circ}C$. The structures of the $Ta_2O_{5}$ thin films were examined by XRD(X-Ray Diffraction). From XRD, it is found that the structure of $Ta_2O_{5}$ is single phase and orthorhombic. From capacitance-voltage (C-V) anaysis, the dielectric constant was 19.4. The temperature dependence of current density-electric field (J-E) characteristics of $Ta_2O_{5}$ thin film was studied at temperature range of 300 - 423 K. In ohmic region (<0.5 MV/cm), the resistivity was 2.456${\times}10^{14}$ ($\omega{\cdot}cm$ at 348 K. The Schottky emission is dominant at lower temperature range from 300 to 323 K and Poole-Frenkel emission is dominant at higher temperature range from 348 to 423 K.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.391-391
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• 2010

The stability enhancement of Znic oxide thin film transistor deposited by PLD-DBD has been reported here using the bias temperature stress test. Znic oxide (ZnO) thin films were deposited on $SiO_2$/Si (100) by pulsed laser deposition method with and without dielectric barrier discharge (DBD) method. The DBD is the efficient method to adopt the nitrogen ions into the thin films. The TFT characteristics of ZnO TFTs with and without Nirogen (N) doping show similar results with $I_{on/off}$ of $10^5{\sim}10^6$. However. the bias temperature stress (BTS) test of N-doped ZnO TFT with DBD shows higher stability than that of ZnO TFT.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.41-46
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• 2002

In this work, we studied electrical characteristics and leakage current mechanism of Au/$Ta_2O_5$/Si metal-oxide-semiconductor (MOS) devices. $Ta_2O_5$ thin film (63nm) was deposited by atomic layer deposition (ALD) method at temperature of $235^{\circ}C$. The structures of the $Ta_2O_5$ thin films were examined by X-Ray Diffraction (XRD). From XRD, the structure of $Ta_2O_5$ was single phase and orthorhombic. From capacitance-voltage (C-V) analysis, the dielectric constant was 19.4. The temperature dependence of current-voltage (I-V) characteristics of $Ta_2O_5$ thin film was studied from 300 to 423 K. In ohmic region (<0.5 MVcm${-1}$), the resistivity was $2.4056{\times}10^{14}({\Omega}cm)$ at 348 K. The Schottky emission is dominant in lower temperature range from 300 to 323 K and Poole-Frenkel emission dominant in higher temperature range from 348 to 423 K.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.94-98
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• 2000

Polycrystalline SBTN ferroelectric thin films were prepared by sol-gel method with various Nb mole ratios on Pt/ $SiO_2$/Si (100) substrates. The films were annealed at different temperatures and characterized in terms of phase and microstructure. Relatively a well saturated hysteresis pattern was obtained at x =0.2 in S $r_{0.8}$B $i_{2.3}$(T $a_{1-x}$ N $b_{x}$)$_2$ $O_{9+}$$\alpha$/ thin films. At an applied voltage of 5V, the dielectric constant ($\varepsilon$$_{r}$) and dissipation factor (tan $\delta$) of typical S $r_{0.8}$B $i_{2.3}$(T $a_{1-x}$ N $b_{x}$)$_2$ $O_{9+}$$\alpha$/ thin film (x=0.2) were about 236.2 and 0.034. Measured remanent polarization (2Pr) and coercive field (Ec) were 4.28C/c $m_2$, and 38.88kv/cm respectively. No fatigue was observed up to 6$\times$10$_{10}$ switching cycles at 5V and the normalized polarization reduced by a factor of only 4%.%. 4%.%. 4%.%.%.%.%.

• 한국재료학회지
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• 제9권8호
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• pp.825-830
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• 1999

FTES/$O_2$-PECVD 방법에 의하여 증착된 SiOF 박막의 특성을 FT-IR, SPS, 그리고 ellipsometry로 분석하였다. 유전상수, breakdown field와 누설전류 밀도는 MIS(Au/SiOF/p-Si) 구조로 형성하여 C-V와 I-V특성곡선으로부터 측정하였다. SiOF박막의 step-coverage는 SEM 단면사진으로 조사하였다. FTES와 $O_2$의 유량을 각각 300sccm으로 반응로에 주입하였을 때 양질의 SiOF 박막이 형성되었다. 형성된 박막의 유전상수는 3.1로서 다른 산화막보다 더 낮은 값으로 나타났다. breakdown field와 누설전류밀도는 약 10MV/cm와 $8{\times}10^{9}A/\textrm{cm}^2$로 측정되었다. $0.3{\mu}{\textrm}{m}$ 금속 패턴에 $2500{\AA}$의 두께로 증착된 SiOF 박막은 전극간에 void가 없이 우수한 덮힘을 보였다.