• 제목/요약/키워드: Thickness reduction

검색결과 1,457건 처리시간 0.028초

옥상녹화조성에 따른 온도저감효과에 관한 연구 -서울대학교 실험구를 중심으로- (The Effect of Temperature Reduction as Influenced by Rooftop Greening)

  • 이동근;윤소원;오승환;장성완
    • 한국환경복원기술학회지
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    • 제8권6호
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    • pp.34-44
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    • 2005
  • The objective of this study is to analyze the thermal properties of various green roof type. The experimental districts, have different soil thickness, soil type, the existence of module and the different kinds of vegetation, had installed. A measurement was conducted in Seoul University to investigate the thermal impacts of rooftop greening. The measurement point of temperature were 30, located in soil surface, middle of the soil layer, under the module, hard surface and soffit surface of each experimental district. The experimental investigation lasted from 6th August to 29th August, a total of 24 days. The results showed that green roof can contribute thermal benefits by soil and vegetation and reduce building energy consumption by a role of insulation. It's also better to make soil thickness over 20cm and various vegetation that should be more effective. The district installed only soil also could be effective for reducing the temperature of roof surface. Therefore, the increase of soil thickness and various vegetation could reduce more temperature of roof surface and building energy consumption. Also, it's helpful to reduce temperature that plant coverage rate be raised.

Critical Shoulder Height of Raceway in Ball Bearing Considering Elastohydrodynamic Lubrication

  • Kim, Kyeongsoo;Kim, Taewan
    • Tribology and Lubricants
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    • 제38권6호
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    • pp.281-286
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    • 2022
  • In this study, the effects of Elasto-hydrodynamic lubrication pressure on the critical shoulder height of raceway in an angular contact ball bearing were investigated. Both 3D contact analyses using an influence function and the EHL analysis were conducted for the contact geometry between the ball and raceways. The pressure distributions by 3D contact analysis and EHL analysis for an example bearing were compared. The effect of ellipse truncation on the minimum film thickness also investigated from EHL analysis. The critical shoulder height in the dry contact and the EHL state were compared for various applied loads. It is shown that when the ellipse truncation occurs, the pressure spike for the EHL conjunction is higher than that for the dry contact, and its location moves more inward of the contact center. The steep pressure gradients would increase the flow rate, so in order to maintain flow continuity a significant reduction in film thickness and an abrupt rise in pressure occurs in the edge of shoulder. Significant reduction of the minimum film thickness occurs near the edge of shoulder. The critical shoulder heights in the EHL state are calculated as higher values compared with in the dry contact. This results shows that the determination of critical shoulder height by the EHL analysis is more proper.

스퍼터링법으로 제조된 Pd-doped $SnO_2$ 박막의 수소가스 감도 특성 (The Hydrogen Gas Sensing Characteristics of the Pd-doped $SnO_2$ Thin Films Prepared by Sputtering)

  • 차경현;김영우;박희찬;김광호
    • 한국세라믹학회지
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    • 제30권9호
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    • pp.701-708
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    • 1993
  • Pd-doped SnO2 thin films for hydrogen gas sensing were fabricated by reactive fo magnetron sputtering and were studied on effects of film thickness and Pd doping content. Pd doping caused the optimum sensor operation temperature to reduce down to ~25$0^{\circ}C$ and also enhanced gas sensitivity, compared with undoped SnO2 film. Gas sensitivity depended on the film thickness. The sensitivity increased with decreasing the film thickness, showing maximum sensitivities at the thickness of 730$\AA$ and 300~400$\AA$ for the undoped SnO2 and the Pd-doped SnO2 film, respectively. Further decrease of the film thickness beyond these thickness ranges, however, resulted in the reduction of sensitivity again.

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박형 결정질 실리콘 태양전지에서의 휨현상 감소를 위한 알루미늄층 두께 조절 (Bow Reduction in Thin Crystalline Silicon Solar Cell with Control of Rear Aluminum Layer Thickness)

  • 백태현;홍지화;임기조;강기환;유권종;송희은
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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    • pp.108-112
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    • 2012
  • Crystalline silicon solar cell remains the major player in the photovoltaic marketplace with 90 % of the market, despite the development of a variety of thin film technologies. Silicon's excellent efficiency, stability, material abundance and low toxicity have helped to maintain its position of dominance. However, the cost of silicon photovoltaic remains a major barrier to reducing the cost of silicon photovoltaics. Using the crystalline silicon wafer with thinner thickness is the promising way for cost and material reduction in the solar cell production. However, the thinner thickness of silicon wafer is, the worse bow phenomenon is induced. The bow phenomenon is observed when two or more layers of materials of different temperature expansion coefficiencies are in contact, in this case silicon and aluminum. In this paper, the solar cells were fabricated with different thicknesses of Al layer in order to reduce the bow phenomenon. With lower paste applications, we observed that the bow could be reduced by up to 40% of the largest value with 130 micron thickness of the wafer even though the conversion efficiency decrease of 0.5 % occurred. Since the bowed wafers lead to unacceptable yield losses during the module construction, the reduction of bow is indispensable on thin crystalline silicon solar cell. In this work, we have studied on the counterbalance between the bow and conversion efficiency and also suggest the formation of enough back surface field (BSF) with thinner Al paste application.

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TiNi계 형상기억합금 선재의 냉간압연 및 열처리 특성 (Cold Rolling and Heat Treatment Characteristics of TiNi Based Shape Memory Wire)

  • 김록형;김희수;장우양
    • 열처리공학회지
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    • 제30권6호
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    • pp.251-257
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    • 2017
  • The effect of annealing temperature on the martensitic transformation behavior, tensile deformation chracteristics and shape recovery etc., has been studied in TiNi based shape memory ribbon fabricated by coldrolling of wire. TiNi based shape memory wire (${\phi}=500{\mu}m$) of which structure is intermetallic compound could be cold-rolled without process annealing up to the reduction rate in thickness of 50%, but a few cracks appear in cold-rolled ribbon in the reduction rate in thickness of 65%. The $B2{\rightarrow}R{\rightarrow}B19^{\prime}$ martensitic transformation or $B2{\rightarrow}B19^{\prime}$ martensitic transformation occurs in annealing conditions dissipating lattice defects introduced by coldrolling. However, in case of higher reduction rate or lower annealing temperature, martensitic transformation in cold-rolled and then annealed ribbons does not occur. The maximum shape recovery rate of cold-rolled ribbons with the reduction rate of 35 and 65% could be achieved at annealing temperatures of 250 and $350^{\circ}C$, respectively. The shape recovery rate seems to be related to the stress level of plateau region on stress-strain curve.

Improvement in engineering properties of subgrade soil due to stabilization and its effect on pavement response

  • Nagrale, Prashant P.;Patil, Atulya P.
    • Geomechanics and Engineering
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    • 제12권2호
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    • pp.257-267
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    • 2017
  • This paper presents laboratory investigation of stabilization of subgrade soil. One type of soil and three types of stabilizers i.e., hydrated lime, class F fly ash and polypropylene fibres are selected in the study. Atterberg limit, compaction, california bearing ratio (CBR), unconfined compressive strength and triaxial shear strength tests are conducted on unstabilized and stabilized soil for varying percentage of stabilizers to analyze the effect of stabilizers on the properties of soil. Vertical compressive strains at the top of unstabilized and stabilized subgrade soil were found out by elasto-plastic finite element analysis using commercial software ANSYS. Strategy for design of optimum pavement section was based on extension in service life (TBR) and reduction in layer thickness (LTR). Extension in service life of stabilized subgrade soil is 6.49, 4.37 and 3.26 times more due to lime, fly ash and fibre stabilization respectively. For a given service life of the pavement, there is considerable reduction in layer thicknesses due to stabilization. It helps in reduction in construction cost of pavement and saving in natural resources as well.

공기윤활에 의한 액화천연가스운반선의 마찰저항저감 평가 및 공기 분사부 배치에 대한 연구 (Study on the Evaluation of Frictional Drag Reduction by Air Lubrication and the Arrangement of Air Injection Parts for a Liquefied Natural Gas Carrier)

  • 김희택;김형태;김현조;김정중
    • 대한조선학회논문집
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    • 제58권3호
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    • pp.144-157
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    • 2021
  • Brake Horse Power (BHP) reduction ratios by air injection to the underside of the hull surface in an actual ship are predicted using an unstructured finite-volume CFD solver and compared with the sea trial results. In addition, air lubrication system installed on the existing vessel is investigated to find a good solution for additional drag reduction. As a results, it is found that the thickness of the air layer should be minimized within a stable range while securing the area covered by the air layer as much as possible. Furthermore, the amount of frictional drag reduced by air injection is found to be independent of surface roughness and still effective on rough surface. Based on the results of this study, it is expected that systematic and reliable air lubrication system can be designed and evaluated using the proposed method.

6 MeV 전자선 치료 시 차폐물질로서 알루미늄, 구리, 납 (Aluminum, Copper and Lead as Shielding Materials in 6 MeV Electron Therapy)

  • 이승훈;차석용;이선영
    • 한국콘텐츠학회논문지
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    • 제14권2호
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    • pp.457-466
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    • 2014
  • 고 에너지 전자선 치료에 있어서 차폐물질은 종양조직 외 정상조직이나 주요장기를 보호하기 위해 사용된다. 하지만 이러한 물질에서 발생되어지는 산란선은 심부선량에 영향을 줄 수 있으며, 물질원자번호에 따라 다르게 나타난다. 이에 차폐물질로써 사용가능한 알루미늄, 구리, 납 등의 다양한 원자번호 물질을 전하 감약율 95% 되는 두께로 하여 측정과 MCNPX 모의계산으로 산란율을 비교분석하였다. 산란선 영향을 많이 받는 표면의 선량변화율은 최대 물질두께에서 +0.88%, 원자번호에서 +0.43%의 영향을 받으며, 전하 감약율 95% 되는 두께의 알루미늄, 구리, 납 물질은 측정에서 +19.70%, +15.20%, +12.40% 계산에서 +25.00%, +15.10%, +13.70%를 보였다. 이로 인해 산란율은 물질두께가 원자번호보다 많은 영향을 주며, 산란전자가 광자보다 많은 기여를 하고 있음을 알 수 있었다. 이에 임상에서의 적절한 차폐물질은 두께영향 산란선이 적게 방출되는 고 원자번호물질이 적당하다고 사료된다.

작은 두께주기를 갖는 W/Si 다층박막거울의 반사율 계산 (Calculation of Reflectivity for W/Si Multilayer Mirror of Small d-Spacing)

  • 천권수
    • 한국방사선학회논문지
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    • 제12권1호
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    • pp.17-22
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    • 2018
  • 다층박막거울은 규소나 게르마늄과 같은 단결정 회절소자를 대체할 수 있는 광학소자로 수 나노미터 두께의 인공적인 회절 평면을 갖는다. 작은 두께 주기를 갖는 W/Si 다층박막거울에서 박막의 두께 변화에 따른 첫 번째 브래그 각도 및 반사율 저하를 조사하였다. 작은 두께 주기를 갖는 W/Si 다층박막거울은 $0.55^{\circ}$ 및 17.5 keV에서 최대 반사율을 나타내도록 설계되었고 72.67%의 반사율을 보였다. 텅스텐 및 규소의 박막 두께가 동일하게 변화되었을 때 첫 번째 브래그 각도의 변화 및 반사율 저하가 관찰되었다. 다층박막거울에서 텅스텐 박막중 하나의 층에서만 두께 변화가 있을 때는 반사율의 변화는 없지만 포락선의 요철이 관찰되었다. 무작위적인 가우시안 두께 변화에서도 반사율 저하가 관찰되었다. 작은 두께 주기를 갖는 W/Si 다층박막거울에서 두께 변화에 따른 반사율의 저하를 통해 제작되는 다층박막거울의 공차를 예측할 수 있을 것이다.

NOVA System을 이용한 CMP Automation에 관한 연구 (The Study for the CMP Automation with Nova Measurement System)

  • 김상용;정헌상;박민우;김창일;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.176-180
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    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

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