• Transactions of Materials Processing
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• v.17 no.8
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• pp.586-593
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• 2008

In warm press forming of magnesium alloy sheet, it is important to control the sheet temperature by heating the sheet in closed die. When forming a commercial AZ31 magnesium alloy sheets which are 0.5mm and 1.0mm thick, respectively, time arriving at target temperature and temperature variation in magnesium alloy sheet have been investigated. The deep drawing process with rectangular shape alone at the first stage and with both circular and rectangular shapes at the second stage was employed. At the first stage, through deep drawing process with rectangular shape alone according to various forming temperature($150{\sim}350^{\circ}C$) and velocity($0.1{\sim}1.0mm/s$), optimum forming condition was obtained. At the second stage, deep drawing process with the circular and rectangular shapes were performed following deep drawn square cups with Limited Drawing Height(LDH) obtained at the first stage. Here, clearance which is defined a gap between the die and the punch including sheet was set to ratio of 20, 40 and 100% to thickness in sheet. Accordingly, temperature, velocities, and clearances suitable for forming were suggested through investigating the thickness variation of the product.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.2
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• pp.103-111
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• 2015

In general, no particularly well-established standards have been in place so far, for the method of evaluating the deteriorated level of pipes and ducts of industrial facilities. For that reason, the evaluation depends upon various studies which are based on the analysis of the residual life, thickness thinning, closure rate, and scale thickness that measure a few specific positions of pipes. It also depends upon the expertise in business operation and the specific techniques conducted by the inspection companies and institutions. This research introduces the concept of measuring units per section and the selection method of measurement points per section. Furthermore, specific methodologies were developed to plan and analyze deterioration level of industrial pipes and ducts by engineers and managers using a section map. Consequently, applying the outcomes from this study to the plant equipment of the incineration facility resulted in saving 42% of the repairing and remodeling cost.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.450-453
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• 2012

In crystalline solar cells, the substrate itself constitutes a large portion of the fabrication cost as it is derived from semiconductor ingots grown in costly high temperature processes. Thinner wafer substrates allow some cost saving as more wafers can be sliced from a given ingot, although technological limitations in slicing or sawing of wafers off an ingot, as well as the physical strength of the sliced wafers, put a lower limit on the substrate thickness. Complementary to these economical and techno-physical points of view, a device operation point of view of the substrate thickness would be useful. With this in mind, BC-BJ Si and GaAs solar cells are compared one to one by means of the Medici device simulation, with a particular emphasis on the substrate thickness. Under ideal conditions of 0.6 ${\mu}m$ photons entering the 10 ${\mu}m$-wide BC-BJ solar cells at the normal incident angle (${\theta}=90^{\circ}$), GaAs is about 2.3 times more efficient than Si in terms of peak cell power output: 42.3 $mW{\cdot}cm^{-2}$ vs. 18.2 $mW{\cdot}cm^{-2}$. This strong performance of GaAs, though only under ideal conditions, gives a strong indication that this material could stand competitively against Si, despite its known high material and process costs. Within the limitation of the minority carrier recombination lifetime value of $5{\times}10^{-5}$ sec used in the device simulation, the solar cell power is known to be only weakly dependent on the substrate thickness, particularly under about 100 ${\mu}m$, for both Si and GaAs. Though the optimum substrate thickness is about 100 ${\mu}m$ or less, the reduction in the power output is less than 10% from the peak values even when the substrate thickness is increased to 190 ${\mu}m$. Thus, for crystalline Si and GaAs with a relatively long recombination lifetime, extra efforts to be spent on thinning the substrate should be weighed against the expected actual gain in the solar cell output power.

• Childhood Kidney Diseases
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• v.5 no.2
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• pp.147-155
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• 2001

Purpose : IgA nephropathy(IgAN) and thin glomerular basement membrane disease(TGBMD) are common glomerular diseases that cause hematuria in childhood. IgAN has characteristics of IgA deposit as the sole or predominantly localized to the mesangium Recently, it has been reported that thinning of glomerular basement membrane(GBM) is commonly accompanied with precipitation of electron dense deposits in IgAN. We performed this study to examine the frequency of thinning of GBM among children with IgAN and to analysis tile correlation between urinary abnormalities and GBM thickness and furthermore to conduct comparative analysis of the clinical and pathological features of IgAN and TGBMD. Methods : This study summarizes data collected from Department of Pediatrics, Busan Paik Hospital, Inje Medical College. Data include 51 cases who were diagnosed as IgAN from 1995 to 2000, and 26 cases who were diagnosed as TGBMD from 1990 to 2000 by percutaneous renal biopsy. Results : Males accounted for 29/51($56.9\%$) patients with IgAN and 8/26($30.8\%$) of those with TGBMD. The clinical and laboratory features between IgAN and TGBMD were significantly different regarding the incidence of proteinuria(IgAN vs TGBMD: $43.1\%\;vs\;3.8\%$, p=0.001), the incidence of co-appearance of proteinuria with hematuria ($41.2\%\;vs\;3.8\%$, p=0.001), total amount of protein in 24 hours collected urine ($808{\pm}\;mg\;vs\;251{\pm}200.7\;mg$, p=0.001) and the incidence of proteinuria more than 1 gm in 24 hours collected urine ($23.5\%\;vs\;3.8\%$, p=0.01). On the contrary, there were no significant differences in the levels of serum albumin, creatinine, BUN, and Ccr between two groups. The mean thickness of GBM in patients with IgAN was $293.0{\pm}79.2\;nm$(139.7-461.9 nm) and $180.9{\pm}35.8\;nm$(110.5-229.5 nm) in patients with TGBMD. The mean GBM thickness revealed significantly thinner in TGBMD compared than those with IgAN (P=0.0001). The frequency of thickness being less than 250 nm was $37.4{\pm}34.4\%$ in IgAN and $93.0{\pm}7.0\%$ in TGBMD (P=0.0001). But there were no correlations between urinary abnormalities and GBM thickness in patients with IgAN. Conclusion : The thinning of GBM would be one of the common pathological findings in IgAN Moreover, there is no significant correlations between urinary abnormalities and GBM thickness in patients with IgAN, However, patients with IgAN tend to have significantly higher possibilities of proteinuria, co-appearance of proteinuria with hematuria and higher total amount of protein in 24 hours collected urine compared those with TGBMD. These differences might be play all important role as progressive prognostic indicators in patients with IgAN. (J Korean Soc Pediatr Nephrol 2001;5 : 136-46)

• Design & Manufacturing
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• v.14 no.3
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• pp.17-22
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• 2020

As devices such as smartphones, tablet PC, and wearable devices have been miniaturized, the connectors that go into the devices are also designed to be very small. The connector combines the plug and the receptacle to transfer electricity. As devices are miniaturized, the contact shape is formed by partially thinning the thickness of the raw material of the terminal in order to lower the coupling height of the plug and receptacle. The product used in this study is a receptacle terminal used for 0.4mm pitch board to board connector among fine pitch connectors. When the material thickness is reduced by forging the receptacle terminal, the width change of the pin is checked. To reduce the thickness of the material by forging, pre-notching is applied in the first step, forging in the second step, and notching in the third step. After forming the width dimension of the pin to 0.28 mm in the pre-notching process, in the forging process, the material thickness 0.08 mm and 0.02 mm (25%) were forged and the thickness was changed to 0.06 mm and the width change amount of the pin was measured. The facility produced 10,000 pieces at 400 SPM using a Yamada Dobby (MXM-40L) press, and thirty pins were measured and the average value was shown. After forging by using C5210-H (HP) and NKT322-EH, which are frequently used in connectors, analyze the amount of change in each material. The effect of punching oil on forging is investigated by appling FM-200M, which is highly viscous, and FL-212, fast drying oil. This study aims to minimize mold modification by predicting the amount of material change after forging.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.149-153
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• 2008

Since magnesium alloy sheets have been employed in industrial field which requires the light weight and thin engineering components, most of researches have been focused on the formability of magnesium ahoy sheet. In warm press forming of magnesium alloy sheet, it is important to control the sheet temperature by heating the sheet in closed die. When forming a commercial AZ31 magnesium alloy sheets which are 0.5mm and 1.0mm thick, respectively, time arriving at target temperature and temperature variation in magnesium alloy sheet have been investigated. Sheet metals were mostly formed in simple shapes such as circular or rectangular. Few studies about forming of complex shapes were reported. Thus, the formability of magnesium alloy sheet for complex shapes is investigated. The process variable for a double sink shape deep drawing with circular and rectangular shape was investigated by varying temperature, velocities, and clearances. Accordingly, temperature, velocities, and clearances suitable for forming were suggested through investigating the thickness variation of the product.

• Structural Engineering and Mechanics
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• v.50 no.4
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• pp.563-573
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• 2014

In hydroforming, the general technique employed to overcome the problem of die corner filling consist in increasing the maximum fluid pressure during the forming process. This technique, in other hand, leads to other difficulties such as thinning and rupturing of the final work piece. In this paper, a new technique has been suggested in order to produce a part with complete filled corners. In this approach, two moveable bushes have been used. So, the workpiece moves driven by both bushes simultaneously. In the first stage, system pressure increases until a maximum of 15 MPa, providing aninitial tube bulge. The results showed that the pressure in this stage have to be limited to 17 MPa to avoid fracture. In a second stage, bushes are moved keeping the constant initial pressure. The punches act simultaneously at the die extremities. Results show that the friction between part and die decreases during the forming process significantly. Also, by using this technique it is possible to produce a part with reasonable uniform thickness distribution. Other outcomes of applying this method are the lower pressures required to manufacture a workpiece with complete filled corners with no wrinkling.

• Transactions of Materials Processing
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• v.17 no.3
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• pp.170-181
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• 2008

The shape of rectangular cup used for Ni-MH(Nickel-coated Metal Hydrogen) battery for hybrid car looks quite simple, but the forming process of extruding and setting up process design are highly difficult. Furthermore, there are few concrete reports on the rectangular deep drawn cup as part of hybrid vehicles till now. In this study, process design for rectangular cup in the multi-stage deep drawing process is carried out, and FE analysis is also preformed based on the result of the process design. From the simulation result, some unexpected problems such as earing, wrinkling and excessive thickness changes of the intermediate blank occurred. To overcome these failures, a series of modification for punch shape in the forming process design are completed and applied. Considering the modified punch shape in the multi-stage deep drawing process, additional FE analysis is also carried out and the simulation result is verified in view of the deformed shape, thickness change and effective strain distribution. The result of FE analysis with the improved process design confirmed not only reducing thinning of wall and possibilities of failure but also improving the quality of drawing product through the modification of punch shape.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.94-99
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• 2004

silicided 50-nm-gate-length n-type Schottky barrier metal-oxide-semiconductor field-effect-transistors (SB-MOSFETs) with 5 nm gate oxide thickness are manufactured. The saturation current is $120{\mu}A/{\mu}m$ and on/off-current ratio is higher than $10^5$ with low leakage current less than $10{\mu}A/{\mu}m$. Novel phenomena of this device are discussed. The increase of tunneling current with the increase of drain voltage is explained using drain induced Schottky barrier thickness thinning effect. The abnormal increase of drain current with the decrease of gate voltage is explained by hole carrier injection from drain into channel. The mechanism of threshold voltage increase in SB-MOSFETs is discussed. Based on the extracted model parameters, the performance of 10-nm-gate-length SB-MOSFETs is predicted. The results show that the subthreshold swing value can be lower than 60 mV/decade.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.1
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• pp.47-52
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• 2011

An electromagnetic acoustic transducer(EMAT) is a non-contact transducer which can transmit the ultrasonic guided waves into specimens without couplant. And it can easily generate specific guided waves such as SH(shear horizontal) or Lamb waves by altering the design of coil and magnet. In this study, the SH wave, which is generated by EMAT, has been applied to estimate the thickness-reduction in a steel plate. Especially, the interesting feature of the dispersive behavior in selected wave modes is used to detect the thickness-reduction. Experimental results show that the reduction-level can be quantified by the measurement of the group velocity of the wave which passes though the thinning area.