• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.61-62
• /
• 2006

In this paper, it was demonstrated that organic thin- film transistors (OTFTs) were fabricated with the organic adhesion layer between an organic semiconductor and a gate insulator by vapor deposition polymerization (VDP) processing. In order to form polymeric film as an adhesion layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. The saturated slop in the saturation region and the subthreshold nonlinearity in the triode region were c1early observed in the electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure. Field effect mobility, threshold voltage, and on-off current ratio in 15-nm-thick organic adhesion layer were about $0.5\;cm^2/Vs$, -1 V, and $10^6$, respectively. We also demonstrated that threshold voltage depends strongly on the delay time when a gate voltage has been applied to bias stress.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.151-155
• /
• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• Journal of the Korean Ceramic Society
• /
• v.45 no.7
• /
• pp.411-417
• /
• 2008

Aerosol Deposition Method (ADM) is a novel technique to grow ceramic thick films with high density and nano-crystal structure at room temperature. $^{1,2)}$ For these unique advantages of ADM, it would be applied to the fabrication process of 3-D integration ceramic modules effectively. However, it is critical to control the properties of starting powders, because a film formation through ADM is achieved by impaction and consolidation of starting powders on the substrates. We fabricated alumina thick films by ADM for the application to integral substrates for RF modules. When the as-received alumina powders were used as a starting material without any treatments, it was observed that the dielectric properties of as-deposited alumina films, such as relative permittivity and loss tangent, showed high dependency on the frequency. In this study, some techniques of powder pre-treatments to improve the dielectric properties of alumina thick films will be shown and the effects of starting powders on the properties of AD films will be discussed.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.35-39
• /
• 2008

In this study, electromechanical properties of carbon nanotube (CNT) thin film on flexible substrates were measured using a micro-tensile machine with functionality of simultaneous measurements of displacement, load and electrical resistance. The CNT thin film of about 100 nm thick was deposited on flexible substrates, polyethylene terephthalate (PET) using spraying and ink-jetting techniques. To investigate the effect of process condition on the electromechanical properties of CNT thin film, sets of CNT samples were fabricated under various heat treatments and microwave process. The microstructures of the CNT thin film before and after tensile test were investigated using Scanning Electron Microscope (SEM), and the failure modes of the CNT thin films were identified to understand their electromechanical behaviors and interaction with the flexible substrates. Based on the experimental results, the use of CNT thin film as flexible electrodes and strain gages is discussed.

• Journal of the Korean Vacuum Society
• /
• v.8 no.3A
• /
• pp.231-237
• /
• 1999

$SrBi_{22.4}Ta_2O_9$ (SBT) thin films of 70~150 nm thickness were prepared on platinized silicon substrates by Liquid Source Misted Chemical Deposition (LSMCD) process, and their microstructure, feroelectric and leakage current characteristics were investigated. By annealing at $800^{\circ}C$ for 1 hour in oxygen ambient, SBT films were fully crystallized to the Bi layered perovskite structure without preferred orientation. The grain size of the LSMCD- derived SBT films was about 100nm, and was not varied with the film thickness. $2P_r$ and $E_c$ of the SBT films increased with decreasing the film thickness, and the 70nm-thick SBT film exhibited $2P_r$ of 17.8 $\mu$C/$\textrm{cm}^2$ and $E_c$ of 74kV/cm at applied voltage of 5V. Within the film thickness range of 70~150nm, the relative dielectric permittivity of the LSMCD-derived SBT film decreased with decreasing the film thickness. Leakage current densities lower than $10^{-7}\textrm{A/cm}^2$ at 5V were observed in the SBT films thicker than 125nm.

• Progress in Superconductivity
• /
• v.6 no.1
• /
• pp.13-18
• /
• 2004

High-.ate in-situ$ YBa_2$Cu$Cu_3$$O_{7-x}$ (YBCO) film growth was demonstrated by means of the electron beam co-evaporation. Even though our oxygen pressure is low, ∼$5 ${\times}$10^{-5}$ Torr, we can synthesize as-grown superconducting YBCO films at a deposition rate of around 10 nm/s. Relatively high temperatures of around 90$0^{\circ}C$ was necessary in this process so far, and it suggests that this temperature at a given oxygen activity allows a Ba-Cu-O liquid formation along with an YBCO epitaxy. Local critical current density shows a clear correlation with local resistivity. Homogeneous transport properties with a large critical current density ($4 ∼ 5 MA/\textrm{cm}^2$ at 77K, 0T) are observed in top faulted region while it is found that the bottom part carries little supercurrent with a large local resistivity. Therefore, it is possible that thickness dependence of critical current density is closely related with a topological variation of good superconducting paths and/or grains in the film bodies. The information derived from it may be useful in the characterization and optimization of superconducting films for electrical power and other applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.05a
• /
• pp.92-95
• /
• 2005

The silver photodoping effect in amorphous AsGeSeS chalcogenide thin films for holographic recording has been investigated using a HeNe laser ($\lambda$=632.8 nm). The chalcogenide films prepared in this work were thinner in comparison with the penetration depth of recording light ($d_p$=1.66 mm). The variation of the diffraction efficiency $(\eta)$ in amorphous chalcogende films exhibits a tendency, independently of the Ag photodoping. That is, n increases relatively rapidly at the beginning of the recording process, reaches the maximum $({\eta}_{max})$ and slowly decreases. In addition, the value of ${\eta}_{max}$ depends strongly on chalcogenide film thickness(d) and its peak among the films with d = 40, 80, 150, 300, and 633 nm is observed at d = 150 nm (approximately 1/2n), where n is refractive index of the chalcogenide (n=2.0). The ${\eta}$ is largely enhanced by Ag photodoping into the chalcogenides. In particular, the value of hmax in a bilayer of 10-nm-thick Ag/150-nm-thick AsGeSeS film is about 1.6%, which corresponds to ~20 times in comparison with that of the AsGeSeS film (without Ag).

• Journal of Hydrogen and New Energy
• /
• v.10 no.3
• /
• pp.171-175
• /
• 1999

Pd films($180{\sim}670{\AA}$ thick) were made by thermal evaporation. Electrical resistance of the films was measured during hydrogen absorption-desorption process at room temperature. Resistance changes as a function of hydrogen pressure in thin films of the PdH system show a strong dependence on film thickness. $({\Delta}R_{\infty}/R_0)_{{\beta}min}$ for a $\670{\AA}$ film is 0.61. For a $\180{\AA}$ film, this is 0.34. Resistance change also depends on sample preparation condition.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.30 no.5
• /
• pp.183-188
• /
• 2020

Lead zinc niobate (PZN)-added lead zirconate titanate (PZT) thick films with thickness of 5~10 ㎛ were fabricated on silicon and sapphire substrates using aerosol deposition method. The contents of PZN were varied from 0 %, 20 % and to 40 %. The PZN-added PZT film showed poorer electrical properties than pure PZT film when the films were coated on silicon substrate and annealed at 700℃. On the other hand, the PZN-added PZT film showed higher remanent polarization and dielectric constant values than pure PZT film when the films were coated on sapphire and annealed at 900℃. The ferroelectric and dielectric characteristics of 20 % PZN-added PZT films annealed at 900℃ were compared with the result values obtained from bulk ceramic specimen with same composition sintered at 1200℃. As annealing temperature increased, dielectric constant increased. These came from enhanced crystallization and grain growth by post heat treatment.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.6 no.2
• /
• pp.315-322
• /
• 2002

A thin film oxide semiconductor micro gas sensor array which shows only 60㎽ of power consumption at an operating temperature of 30$0^{\circ}C$ has been fabricated using microfabrication and rnicrornachining techniques. Excellent thermal insulation of the membrane is achieved by the use of a double la! or structure of 0.1${\mu}{\textrm}{m}$ thick Si$_3$N$_4$ and 1${\mu}{\textrm}{m}$ thick phosphosilicate glass(PSG) prepared by low pressure chemical vapor deposition(LPCVD) and atmospheric－pressure chemical-vapor deposition(APCVD), respectively. The sensor way consists of such thin film oxide semiconductor sensing materials as 1wt.％ Pd-doped SnO$_2$, 6wt.% AI$_2$O$_3$-doped ZnO, WO$_3$ and ZnO. The thin film oxide semiconductor micro gas sensor array exhibited resistance changes usable for subsequent data processing upon exposure to various gases and the sensitivity strongly depended on the sensing layer materials. Heater Part of the sensor structure has been modified in order to improve the process yield of the sensor, and as a result of modified heater structure improved process yield has been achieved.