• 제목/요약/키워드: Thick Ring

검색결과 70건 처리시간 0.019초

두꺼운 링의 고유진동 해석 (Natural Vibration Analysis of Thick Rings)

  • 박정우;김세희;김창부
    • 한국소음진동공학회논문집
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    • 제15권10호
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    • pp.1186-1194
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    • 2005
  • In this paper, we have systematically formulated the equations concerned to the in-plane and out-of-plane motions and deformations of a thick circular beam by using the kinetic and strain energies in order to analyse natural frequencies of a thick ring. The effects of variation of radius of curvature across the cross-section and also the effects of bending shear, extension and twist are considered. The equations of motion for natural vibration analysis of a ring are obtained utilizing the cyclic symmetry of vibration modes of the ring. The frequencies calculated using thick ring model and thin ring model are compared and discussed with the ones obtained from finite element analysis using the method of cyclic symmetry with 20-node hexahedral solid elements for rings with the different ratio of radial thickness to mean radius.

회전하는 두꺼운 링의 고유진동 해석을 위한 모델링 (Modeling for the Natural Vibration Analysis of a Rotating Thick Ring)

  • 김창부;김보연
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2007년도 추계학술대회 논문집
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    • pp.107-114
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    • 2007
  • In this paper, the equations of motion by which the natural vibration of rotating thick ring can be analyzed accurately are presented. These equations are derived from the theory of finite deformation and the principle of virtual work. The effects of variation in curvature across the ring cross-section can be considered in these equations. The ring models are called as thick ring model and thin ring model respectively as the effects of variation in curvature are considered or neglected. The radial displacement of ring which is rotating at constant angular velocity is determined by a non-linear equation derived from the principle of virtual work. The equations of the in-plane and out-of-plane vibrations at disturbed state are also formulated from the principle of virtual work. They can be expressed as the combination of the radial displacement at the steady state and the disturbed displacements about the steady state. The natural vibrations of rings with different thickness are analyzed by using the presented ring models and 3-dimensional finite element method to verify accuracy of the presented equations of motion. Its results are compared and discussed.

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두꺼운 링의 고유진동 해석 (Natural Vibration Analysis of Thick Rings)

  • 김창부;박정우
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2005년도 춘계학술대회 논문집
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    • pp.459-466
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    • 2005
  • In this paper, we have systematically formulated the equations concerned to the in-plane and out-of-plane motions and deformations of a thick circular beam by using the kinetic and strain energies in order to analyse natural frequencies of a thick ring. The effects of variation of radius of curvature across the cross-section and also the effects of bending shear, extension and twist are considered. The equations of motion for natural vibration analysis of a ring are obtained utilizing the cyclic symmetry of vibration modes of the ring. The frequencies calculated using thick ring model and thin ring model are compared and discussed with the ones obtained from finite element analysis using the method of cyclic symmetry with 20-node hexahedral solid elements for rings with the different ratio of radial thickness to mean radius.

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Coverlayer Fabrication of Small Form Factor Optical Disks

  • Kim, Jin-Hong;Kim, Jong-Hwan
    • 정보저장시스템학회논문집
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    • 제1권2호
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    • pp.188-191
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    • 2005
  • Two different coverlayers which is useful for an optical buffer and a mechanical protection made of not only UV resin but also polycarbonate coversheet were prepared on small form factor optical disks. Thin coverlayer of 10 ${\mu}m$ and thick coverlayer of 80 ${\mu}m$ were fabricated. 10 ${\mu}m$-thick coverlayer was coated using UV resin material by spin coating method for the flying optical head application. On the other hand, 80 ${\mu}m$-thick coverlayer using coversheet with the resin bonding material was prepared for the non-flying optical head application. Both cases, the thickness uniformity seem to be the primary prerequisite factor, and it was analyzed. Thickness of 10 ${\mu}m$-thick UV resin coverlayer could be controlled within ${\pm}0.2m$ range and 80 ${\mu}m$-thick coversheet could be controlled within ${\pm}3{\mu}m$ range. However, the yield of such thickness tolerance was not good. New design of metal housing holder and polycarbonate outer ring was adopted to diminish the ski-jump phenomenon. Specifically, the polycarbonate outer ring was very effective to reduce the ski-jump. However, it should be careful to maintain uniform edge between disk and ring for the perfect coverlayer.

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Impact of coffee ring effect on the $Al_2O_3$ thick films by Using Inkjet Printing Process

  • Hwang, Myung-Sung;Jang, Hun-Woo;Kim, Ji-Hoon;Koo, Eun-Hae;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.171-171
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    • 2009
  • We have investigated the impact of coffee ring effect on the inkjet-printed $Al_2O_3$ thick films. In a single solvent system such as Dimethylformamide, the coffee-ring-pattern has appeared on the edge of sessile drop after evaporation. The peak-to-valley height difference in $Al_2O_3$ coffee ring is over 2um. This non-uniform deposition of $Al_2O_3$ over the surface leads to sever surface roughness of the inkjet-printed films. However, we have manipulated our printing parameters to improve the surface roughness and the packing density of the printed $Al_2O_3$ films. Our inkjet-printed $Al_2O_3$ films show 10 times smoother surface than the initially printed sample's surface. Also the packing density of the printed Ah03 film becomes 70% of high packed $Al_2O_3$. In this presentation, we would like to present the key process parameters of the inkjet printing process to overcome the genetic coffee ring problem.

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타원형 또는 원형 단면을 가진 원형 링의 3차원적 진동해석 (Three-dimensional Vibration Analysis of Circular Rings with an Elliptical or Circular Cross-section)

  • 심현주;우하영;강재훈
    • 한국소음진동공학회논문집
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    • 제16권10호
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    • pp.1024-1035
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    • 2006
  • A three-dimensional (3-D) method of analysis is presented for determining the free vibration frequencies and mode shapes of thick, complete (circumferentially closed), circular rings with an elliptical or circular cross-section. Displacement components $u_r,\;u_\theta\;and\;u_z$ in the radial, circumferential, and axial directions, respectively, are taken to be periodic in ${\theta}$ and in time, and algebraic polynomials in the r and z directions. Potential (strain) and kinetic energies of the circular rings are formulated, and upper bound values of the frequencies are obtained by minimizing the frequencies. As the degree of the polynomials is increased, frequencies converge to the exact values. Convergence to four-digit exactitude is demonstrated for the first five frequencies of the rings. Novel numerical results are presented for the circular rings having an elliptical cross-section based upon 3-D theory. Comparisons are also made between the frequencies from the present 3-D Ritz method and ones obtained from thin and thick ring theories, experiments, and another 3-D method.

광-유체링공진기(OFRR) 바이오센서에 관한 공진이동과 양호도의 시뮬레이션 (Simulation of Resonance Shift and Quality Factor for Opto-fluidic Ring Resonator (OFRR) Biosensors)

  • 조한근;한진우;양길모
    • Journal of Biosystems Engineering
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    • 제36권1호
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    • pp.23-32
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    • 2011
  • In this work, the finite element method was used to investigate the shifts of resonance frequencies and quality factor of whispering-gallery-mode (WGM) for an opto-fluidic ring resonator (OFRR) biosensor. To describe the near-field radiation transfer, the time-domain Maxwell's equations were employed and solved by using the in-plane TE wave application mode of the COMSOL Multiphysics with RF module. The OFRR biosensor model under current study includes a glass capillary with a diameter of 100 mm and wall thickness of 3.0 mm. The resonance energy spectrum curves in the wavelength range from 1545 nm to 1560 nm were examined under different biosensing conditions. We mainly studied the sensitivity of resonance shifts affected by changes in the effective thickness of the sensor resonator ring with a 3.0 mm thick wall, as well as changes in the refractive index (RI) of the medium inside ring resonators with both 2.5 mm and 3.0 mm thick walls. In the bulk RI detection, a sensitivity of 23.1 nm/refractive index units (RIU) is achieved for a 2.5 mm thick ring. In small molecule detection, a sensitivity of 26.4 pm/nm is achieved with a maximum Q-factor of $6.3{\times}10^3$. These results compare favorably with those obtained by other researchers.

상수리나무 심재(心材)와 변재판재(邊材板材)의 두께와 연륜각도(年輪角度)가 열판건조(熱板乾燥)에 미치는 영향(影響) (Effect of Board Thickness and Ring Angle on Press - drying for Heartwood and Sapwood of Quercus acutissima C.)

  • 이남호;정희석
    • Journal of the Korean Wood Science and Technology
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    • 제15권2호
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    • pp.67-78
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    • 1987
  • This study was designed to investigate the effect of board thickness and ring angle on the characteristics including internal check. ring failure, surface check, end check, collapse, thickness shrinkage and width shrinkage of press-drying. The exprimental materials of 6mm-. 9mm- and 12mm-thick board were taken from heartwood and sapwood of oak (Quercus acutissima Carr.) respectively. And boards were numbered according to position in the log(No. 1 to No. 4 for heartwood :md No. 9 for sapwood). Press-drying was at $145^{\circ}C$ platen temperature and 3.5kg/$Cm^2$ platen pressure. The results of this study were summarized as follows. 1. Drying rates for sapwood materials were greater than those for heartwood materials. And drying rates for thinner materials were greater than those for thicker materials. 2. The thinner boards were. the severer surface checking developed in the heartwood materials, and surface checking for heartwood materials had no tendency in board position for the same thickness. Sapwood materials were completely free from surface checking. 3. End checking for heartwood materials had no tendency in board position. The greater deviation of ring angle from perfectly edge-grained was, the severer and checking developed in the sapwood materials. But end checking did not occur in 6mm-thick sapwood materials. 4. The greater deviation of ring angle from perfectly edge-grained was, the severer end checking developed for heartwood and sapwood materials. As board thickness increased, maternal checking developed more severely for heartwood and sapweed materials. 5. For heartwood materials, ring failure, reduced with increasing deviation of ring angle from perfectly edge-grained except 12mm-thick material and showed no significant difference attributable to board thickness. Sapwood materials were completely free from ring failure. 6. For heartwood and sapwood materials, collapse was slight and showed no significant differences attributable to both board thickness and board position. 7. As deviation of ring angle from perfectly edge-grained increased, shrinkage of board thickness decreased for heartwood and sapwood materials. 8. Shrinkage of board width showed no significant differences attributable to both board thickness and board position for heartwood and sapweed materials.

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두꺼운 원형링의 3차원적 자유진동해석 (Free Vibration Analysis of Thick Circular Ring from Three-Dimensional Analysis)

  • 양근혁;강재훈;채영호
    • 한국전산구조공학회논문집
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    • 제15권4호
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    • pp.609-617
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    • 2002
  • 본 연구에서는 이등변사다리꼴과 이등변삼각형 단면을 갖는 두꺼운 원형링의 고유진동수와 모우드형태를 결정하는 3차원 해석방법을 제시하였다. 자오선(s), 수직(z) 및 원주방향(θ)으로의 변위성분(u/sub s/, u/sub z/, u/sub θ/)을 시간에 대해서는 정현적으로, θ방향으로는 주기성을 갖도록, s와 z방향으로는 대수다항식의 형태로 표현하였다. 원형링의 위치(변형률)에너지와 운동에너지가 공식화되었으며, 진동수의 최소화를 통하여 상위경계치의 진동수를 계산하였다. 다항식의 차수를 증가시키면 진동수는 엄밀해에 수렴하게 된다. 완전자유경계의 원형링에 대한 3차원적 진동수를 최초로 구하였으며 원형링의 하위 5개 진동수에 대해서 유효숫자 4자리까지의 수렴성연구가 이루어졌다. 본 방법은 링 두께의 크기에 관계없이 적용이 가능하다.

플립칩용 웨이퍼레벨 Fine Pitch 솔더범프 형성 (Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application)

  • 주철원;김성진;백규하;이희태;한병성;박성수;강영일
    • 한국전기전자재료학회논문지
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    • 제14권11호
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    • pp.874-878
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    • 2001
  • Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

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