• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.10 s.103
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• pp.1186-1194
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• 2005

In this paper, we have systematically formulated the equations concerned to the in-plane and out-of-plane motions and deformations of a thick circular beam by using the kinetic and strain energies in order to analyse natural frequencies of a thick ring. The effects of variation of radius of curvature across the cross-section and also the effects of bending shear, extension and twist are considered. The equations of motion for natural vibration analysis of a ring are obtained utilizing the cyclic symmetry of vibration modes of the ring. The frequencies calculated using thick ring model and thin ring model are compared and discussed with the ones obtained from finite element analysis using the method of cyclic symmetry with 20-node hexahedral solid elements for rings with the different ratio of radial thickness to mean radius.

• Proceedings of the KSR Conference
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• 2007.11a
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• pp.107-114
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• 2007

In this paper, the equations of motion by which the natural vibration of rotating thick ring can be analyzed accurately are presented. These equations are derived from the theory of finite deformation and the principle of virtual work. The effects of variation in curvature across the ring cross-section can be considered in these equations. The ring models are called as thick ring model and thin ring model respectively as the effects of variation in curvature are considered or neglected. The radial displacement of ring which is rotating at constant angular velocity is determined by a non-linear equation derived from the principle of virtual work. The equations of the in-plane and out-of-plane vibrations at disturbed state are also formulated from the principle of virtual work. They can be expressed as the combination of the radial displacement at the steady state and the disturbed displacements about the steady state. The natural vibrations of rings with different thickness are analyzed by using the presented ring models and 3-dimensional finite element method to verify accuracy of the presented equations of motion. Its results are compared and discussed.

• Proceedings of the KSR Conference
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• 2005.05a
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• pp.459-466
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• 2005

In this paper, we have systematically formulated the equations concerned to the in-plane and out-of-plane motions and deformations of a thick circular beam by using the kinetic and strain energies in order to analyse natural frequencies of a thick ring. The effects of variation of radius of curvature across the cross-section and also the effects of bending shear, extension and twist are considered. The equations of motion for natural vibration analysis of a ring are obtained utilizing the cyclic symmetry of vibration modes of the ring. The frequencies calculated using thick ring model and thin ring model are compared and discussed with the ones obtained from finite element analysis using the method of cyclic symmetry with 20-node hexahedral solid elements for rings with the different ratio of radial thickness to mean radius.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.188-191
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• 2005

Two different coverlayers which is useful for an optical buffer and a mechanical protection made of not only UV resin but also polycarbonate coversheet were prepared on small form factor optical disks. Thin coverlayer of 10 ${\mu}m$ and thick coverlayer of 80 ${\mu}m$ were fabricated. 10 ${\mu}m$-thick coverlayer was coated using UV resin material by spin coating method for the flying optical head application. On the other hand, 80 ${\mu}m$-thick coverlayer using coversheet with the resin bonding material was prepared for the non-flying optical head application. Both cases, the thickness uniformity seem to be the primary prerequisite factor, and it was analyzed. Thickness of 10 ${\mu}m$-thick UV resin coverlayer could be controlled within ${\pm}0.2m$ range and 80 ${\mu}m$-thick coversheet could be controlled within ${\pm}3{\mu}m$ range. However, the yield of such thickness tolerance was not good. New design of metal housing holder and polycarbonate outer ring was adopted to diminish the ski-jump phenomenon. Specifically, the polycarbonate outer ring was very effective to reduce the ski-jump. However, it should be careful to maintain uniform edge between disk and ring for the perfect coverlayer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.171-171
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• 2009

We have investigated the impact of coffee ring effect on the inkjet-printed $Al_2O_3$ thick films. In a single solvent system such as Dimethylformamide, the coffee-ring-pattern has appeared on the edge of sessile drop after evaporation. The peak-to-valley height difference in $Al_2O_3$ coffee ring is over 2um. This non-uniform deposition of $Al_2O_3$ over the surface leads to sever surface roughness of the inkjet-printed films. However, we have manipulated our printing parameters to improve the surface roughness and the packing density of the printed $Al_2O_3$ films. Our inkjet-printed $Al_2O_3$ films show 10 times smoother surface than the initially printed sample's surface. Also the packing density of the printed Ah03 film becomes 70% of high packed $Al_2O_3$. In this presentation, we would like to present the key process parameters of the inkjet printing process to overcome the genetic coffee ring problem.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.10 s.115
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• pp.1024-1035
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• 2006

A three-dimensional (3-D) method of analysis is presented for determining the free vibration frequencies and mode shapes of thick, complete (circumferentially closed), circular rings with an elliptical or circular cross-section. Displacement components $u_r,\;u_\theta\;and\;u_z$ in the radial, circumferential, and axial directions, respectively, are taken to be periodic in ${\theta}$ and in time, and algebraic polynomials in the r and z directions. Potential (strain) and kinetic energies of the circular rings are formulated, and upper bound values of the frequencies are obtained by minimizing the frequencies. As the degree of the polynomials is increased, frequencies converge to the exact values. Convergence to four-digit exactitude is demonstrated for the first five frequencies of the rings. Novel numerical results are presented for the circular rings having an elliptical cross-section based upon 3-D theory. Comparisons are also made between the frequencies from the present 3-D Ritz method and ones obtained from thin and thick ring theories, experiments, and another 3-D method.

• Journal of Biosystems Engineering
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• v.36 no.1
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• pp.23-32
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• 2011

In this work, the finite element method was used to investigate the shifts of resonance frequencies and quality factor of whispering-gallery-mode (WGM) for an opto-fluidic ring resonator (OFRR) biosensor. To describe the near-field radiation transfer, the time-domain Maxwell's equations were employed and solved by using the in-plane TE wave application mode of the COMSOL Multiphysics with RF module. The OFRR biosensor model under current study includes a glass capillary with a diameter of 100 mm and wall thickness of 3.0 mm. The resonance energy spectrum curves in the wavelength range from 1545 nm to 1560 nm were examined under different biosensing conditions. We mainly studied the sensitivity of resonance shifts affected by changes in the effective thickness of the sensor resonator ring with a 3.0 mm thick wall, as well as changes in the refractive index (RI) of the medium inside ring resonators with both 2.5 mm and 3.0 mm thick walls. In the bulk RI detection, a sensitivity of 23.1 nm/refractive index units (RIU) is achieved for a 2.5 mm thick ring. In small molecule detection, a sensitivity of 26.4 pm/nm is achieved with a maximum Q-factor of $6.3{\times}10^3$. These results compare favorably with those obtained by other researchers.

• Journal of the Korean Wood Science and Technology
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• v.15 no.2
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• pp.67-78
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• 1987

This study was designed to investigate the effect of board thickness and ring angle on the characteristics including internal check. ring failure, surface check, end check, collapse, thickness shrinkage and width shrinkage of press-drying. The exprimental materials of 6mm-. 9mm- and 12mm-thick board were taken from heartwood and sapwood of oak (Quercus acutissima Carr.) respectively. And boards were numbered according to position in the log(No. 1 to No. 4 for heartwood :md No. 9 for sapwood). Press-drying was at $145^{\circ}C$ platen temperature and 3.5kg/$Cm^2$ platen pressure. The results of this study were summarized as follows. 1. Drying rates for sapwood materials were greater than those for heartwood materials. And drying rates for thinner materials were greater than those for thicker materials. 2. The thinner boards were. the severer surface checking developed in the heartwood materials, and surface checking for heartwood materials had no tendency in board position for the same thickness. Sapwood materials were completely free from surface checking. 3. End checking for heartwood materials had no tendency in board position. The greater deviation of ring angle from perfectly edge-grained was, the severer and checking developed in the sapwood materials. But end checking did not occur in 6mm-thick sapwood materials. 4. The greater deviation of ring angle from perfectly edge-grained was, the severer end checking developed for heartwood and sapwood materials. As board thickness increased, maternal checking developed more severely for heartwood and sapweed materials. 5. For heartwood materials, ring failure, reduced with increasing deviation of ring angle from perfectly edge-grained except 12mm-thick material and showed no significant difference attributable to board thickness. Sapwood materials were completely free from ring failure. 6. For heartwood and sapwood materials, collapse was slight and showed no significant differences attributable to both board thickness and board position. 7. As deviation of ring angle from perfectly edge-grained increased, shrinkage of board thickness decreased for heartwood and sapwood materials. 8. Shrinkage of board width showed no significant differences attributable to both board thickness and board position for heartwood and sapweed materials.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.15 no.4
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• pp.609-617
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• 2002

A three-dimensional(3-D) method of analysis is presented for determining the free vibration frequencies and mode shapes of thick, circular rings with isosceles trapezoidal and triangular cross-sections. Displacement components u/sub s/, u/sub z/, and u/sub θin the meridional, normal, and circumferential directions, respectively, are taken to be sinusoidal in time, periodic in θ, and algebraic polynomials in the ψ and z directions. Potential(strain) and kinetic energies of the circular ring are formulated, and upper bound values of the frequencies we obtained by minimizing the frequencies. As the degree of the polynomials is increased, frequencies converge to the exact values. Novel numerical results are presented for the circular rings with isosceles trapezoidal and equilateral triangular cross-sections having completely free boundaries. Convergence to four-digit exactitude is demonstrated for the first five frequencies of the rings. The method is applicable to thin rings, as well as thick and very thick ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.