• Title/Summary/Keyword: Thermomechanical deformation

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Thermomechanical interactions in a transversely isotropic thermoelastic media with diffusion due to inclined load

  • Parveen Lata;Heena
    • Structural Engineering and Mechanics
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    • v.90 no.3
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    • pp.263-272
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    • 2024
  • This research deals with the study of two-dimensional deformation in transversely isotropic thermoelastic diffusion medium. This investigation integrates the effect of diffusion and thermal effects in transversely isotropic thermoelastic solids under inclined load. Inclined load is taken as linear combination of normal load and tangential load. Laplace and Fourier transformation techniques are employed to transform the physical domain and then transformed solutions are inverted with the aid of numerical inversion techniques. Concentrated and distributed load are considered to exemplify its utility. Graphical representation of variation in displacement, stresses, temperature and concentration distribution with distance is depicted by taking inclination at different angles. Some particular cases are studied.

Thermomechanical Analysis of Functionally Gradient $Al-SiC_p$ Composite for Electronic Packaging (전자패키지용 경사조성 $Al-SiC_p$복합재료의 열.기계적 변형특성 해석)

  • 송대현;최낙봉;김애정;조경목;박익민
    • Composites Research
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    • v.13 no.6
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    • pp.23-29
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    • 2000
  • The internal residual stresses within the multilayered structure with sharp interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed for the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the $Al-SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

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Cyclic Deformation Behaviors under Isothermal and Thermomechanical Fatigue Conditions in Nb and Mo Added 15Cr Ferritic Stainless Steel (Nb 및 Mo 첨가 페라이트계 스테인리스강의 등온 저주기 및 열기계적 피로에 따른 변형거동)

  • Jung, Jae Gyu;Oh, Seung Taik;Choi, Won Doo;Lee, Doo Hwan;Lim, Jong Dae;Oh, Yong Jun
    • Korean Journal of Metals and Materials
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    • v.47 no.11
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    • pp.707-715
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    • 2009
  • This paper deals with cyclic stress and strain responses during isothermal low cycle fatigue (LCF) and thermo-mechanical fatigue (TMF) loadings on Nb and Mo containing 15Cr stainless steel, which is used for exhaust manifolds in automobiles. The test temperatures ($T_{i}$) of the isothermal LCF were 600 and $800^{\circ}C$. The minimum temperature of the TMF test was $100^{\circ}C$ and the maximum temperaures ($T_{p}$) were varied between 500 and $800^{\circ}C$. In both loading conditions, weak cyclic softening is observed at $T_{i}=T_{p}=800^{\circ}C$, but the transition to strong cyclic hardening is completed with the temperature decrease below $T_i=600{\sim}700^{\circ}C$ for LCF and $T_{p}=500{\sim}600^{\circ}C$ for TMF. The stress-strain hysteresis loops in the TMF loading show a significant stress relaxation during compressive (heating) half cycle at $T_{p}>500^{\circ}C$, which develops tensile mean stress during cycling. Due to the stress relaxation, the TMF test sample reveals much lower dislocation density than the isothermally fatigued sample at the same temperature with $T_{p}$. A detailed correlation between fatigue microstructure and cycling deformation behavior is discussed.

High Temperature Deformation Behavior of Sc Added Al-7.7wt%Zn-2.0wt%Mg-1.9wt%Cu Alloy (Sc을 첨가한 Al-7.7wt%Zn-2.0wt%Mg-1.9wt%Cu합금의 고온 변형거동)

  • Woo, Kee-Do;Ryu, Yong-Seok;Kim, Sug-Won;Deliang Zhang
    • Korean Journal of Materials Research
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    • v.13 no.12
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    • pp.819-824
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    • 2003
  • The Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy exhibited excellent elongation by the new thermomechanical treatment (TMT) process; solution treatment and furnace cooling\longrightarrowhot and cold rolling and then annealing for short time. Tensile test at high temperature from 430 to $500^{\circ}C$ has been performed with various strain rates using for the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy obtained by the TMT process. The elongation of the Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc was 550% tensile tested at $470^{\circ}C$ temperature and 2.2 $\times$ $10^{-3}$ $s^{-1}$ strain rate. The m value of Al-7.7Zn-2.0Mg-1.9Cu-0.1Zr-0.1Sc alloy deformed 85% increased from 0.33 to 0.46 with increasing total elongation. This new TMT process was very simple and easy to make the sheets in the company.

Stochastic dynamic instability response of piezoelectric functionally graded beams supported by elastic foundation

  • Shegokara, Niranjan L.;Lal, Achchhe
    • Advances in aircraft and spacecraft science
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    • v.3 no.4
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    • pp.471-502
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    • 2016
  • This paper presents the dynamic instability analysis of un-damped elastically supported piezoelectric functionally graded (FG) beams subjected to in-plane static and dynamic periodic thermomechanical loadings with uncertain system properties. The elastic foundation model is assumed as one parameter Pasternak foundation with Winkler cubic nonlinearity. The piezoelectric FG beam is subjected to non-uniform temperature distribution with temperature dependent material properties. The Young's modulus and Poison's ratio of ceramic, metal and piezoelectric, density of respective ceramic and metal, volume fraction exponent and foundation parameters are taken as uncertain system properties. The basic nonlinear formulation of the beam is based on higher order shear deformation theory (HSDT) with von-Karman strain kinematics. The governing deterministic static and dynamic random instability equation and regions is solved by Bolotin's approach with Newmark's time integration method combined with first order perturbation technique (FOPT). Typical numerical results in terms of the mean and standard deviation of dynamic instability analysis are presented to examine the effect of slenderness ratios, volume fraction exponents, foundation parameters, amplitude ratios, temperature increments and position of piezoelectric layers by changing the random system properties. The correctness of the present stochastic model is examined by comparing the results with direct Monte Caro simulation (MCS).

Effect of Thermomechanical Treatment on the Phase Transformation and Superelasticity in Ti-Ni-Cu Shape Memory Alloy (Ti-Ni-Cu 형상기억합금의 상변태 및 초탄성에 미치는 가공열처리의 영향)

  • Lee, O.Y.;Park, Y.K.;Chun, B.S.
    • Journal of the Korean Society for Heat Treatment
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    • v.7 no.4
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    • pp.253-261
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    • 1994
  • Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

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Continuous Cooling Transformation, Microstructure and Mechanical Properties of High-Strength Low-Alloy Steels Containing B and Cu (B과 Cu가 포함된 고강도 저합금강의 연속냉각 변태와 미세조직 및 기계적 특성)

  • Hwang, Byoungchul
    • Korean Journal of Materials Research
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    • v.23 no.9
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    • pp.525-530
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    • 2013
  • This study investigated the continuous cooling transformation, microstructure, and mechanical properties of highstrength low-alloy steels containing B and Cu. Continuous cooling transformation diagrams under non-deformed and deformed conditions were constructed by means of dilatometry, metallographic methods, and hardness data. Based on the continuous cooling transformation behaviors, six kinds of steel specimens with different B and Cu contents were fabricated by a thermomechanical control process comprising controlled rolling and accelerated cooling. Then, tensile and Charpy impact tests were conducted to examine the correlation of the microstructure with mechanical properties. Deformation in the austenite region promoted the formation of quasi-polygonal ferrite and granular bainite with a significant increase in transformation start temperatures. The mechanical test results indicate that the B-added steel specimens had higher strength and lower upper-shelf energy than the B-free steel specimens without deterioration in low-temperature toughness because their microstructures were mostly composed of lower bainite and lath martensite with a small amount of degenerate upper bainite. On the other hand, the increase of Cu content from 0.5 wt.% to 1.5 wt.% noticeably increased yield and tensile strengths by 100 MPa without loss of ductility, which may be attributed to the enhanced solid solution hardening and precipitation hardening resulting from veryfine Cu precipitates formed during accelerated cooling.

A Study on the Superplasticity of Zn-Al Alloy using Dynamic Materials Model (동적재료모델을 이용한 Zn-Al 합금의 초소성 변형거동 연구)

  • Jung, J.Y.;Ha, T.K.;Chang, Y.W.
    • Transactions of Materials Processing
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    • v.18 no.4
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    • pp.317-322
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    • 2009
  • Superplastic deformation behavior of a Zn-0.3 wt.% Al was investigated. Grain sizes of $1{\mu}m$ and $10{\mu}m$ were obtained by a thermomechanical treatment. A series of load relaxation and tensile tests were conducted at various temperatures ranging from RT ($24^{\circ}C$) to $200^{\circ}C$. A large elongation of 1400% was obtained at room temperature in the specimens with the grain size of $1{\mu}m$. In the case of specimens with the grain size of $10{\mu}m$, relatively lower elongation at room temperature was obtained and, as the temperature increases above $100^{\circ}C$, a high elongation of about 400 % has been obtained at $200^{\circ}C$ under the strain rate of $2{\times}10^{-4}/s$. Dynamic materials model (DMM) has been employed to explain the contribution from GBS of Zn-Al alloy. Power dissipation efficiency for GBS was evaluated as above 0.4 and found to be very close to the unity as strain rate decreased and temperature increased, suggesting that GBS could be regarded as Newtonian viscous flow.

The Effect of Grain Size and Film Thickness on the Thermal Expansion Coefficient of Copper and Silver Thin Films (구리와 은 박막의 열팽창계수에 미치는 결정립 크기와 박막 두께의 영향)

  • Hwang, Seulgi;Kim, Youngman
    • Korean Journal of Metals and Materials
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    • v.48 no.12
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    • pp.1064-1069
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    • 2010
  • Thin films have been used in a large variety of technological applications such as solar cells, optical memories, photolithographic masks, protective coatings, and electronic contacts. If thin films experience frequent temperature changes, thermal stresses are generated due to the difference in the coefficient of thermal expansion between the film and substrate. Thermal stresses may lead to damage or deformation in thin film used in electronic devices and micro-machined structures. Thus, knowledge of the thermomechanical properties of thin films, such as the coefficient of thermal expansion, is an important issue in determining the stability and reliability of the thin film devices. In this study, thermal cycling of Cu and Ag thin films with various microstructures was employed to assess the coefficient of thermal expansion of the films. The result revealed that the coefficient of thermal expansion (CTE) of the Cu and Ag thin films increased with an increasing grain size. However, the effect of film thickness on the CTE did not show a remarkable difference.

Thermomechanical and electrical resistance characteristics of superfine NiTi shape memory alloy wires

  • Qian, Hui;Yang, Boheng;Ren, Yonglin;Wang, Rende
    • Smart Structures and Systems
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    • v.30 no.2
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    • pp.183-193
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    • 2022
  • Structural health monitoring and structural vibration control are multidisciplinary and frontier research directions of civil engineering. As intelligent materials that integrate sensing and actuation capabilities, shape memory alloys (SMAs) exhibit multiple excellent characteristics, such as shape memory effect, superelasticity, corrosion resistance, fatigue resistance, and high energy density. Moreover, SMAs possess excellent resistance sensing properties and large deformation ability. Superfine NiTi SMA wires have potential applications in structural health monitoring and micro-drive system. In this study, the mechanical properties and electrical resistance sensing characteristics of superfine NiTi SMA wires were experimentally investigated. The mechanical parameters such as residual strain, hysteretic energy, secant stiffness, and equivalent damping ratio were analyzed at different training strain amplitudes and numbers of loading-unloading cycles. The results demonstrate that the detwinning process shortened with increasing training amplitude, while austenitic mechanical properties were not affected. In addition, superfine SMA wires showed good strain-resistance linear correlation, and the loading rate had little effect on their mechanical properties and electrical resistance sensing characteristics. This study aims to provide an experimental basis for the application of superfine SMA wires in engineering.