• 한국재료학회지
• /
• 제27권1호
• /
• pp.53-61
• /
• 2017

Magnesium alloys are of emerging interest in the automotive, aerospace and electronic industries due to their light weight, high specific strength, damping capacity, etc. However, practical applications are limited because magnesium alloys have poor formability at room temperature due to the lack of slip systems and the formation of basal texture, both of which characteristics are attributed to the hcp crystal structure. Fortunately, many magnesium alloys, even commercialized AZ or ZK series alloys, exhibit superplastic behavior and show very large tensile ductility, which means that these materials have potential application to superplastic forming (SPF) of magnesium alloy sheets. The SPF technique offers many advantages such as near net shaping, design flexibility, simple process and low die cost. Superplasticity occurs in materials having very small grain sizes of less than $10{\mu}m$ and these small grains in magnesium alloys can be achieved by thermomechanical treatment in conventional rolling or extrusion processes. Moreover, some coarse-grained magnesium alloys are reported to have superplasticity when grain refinement occurs through recrystallization during deformation in the initial stage. This report reviews the characteristics of superplastic magnesium alloys with high-strain rate and coarse grains. Finally, some examples of SPF application are suggested.

• Metals and materials international
• /
• 제24권6호
• /
• pp.1333-1345
• /
• 2018

The effect of manganese sulfide (MnS) inclusions on the machinability of free-cutting steel is based on their morphology, size and distribution. Furthermore, the plasticity of MnS is high during the hot working caused different characterization of MnS. In this study, the deformation behavior of MnS in 1215MS steel after a thermomechanical process was investigated at 1323 K. The microstructures of MnS inclusions were characterized by optical microscopy, scanning electron microscopy, energy-dispersive spectrometry, and electron backscattering diffraction (EBSD). As the thickness reduction of the inclusions increased from 10 to 70%, their average aspect ratio increased from 1.20 to 2.39. In addition, the deformability of MnS inclusions was lower than that of the matrix. The possible slip systems of A, B, C, and D plane traces were (${\bar{1}}0{\bar{1}}$)[${\bar{1}}01$], ($10{\bar{1}}$)[101], (011)[$01{\bar{1}}$], and (110)[$1{\bar{1}}0$]. Furthermore, the EBSD measurements suggested that slip planes in MnS inclusions occur on {110} planes.

• 대한금속재료학회지
• /
• 제49권7호
• /
• pp.541-548
• /
• 2011

Thermomechanical fatigue (TMF) behavior of heat resistant austenitic stainless steel was evaluated in the temperature range from 100$^{\circ}C$ to peak temperatures of 600 to 800$^{\circ}C$; The fatigue lives under TMF conditions were plotted against the plastic strain range and the dissipated energy per cycle. In the expression of the inelastic strain range versus fatigue life, the TMF data obtained at different temperature ranges were located close to a single line with a small deviation; however, when the dissipated energy per cycle, calculated from the area of the stress-strain hysteresis loops at the half of the fatigue life, was plotted against the fatigue life, the data showed greater scattering than the TMF life against the inelastic strain range. A noticeable stress relaxation in the stress-strain hysteresis curve took place at the peak temperatures higher than 700$^{\circ}C$, but all specimens in this study exhibited cyclic hardening behavior with TMF cycles. Recrystallization occurred during the TMF cycle concurrent with the formation of fine subgrains in the recrystallized region, which is considered to cause the cyclic hardening of the steel.

• 한국정밀공학회지
• /
• 제10권3호
• /
• pp.198-204
• /
• 1993

The study is concerned with finite element analysis and design of axisymmetric deep drawing by local heating. When the bottom shape of a cup is not flat but in complex-shaped, i.e., hemispherical, the cup cannot be drawn in one or two processes in the conventional deep drawing process and the limit drawing ratio is limited as well. By introducing local heating selectively with regards to the heating position, the formability of the sheet metal can be greatly increased with the reduced number of processes. In the Process analysisthe rigid- viscoplastic finite element method is employed and the temperature effect is incorporated. Bishop's step-wise decoupled method is employed to analyze the thermomechanical interaction between deformation and heat transfer. Axisymmetric deep drawing of a hemisphere-bottomed cup has been analyzed for various combinations of heat application in the punch and the die. At the first stage of deep drawing stretch forming is practically carried out by firmly pressing the blankholder with the punch and the die heated at various levels of temperature. Then at the second stage the same cup is drawn for the saame or different combination of temperature. From the computation, it has thus been shown that the fromability of a cup is greatly increased in two-stage deep drawing with increased limet drawing ratio.

• 대한기계학회논문집A
• /
• 제23권6호
• /
• pp.1001-1010
• /
• 1999

Thermo-mechanical behavior of discontinuous shape memory alloy(SMA) reinforced polymeric composite has been studied using modified shear lag theory and finite element(FE) analysis with 2-D multi-fiber model. The aligned and staggered models of short-fiber arrangement are employed. The effects of fiber overlap and aspect ratio on the thermomechanical responses such as the thermal expansion coefficient are investigated. It is found that the increase of both tensile stress(resistance stress) in SMA fiber and compressive stress in polymer matrix with increasing aspect ratio is the main cause of low thermal deformation of the composite.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1995년도 추계학술대회 논문집
• /
• pp.219-222
• /
• 1995

The objective of this study is to demonstrate the ability of a computer simulation of microstructural evolution in hot forging of C-Mn steels. The finite element method is applied to the prediction of the microstructural evolution, and it should be coupled with heat transfer analysis to consider the change of thermomechanical properties during the deformation. In this study, Yada's recrystallization model and rigid-thermoviscoplastic finite element method were employed in order to analyze microstructural evolution during hot forging process. To show the validity and effectveness of the proposed method, the experiment of hot compression process was accomplished and the results of experiment were compared with those of simulation. Consequently, this approach shows a good agreement with experimental results.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 1999년도 춘계학술대회논문집
• /
• pp.249-252
• /
• 1999

A numerical analysis was perfomed to predict flow curves and dynamic recrystallization behaviors of Al-5%Mg alloy on the basis of results of hot compression tests. The hot compression tests were carried out in the ranges of 350-50$0^{\circ}C$ and 5$\times${{{{ {10 }^{-3 } }}}}~3$\times${{{{ {10 }^{0 } }}}}/sec to obtain the Zener-Hollmon parameter. In the modelling equation the effects os strain hardening and dynamic recrystallization were taken into consideration. A model for predicting the evolution of microstructure in Al-5%Mg alloy during thermomechanical processing was developed in terms of dynamic recrystallization phenomena, The microstructure model was combined with finite element modeling(FEM) to predict microstructure development Model predictions showed good agreement with microstructures obtained in compression tests.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 추계학술대회
• /
• pp.1027-1032
• /
• 2003

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.

• 한국전산구조공학회:학술대회논문집
• /
• 한국전산구조공학회 2007년도 정기 학술대회 논문집
• /
• pp.415-420
• /
• 2007

In analyzing the nano-scale behavior of nano devices or materials, QC method is efficient because it does not treat all the atoms. But for more accurate analysis in QC method, it is important to consider temperature and surface effects. In finite temperature, free energy is considered instead of potential energy. Because the surface area to volume ratio increases as the length scale of a body decreases, the surface effects are more dominant. In this paper, temperature related Cauchy-Born rule and surface Cauchy-Born rule are proposed to configurate the strain energy density. This method is applied to small and homogeneous deformation in two dimensional problem using finite element simulation.

• Coupled systems mechanics
• /
• 제8권5호
• /
• pp.415-437
• /
• 2019

The present research deals with two-dimensional axisymmetric deformation in transversely isotropic magneto thermoelastic solid with and without energy dissipation, with two temperature and time-harmonic source. The proposed model is helpful for finding the type of relations between mechanical and thermal fields as most of the structural elements of heavy industries are frequently related to mechanical and thermal stresses at a higher temperature. The Hankel transform has been used to find a solution to the problem. The displacement components, stress components, and temperature distribution with the horizontal distance in the physical domain are calculated numerically. The effect of time-harmonic source and two temperature is depicted graphically on the resulting quantities.