• 터널과지하공간
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• 제31권4호
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• pp.289-308
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• 2021

본 연구에서는 열-수리-역학적 복합거동 수치해석을 활용하여 국내 고준위방사성폐기물 처분장의 완충재의 설계 기준 온도가 100℃ 및 125℃인 경우, 처분 간격에 따른 처분시스템의 최고 온도를 계산하고, 역학적 안정성을 확보하기 위한 암반의 조건을 도출하였다. 완충재의 설계 기준 온도를 현재와 같이 100℃로 유지할 때, 처분터널 간격이 40 m, 처분공 간격이 5.5 m인 경우와 처분터널 간격이 30 m, 처분공 간격이 6.5 m인 경우, 처분용기와 완충재가 접하는 점에서 최고 온도가 각각 99.4℃ 및 99.8℃로 계산되었다. 완충재의 설계 기준 온도를 125℃로 향상시킨 경우, 처분터널 간격을 30 m, 처분공 간격을 4.5 m까지 감소시켜 처분 면적을 KRS⁺ 기반 처분시스템 대비 55%까지 감소시킬 수 있었다. 다양한 처분 간격에 대해 암반에서의 역학적 안정성을 평가한 결과, 암반파괴가 발생하지 않기 위해서는 KRS⁺ 기반 처분시스템은 암반의 RMR 분류법의 Good rock에 해당하는 RMR 72.4 이상의 조건이어야 했다. 처분 간격이 감소할수록 암반의 RMR이 더 높아야 했으며, 처분터널 간격 30 m, 처분공 간격 4.5 m인 경우에는 RMR 87.3 이상이 되어야 암반의 파괴를 방지할 수 있었다. 그러나, 처분 이후 지하수 유입 시 벤토나이트 완충재 및 뒤채움재의 팽윤에 따른 구속압에 의한 암반 강도의 증가를 고려하면, 해석을 수행한 모든 처분 간격에 대해 암반의 RMR이 75 이상이면 역학적 안정성을 확보할 수 있었다.

• 한국융합학회논문지
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• 제9권4호
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• pp.151-160
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• 2018

야외 철제 조각 작품 표면 보존용 코팅제로 사용되고 있는 왁스는 대기의 오염과 산성비 등에 의해 노화되어 코팅력이 저하되고 백화현상이 발생하며, 이로 인해 보존처리 후 짧은 시간 내에 재 부식이 발생한다. 또한 색상 및 광택 변화가 일어나 작품 본래의 특성을 잃어버리는 등의 문제점이 나타나고 있어 융합 연구를 통해 기존 재료보다 성능이 개선된 왁스를 개발하고자 하였으며, 염수 분무, 가스 부식 실험 등의 환경실험과 광택도, 열 중량 분석을 통해 물성 효과를 확인하였다. 실험 결과 개발된 ISC왁스는 기존 왁스에 비해 염수로부터 5배 이상의 우수한 차단성과 코팅 지속력을 보여주었으며, 2~4배 이상의 내산성, 2~10배 이상의 자외선 차단성, 3~16배 이상의 증진된 광택 변화량, 0.5~5배 이상의 내열성과 내구성 등을 나타내 기존 왁스 보다 우수한 코팅 효과를 나타내었다. 이러한 결과로 보아 야외 철제 조각 작품 보존처리에 사용되어 온 기존의 왁스를 대체할 수 있는 재료로 판단된다.

• 폴리머
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• 제36권4호
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• pp.525-530
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• 2012

본 연구에서는 다양한 조성의 스티렌(styrene, St)과 3-(trimethoxy)propyl methacrylate(TMSPM)를 poly(ethylene-co-tetrafluoroethylene)(ETFE) 필름에 방사선 동시조사법으로 그래프트시킨 후 졸-젤 반응 및 설폰화 반응을 진행하여 실란 가교된 유/무기 복합막을 제조하였다. 졸-젤 반응을 통해 형성된 실란 가교 구조는 Fourier transform infrared spectroscopy(FTIR) 및 thermo gravimetric analysis(TGA)를 사용하여 관찰하였다. 설폰화 관능기를 도입하여 막을 제조한 후 유사한 이온교환용량을 가지면서 TMSPM의 함량이 다른 연료전지막을 선별하여 함수율, 치수 안정성, 수소이온전도도 등의 물성을 측정하였다. 또한 제조된 유/무기 복합막을 이용하여 membrane electrode assemblies(MEA)를 제조한 후 단위전지 성능을 평가하였다.

• 대한금속재료학회지
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• 제49권11호
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• pp.882-892
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• 2011

The influence of rhenium (Re) and ruthenium (Ru) addition on the solidification and solute redistribution behaviors in advanced experimental Ni-base superalloys has been investigated. A series of model alloys with different levels of Re and Ru were designed based on the composition of Ni-6Al-8Ta and were prepared by vacuum arc melting of pure metallic elements. In order to identify the influence of Re and Ru addition on the thermo-physical properties, differential scanning calorimetry analyses were carried out. The results showed that Re addition marginally increases the liquidus temperature of the alloy. However, the ${\gamma}^{\prime}$ solvus was significantly increased at a rate of $8.2^{\circ}C/wt.%$ by the addition of Re. Ru addition, on the other hand, displayed a much weaker effect on the thermo-physical properties or even no effect at all. The microsegregation behavior of solute elements was also quantitatively estimated by an electron probe microanalysis on a sample quenched during directional solidification of primary ${\gamma}$ with the planar solid/liquid interface. It was found that increasing the Re content gradually increases the microsegregation tendency of Re into the dendritic core and ${\gamma}^{\prime}$ forming elements, such as Al and Ta, into the interdendritic area. The strongest effect of Ru addition was found to be Re segregation. Increasing the Ru content up to 6 wt.% significantly alleviated the microsegregation of Re, which resulted in a decrease of Re accumulation in the dendritic core. The influence of Ru on the microstructural stability toward the topologically close-packed phase formation was discussed based on Scheil type calculations with experimentally determined microsegregation results.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Geomechanics and Engineering
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• 제16권4호
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• pp.363-373
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• 2018

The evaluation of Thermo-Hydro-Mechanical (THM) coupling behavior is important for the development of underground space for various purposes. For a high-level radioactive waste repository excavated in a deep underground rock mass, the accurate prediction of the complex THM behavior is essential for the long-term safety and stability assessment. In order to develop reliable THM analysis techniques effectively, an international cooperation project, Development of Coupled models and their Validation against Experiments (DECOVALEX), was carried out. In DECOVALEX-2015 Task B2, the in situ THM experiment that was conducted at Horonobe Underground Research Laboratory(URL) by Japan Atomic Energy Agency (JAEA), was modeled by the research teams from the participating countries. In this study, a THM coupling technique that combined TOUGH2 and FLAC3D was developed and applied to the THM analysis for the in situ experiment, in which rock, buffer, backfill, sand, and heater were installed. With the assistance of an artificial neural network, the boundary conditions for the experiment could be adequately implemented in the modeling. The thermal, hydraulic, and mechanical results from the modeling were compared with the measurements from the in situ THM experiment. The predicted buffer temperature from the THM modelling was about $10^{\circ}C$ higher than measurement near by the overpack. At the other locations far from the overpack, modelling predicted slightly lower temperature than measurement. Even though the magnitude of pressure from the modeling was different from the measurements, the general trends of the variation with time were found to be similar.

• KSBB Journal
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• 제13권5호
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• pp.502-510
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• 1998

Stabilization of antibody, which is specific to Salmonella typhimurium antigens, present in dry states on membranes was accomplished, and its shelf-life, i.e., duration for maintaining minimum 90% of the initial activity, under optimal conditions was determined. To prepare two major components of an immuno-strip, the antibody was not only immobilized on nitrocellulose membrane surfaces but also placed within the pores of glass fiber membrane after conjugating it with old colloids as signal generator. Among potential stabilizers of the immuno-components, a disaccharide, trehalose, showed a significant protection effect of immunoglobulin structure from thermal energy. Optimal concentrations of trehalose for the respective component were significantly different (8-fold higher for the antibody-gold conjugate than for the immobilized antibody), which probably resulted from distinct densities and configurations of antibody present on the membranes. An additional requirement for the gold conjugate was freeze-drying of this substance such that the conjugate can be readily resolubilized upon contact with aqueous medium. By using the components prepared under optimal conditions, immuno-strips were constructed and exposed to thermal energy. Signals with less than 10% decrease in the intensity were maintained for approximately 21 days at 60$^{\circ}C$. Compared to previous reports, this result represented a 2-year shelf-life at room temperature. it was, however, two times longer if determined from thermal acceleration tests based on the theory of inactivation rate of protein. Such discrepancy between the two estimates could be mainly attributed to errors in accurately controlling temperatures and also to changes in the physical properties of membranes due to a high thermal energy.

• 한국항공우주학회지
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• 제39권10호
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• pp.952-958
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• 2011

우주용 영상센서의 비균일 출력특성 교정을 통한 영상품질향상을 목적으로 하는 탑재교정장치는 균일한 온도정보 제공을 위한 흑체, 교정임무 수행 중 흑체 지향을 위해 전개 및 수납 기능을 갖는 교정용 구동미러 그리고 상기 구성품의 제어를 담당하는 탑재교정장치 제어용 전장유닛으로 구성된다. 탑재교정장치 제어용 전장품의 발사 및 궤도환경에서의 구조건전성 확보를 위해 소자 납땜부에 대한 열탄성 해석과 피로파괴 이론에 기초한 구조 열해석을 실시하였으며, 이를 통하여 전장품의 구조 건전성을 평가하였다. 본 논문에서는 전자기판에 장착된 소자별 안전성 검토를 위해 일반적으로 적용되는 해석적 방법과 FEM으로부터 도출된 결과를 비교 및 검토하여 피로파괴 이론에 기초한 구조 건전성 예측이 유용함을 입증하였다.

• 터널과지하공간
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• 제17권6호
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• pp.475-483
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• 2007

에너지원으로서 LNG 수요뿐 아니라 온실가스인 이산화탄소의 처분에 대한 필요성이 점차 증가되고 있어, 이를 위한 많은 저장시설이 요구된다. 이러한 저장시설은 안전성과 국토의 효율적 이용 등으로 인하여 지하화하는 경향이 있다. 이와 같은 온도특성을 고려해야하는 물질에 대한 지하저장시설의 건설에 있어서, 암석의 열물성은 열역학적 특성과 함께 저장시설의 설계 및 유지관리를 위한 중요한 요소이다. 본 연구에서는 암석입자의 크기와 실험온도범위를 고려하여 스트레인 게이지를 이용하여 암석의 열팽창계수를 실험적으로 측정하였다. 실험결과 열팽창계수는 온도가 내려감에 따라 감소하였으며, 국내 대표암석인 화강암에 대한 선열팽창계수의 온도관계식을 제안할 수 있었다. 본 연구에서 수행된 온도변화에 따른 시험결과는 지하저장소의 열역학적 안정성 해석과 열전파 특성을 규명하기 위한 해석에 주요 자료로 활용될 수 있을 것이다.