• 제목/요약/키워드: Thermally conductive polymer

검색결과 25건 처리시간 0.027초

A Review on Thermal Conductivity of Polymer Composites Using Carbon-Based Fillers : Carbon Nanotubes and Carbon Fibers

  • Hong, Jin-Ho;Park, Dong-Wha;Shim, Sang-Eun
    • Carbon letters
    • /
    • 제11권4호
    • /
    • pp.347-356
    • /
    • 2010
  • Recently, the use of thermal conductive polymeric composites is growing up, where the polymers filled with the thermally conductive fillers effectively dissipate heat generated from electronic components. Therefore, the management of heat is directly related to the lifetime of electronic devices. For the purpose of the improvement of thermal conductivity of composites, fillers with excellent thermally conductive behavior are commonly used. Thermally conductive particles filled polymer composites have advantages due to their easy processibility, low cost, and durability to the corrosion. Especially, carbon-based 1-dimensional nanomaterials such as carbon nanotube (CNT) and carbon nanofiber (CNF) have gained much attention for their excellent thermal conductivity, corrosion resistance and low thermal expansion coefficient than the metals. This paper aims to review the research trends in the improvement of thermal conductivity of the carbon-based materials filled polymer composites.

Preparation of Solventless UV Curable Thermally Conductive Pressure Sensitive Adhesives and Their Adhesion Performance

  • Baek, Seung-Suk;Park, Jinhwan;Jang, Su-Hee;Hong, Seheum;Hwang, Seok-Ho
    • Elastomers and Composites
    • /
    • 제52권2호
    • /
    • pp.136-142
    • /
    • 2017
  • Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

열 전도성 고분자 복합재료의 개발 동향 (Trends in Development of Thermally Conductive Polymer Composites)

  • 홍진호;심상은
    • 공업화학
    • /
    • 제21권2호
    • /
    • pp.115-128
    • /
    • 2010
  • 마이크로 프로세서 및 항공 우주산업의 기술 발전에 따른 냉각 조건이 까다로워짐에 따라 각종 산업에서 열 전도 향상을 통한 기기 내에서 외부로의 열 배출은 최근 각광을 받고 있다. 특히 열 전도성 고분자 복합재료의 경우 매우 다양한 물질을 사용하여 그 요구조건에 맞는 부품의 생산이 가능하고 가공 편의성으로 인한 마이크로 부품에서부터 큰 부속품까지 그 사용 범위가 넓다. 방열 소재로 사용되는 고분자 복합재료의 열전도도 예측 모델 식을 알아보고 방열 소재에 대해 알아보며 상업적으로 많이 사용되고 있는 충전제에 대해 다룬다. 또한 최근의 고분자 복합재료 방열소재의 동향에 대해 알아본다.

육방정 질화붕소 나노입자의 결정성에 미치는 불화칼슘 첨가의 영향 (Effect of CaF2 Addition on the Crystallinity of Hexagonal Boron Nitride Nanoparticles)

  • 정재용;김양도;김영국
    • 대한금속재료학회지
    • /
    • 제56권12호
    • /
    • pp.915-920
    • /
    • 2018
  • With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

세라믹 방열 복합체의 열전도도 분석 및 Wetting Process를 이용한 SiC/에폭시 복합체 (Thermal Conductivity of Thermally Conductive Ceramic Composites and Silicon Carbide/Epoxy Composites through Wetting Process)

  • 황용선;김주헌;조원철
    • 폴리머
    • /
    • 제38권6호
    • /
    • pp.782-786
    • /
    • 2014
  • 세라믹 방열 복합체의 특성 비교를 위해 casting method로 제작하였으며, 이들의 광학적 이미지와 단면 FE-SEM 분석을 실시하였다. 각각의 복합체의 열전도성 특성을 비교 분석하였으며, silicon carbide(SiC)의 분산도 문제를 해결하기 위해 wetting process를 도입하여 SiC/epoxy 복합체를 제작하였다. 기존의 방법에서 발견된 복합체 내공극과 분산도 문제가 wetting process를 통해 향상되었으며, 충전제 함량에 따른 열전도성 특성을 분석하였다. SiC 복합체의 함량에 따른 공극률 해석을 통해 70 wt% SiC 복합체에서 가장 높은 열전도도 값을 보였으며, 이들의 단면 FE-SEM 분석을 통해 복합체 내의 충전제 분산도를 확인하였다.

열전도성 고분자 복합소재/금속 소재 하이브리드 구조의 방열기구 설계 및 방열특성에 관한 연구 (A study on the design and cooling of the heat sink with hybrid structure of conductive polymer composite and metal)

  • 유영은;김덕종;윤재성;박시환
    • Design & Manufacturing
    • /
    • 제10권3호
    • /
    • pp.14-19
    • /
    • 2016
  • Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

탄소재료가 내첨된 열전도성 복합재의 연구 동향 (Research Trends in Thermally Conductive Composites Filled with Carbon Materials)

  • 안동해;김경훈;김지욱;이영석
    • 공업화학
    • /
    • 제31권1호
    • /
    • pp.73-83
    • /
    • 2020
  • 전자기기의 고도화 및 소형화에 따라, 기기의 효율 및 수명에 영향을 미치는 발열 문제를 해결하는 것은 가장 큰 해결 난제 중 하나가 되었다. 이를 해결하기 위하여 금속 및 세라믹 기반의 높은 열전도도를 가지는 재료가 많이 사용되어 왔으나, 낮은 기계적 물성 및 높은 중량으로 인해 가벼우면서도 기계적 특성이 좋은 고분자를 기지재로 사용하고 높은 열전도도를 갖는 탄소재료를 필러로 사용한 열전도성 복합재가 주목받고 있다. 열전도성 복합재의 열전도도를 향상시키기 위해서는 효과적인 포논의 이동이 이루어지도록 포논 산란이 억제되야한다. 본 논문에서는 탄소재료/고분자 복합재의 포논 이동 및 산란 억제에 관련된 연구를 분류하고, 열전도도 향상을 위하여 적용된 다양한 방법들에 대하여 논의하였다.

Thermal Conductivity and Adhesion Properties of Thermally Conductive Pressure-Sensitive Adhesives

  • Kim, Jin-Kon;Kim, Jong-Won;Kim, Myung-Im;Song, Min-Seok
    • Macromolecular Research
    • /
    • 제14권5호
    • /
    • pp.517-523
    • /
    • 2006
  • The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.

육방정 질화붕소 나노입자 합성 및 열전도성 복합체 응용 (Synthesis of Hexagonal Boron Nitride Nanocrystals and Their Application to Thermally Conductive Composites)

  • 정재용;김양도;신평우;김영국
    • 한국분말재료학회지
    • /
    • 제23권6호
    • /
    • pp.414-419
    • /
    • 2016
  • Much attention has been paid to thermally conductive materials for efficient heat dissipation of electronic devices to maintain their functionality and to support lifetime span. Hexagonal boron nitride (h-BN), which has a high thermal conductivity, is one of the most suitable materials for thermally conductive composites. In this study, we synthesize h-BN nanocrystals by pyrolysis of cost-effective precursors, boric acid, and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, h-BN nanoparticles with diameters of ~80 nm are synthesized. We demonstrate that the addition of small amounts of Eu-containing salts during the preparation of melamine borate precursors significantly enhanced the crystallinity of h-BN. In particular, addition of Eu assists the growth of h-BN nanoplatelets with diameters up to ~200 nm. Polymer composites containing both spherical $Al_2O_3$ (70 vol%) and Eu-doped h-BN nanoparticles (4 vol%) show an enhanced thermal conductivity (${\lambda}{\sim}1.72W/mK$), which is larger than the thermal conductivity of polymer composites containing spherical $Al_2O_3$ (70 vol%) as the sole fillers (${\lambda}{\sim}1.48W/mK$).