• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1644-1646
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• 1998

High-Smokestacks have been the symbol of the thermal power plant. Those cause the thermal power plant to be damaged by lightening for reaching several hundreds meter. In this paper, we investigated the accident of low-voltage source circuit due to grounding potential rise by lightening via high-smokestack in practically driving power plant, described examination into the cause and the impulse analysis. We analysed the transient voltage by EMTP(ElectroMagnetic Transient Program) via modeling the grounding system of power plant. This theoretical results coincided with practical accidental state. Therefore, it was verified that we could apply the grounding system of power plant and substation with the distribution-circuit analysis(EMTP).

• Korean Journal of Materials Research
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• v.28 no.12
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• pp.696-701
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• 2018

This study is carried out to evaluate the commercial feasibility of the room temperature and thermal polymerization method as a lens manufacturing method. All samples are found to be transparent after polymerization, thereby indicating that their physical and surface properties are suitable for hydrogel ophthalmic lenses. The optical and physical properties of the lenses are compared. The water content of the samples that are prepared via a room temperature polymerization process decreases with the addition of MMA as compared to the water content of the samples that are prepared via thermal polymerization. When MMA and DMA are used as an additive for improving functionality, the wettability of the lenses increases. By measuring the AFM, the surface roughness is shown to improve more than MMA and DMA. Therefore, it is judged to be an appropriate process for manufacturing hydrogel lenses with high functionality.

• Advances in nano research
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• v.13 no.6
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• pp.561-574
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• 2022

The stability of protein tissues and protein fibers in the human muscle is investigated in the presented paper. The protein fibers are modeled via tube structures embedded in others proteins fibers like the elastic substrate. Physical sport and physical exercise play an important role in the stability of synthesis and strength of the protein tissues. In physical exercise, the temperature of the body increases, and this temperature change impacts the stability of the protein tissues, which is the aim of the current study. The mathematical simulation of the protein tissues is done based on the mechanical sciences, and the protein fibers are modeled via wire structures according to the high-order theory beams. The thermal stress due to the conditions of the sport is applied to the nanoscale protein fibers, then the stability regarding the frequency analysis is investigated. Finally, the impact of temperature change, physical exercise, and small-scale parameters on the stability of the protein tissues are examined in detail.

• Geomechanics and Engineering
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• v.28 no.5
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• pp.455-461
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• 2022

Numerical assessment of the dynamic stability behavior of nonlocal beams rested on elastic foundation has been provided in the present research. The beam is made of fucntional graded (FG) porous material and is exposed to thermal and humid environments. It is also consiered that the beam is subjected to axial periodic mechanical load which especific exitation frequency leading to its instability behavior. Beam modeling has been performed via a two-variable theory developed for thick beams. Then, nonlocal elasticity has been used to establish the governing equation which are solved via Chebyshev-Ritz-Bolotin method. Temperature and moisture variation showed notable effects on stability boundaries of the beam. Also, the stability boundaries are affected by the amount of porosities inside the material.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.4
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• pp.481-488
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• 1999

A thermal model based on the chamber geometry of the industry-standard AST SHS200MA rapid thermal processing system has been developed for the study of thermal uniformity and process repeatability thermal model combines radiation energy transfer directly from the tungsten-halogen lamps and the steady-state thermal conducting equations. Because of the difficulties of solving partial differential equation, calculation of wafer temperature was performed by using finite-difference approximation. The proposed thermal model was verified via titanium silicidation experiments. As a result, we can conclude that the thermal model show good estimation of wafer surface temperature distribution.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.47-56
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• 2015

In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical analysis using CAE (Computer Aided Engineering) software. For the characterization of the carbon CCL, it is compared with the conventional FR-4 core and Heavy Cu core. From research results, the deformation amount of the flexure strength of PCB is the highest with pitch grade carbon and thermal behavior of PCB is lowest as temperature increases. In addition, TC (Thermal Cycling), LLTS (Liquid-to-Liquid Thermal Shock) and Humidity tests have been applied in the PCB with carbon core and the reliability of PCB with carbon core is confirmed through reliability tests. Also, possibility of uneven surface of the via hole and wear of the drill bit due to the carbon fibers are analyzed. surface of the via hole is uniform, the surface of the drill bit is smooth. Therefore, it is proved that the carbon CCL has the drilling workability of the same level as conventional core material.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.29 no.3
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• pp.229-235
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• 2016

In this paper, a methodology, which is able to predict the thermal stresses accurately yet efficiently, is presented for beam structures via Saint-Venant's principle. In general, higher-order beam theories have been known to be effective for the prediction of thermal stresses. In contrast to this, we propose the method to predict the thermal stresses of beam structures by post-processing the classical beam theory via Saint-Venant's principle. The approach includes an out-of-plane warping displacement to account for the through-the-thickness thermal deformation. With this, one can accurately recover the thermal stresses as compared to the elasticity solutions. In fact, they are identical for the beams made of isotropic materials. The effect of out-of-plane warping is also investigated, it turns out that the effect is negligible in mechanical stress analysis but not in thermal stress analysis.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.316-322
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• 2014

With increase in demand for higher operating temperatures of gas turbines, extensive research efforts have been carried out to enhance the performance of thermal barrier coatings (TBCs) in the field of coating processing as well as materials. In this study, thermal barrier coatings in lanthanum/gadolinium zirconate system, which is one of the most promising candidates for replacing yttira-stabilized zirconia (YSZ) in thermal barrier coating applications, are fabricated via suspension plasma spray. Dense, $300{\sim}400{\mu}m$ thick coatings of fluoritephase zirconate with modest amount of segmented microstructures are obtained by using suspension plasma spray with suspensions of planetary-milled mixture between lanthanum and/or gadolinium oxide and nano zirconia. These coatings exhibit thermal conductivities of 1.6 ~ 1.7 W/mK at $1000^{\circ}C$, which is relatively lower than that of YSZ.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.19-23
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• 2012

Silicon substrate for light emitting diodes (LEDs) has been the tendency of LED packaging for improving power consumption and light output. In this study, a low cost and high throughput Si through via fabrication has been demonstrated using a wet etching process. Both a wet etching only process and a combination of wet etching and dry etching process were evaluated. The silicon substrate with Si through via fabricated by KOH wet etching showed a good electrical resistance (${\sim}5.5{\Omega}$) of Cu interconnection and a suitable thermal resistance (4 K/W) compared to AlN ceramic substrate.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1724-1725
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• 2011

본 논문에서는 LED 패키지의 방열문제를 해결하기 위해 FR4 PCB에 Via-hole을 형성함으로써 열전달 능력을 향상시키고자 하였다. 또한 FR4 PCB의 면적과 Via-hole 크기 및 수량을 변화를 주어 그에 따른 K-factor를 측정 하였으며 열 저항 특성을 분석하였다. 결과로서, Via-hole을 형성한 FR4 PCB의 경우 초기 면적이 증가함에 따라 열 저항 및 접합온도가 급격히 감소하는 특성을 보였으며 200 [mm2]에서 안정화 되는 특성을 보였다. 또한 PCB 면적 및 Via-hole을 형성함에 따라 광 출력이 최대 17% 향상 되었다. 따라서 접합온도 및 열 저항에 있어서 PCB면적의 증가 및 Via-hole을 구성함에 있어 열전달 능력을 향상시킬 수 있음을 확인하였다.