• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.699-700
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• 2013

Aluminum and hydrogen doped zinc oxide (AZHO) films were prepared by r.f. magnetron sputtering. The structural, electrical, and optical properties of the AHZO films were investigated in terms of the annealing conditions to study the thermal stability. The XRD measurements revealed that the degree of c-axis orientation was decreased and the crystallintiy of the films was deteriorated by the heat treatment. The electrical resistivity was significantly increased when the films were annealed at higher temperature. Although the optical transmittance of AHZO films didn't highly changed by heat treatment, the optical band gap was reduced, regardless of annealing temperature and duration. The thermal stability of AHZO films was worse compared to AZO films.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.53-58
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• 2013

Graphene-based polymer nanocomposites are very promising candidates for new high-performance materials that offer improved mechanical, barrier, thermal and electrical properties. Herein, an approach is presented to improve the mechanical, thermal and electrical properties of unsaturated polyester resin (UPR) by using graphene nano sheets (GNS). The extent of dispersion of GNS into the polymer matrix was also observed by using the scanning electron microscopy (SEM) which indicated homogeneous dispersion of GNS through the UPR matrix and strong interfacial adhesion between the GNS and UPR matrix were achieved in the UPR composite, which enhanced the mechanical properties. The tensile strength of the nanocomposites improved at a tune of 52% at a GNS concentration of 0.05%. Again the flexural strength also increased around 92% at a GNS concentration of 0.05%. Similarly the thermal properties and the electrical properties for the nanocomposites were also improved as evidenced from the differential scanning caloriemetry (DSC) and dielectric strength measurement.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.693-699
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• 2003

To improve thermal stability of Teflon FEP which is the most widely used materials for electret application, Teflon AF film of 1 $\mu\textrm{m}$ thick was spin coated on FEP film and the charge storage properties were investigated. The surface potential depend on aging temperature. Thermal Stimulated Current(TSC), Atomic Force Microscopy(AFM), and Fourier Transform-Infrared Spectroscope(FT-lR) measurements were carried out. It is shown that the AF/FEP dual film have more higher electrical property and thermal stability than that FEP film have caused by charge stored at interface of AF and FEP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.365-369
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• 2016

In this paper, we fabricated Cu/Mn alloy shunt resistor with low resistance and thermal stability for use of mobile electronic devices. We designed metal alloy composed of copper (Cu) and manganese (Mn) to embody in low resistance and low TCR which are conflict each other. Cu allows high electrical conductivity and Mn serves thermal stability in this Cu/Mn alloy system. We confirmed the elemental composition of the designed metal alloy system by using energy dispersive X-ray (EDX) analysis. We obtained low resistance below $10m{\Omega}$ and low temperature coefficient of resistance (TCR) below $100ppm/^{\circ}C$ from the designed Cu/Mn alloy resistor. And in order to minimize resistance change caused by alternative frequency on circuit, shape design of the metal alloy wire is performed by rolling process. Finally, we conclude that design of the metal alloy system was successfully done by alloying Cu and 3 wt% of Mn, and the Cu/Mn alloy resistor has low resistance and thermal stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.81-84
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• 2004

The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on coming glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then $10\;ppm/^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

• Bulletin of the Korean Chemical Society
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• v.22 no.7
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• pp.663-668
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• 2001

Thermodynamic and electrical functions of aminophenol and anthranilic acid complexes with Mn(Ⅱ), Fe(Ⅱ), Co(Ⅱ), Ni(Ⅱ) and Cu(Ⅱ) were determined. ΔG°, ΔH° and ΔS° were calculated with the help of stability constant values at different temperatures. It was found that the complexing processes have an exothermic nature. The studied complexes behave like semiconductors. The conduction takes place according to hopping mechanism. To show the composition of complexes conductometric and photometric titrations, IR spectra, thermal analysis and X-ray diffraction techniques were employed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.361-366
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• 2004

The interface stability of Ta-Mo alloy film on SiO$_2$ was investigated. Ta-Mo alloy films were formed by co-sputtering method, and the alloy composition was varied by controlling Ta and Mo sputtering power, When the atomic composition of Ta was about 91％, the measured work function was 4.24 eV that is suitable for NMOS gate. To identify interface stability between Ta-Mo alloy film and SiO$_2$, C-V and XRD measurements were performed on the samples annealed with rapid thermal processor between $600^{\circ}C$ and 90$0^{\circ}C$. Even after 90$0^{\circ}C$ rapid thermal annealing, excellent interface stability and electrical properties were observed. Also, thermodynamic analysis was studied to compare with experimental results.

• Progress in Superconductivity and Cryogenics
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• v.20 no.1
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• pp.19-22
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• 2018

The thermal and electrical properties of the conductor are critical parametersfor the design and optimization of the superconducting magnet. This paper presents simulation code to analyze electrical and thermal stability characteristics of the second generation (2G) high-temperature superconductor (HTS) by varying copper stabilizer thickness. Two types of commercial 2G HTS coated conductor tapes, YBCO and GdBCO were used in this study. These samples were cooled by Liquid Nitrogen ($LN_2$) having boiling at 77.3 K and an equivalent electrical circuit model for them is choosen and analysed in details. Also, an over-current pulse test in which a current exceeding a critical current was performed. From the simulation results, the influences of the copper stabilizer thickness on the stability characteristics of these samples are presented.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.168-170
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• 2001

The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on corning glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then 10 ppm/$^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1651-1656
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• 2017

This paper deals with the thermal and mechanical properties of ceramic coating material for bus bars. A ceramic coated samples were prepared for the mechanical properties test. There are two types of samples. One is a square shape and the other is a busbar shape. Each sample was deteriorated for 30 days to compare the thermal and mechanical properties with the non-degraded samples. Two thermal properties tests are TGA and flammability tests, and four mechanical properties tests are drop impact test, cross cut, tensile test, and bend test. The ceramic coating material was never damaged by impact and did not separate from aluminum in the cross cut test. In the tensile test, the breakage of the insulating material did not occur until aluminum fractured, and the breakage of the insulating material did not occur until the maximum load in the bending test. The decomposition temperature (melting point) of the ceramic coating material was higher than that of other epoxy insulators. This ceramic coating material is nonflammable and it has excellent fire stability.