• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.48-51
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• 1995

We have developed the three dimensional mesh generator for three dimensional process simulation using the FEM(Finite Element Method). Tetrahedron element construct the presented three dimensional mesh, which is suitable for the simulation of three dimensional behavior of the LOCOS. The simulation of thermal oxidation is one of the problem in scale downed semiconductor processes. As three dimensional simulators use the huge size of the memory, we use the efficient method that generates the new nodes inside the growing oxide and removes the nodes nearby the SiO2/Si interface in silicon. The resented three dimensional mesh generator was designed to be used in various process simulations, for instance thermal oxidation, silicidation, nitridation, ion implantation, diffusion, and so on.

• 한국재료학회지
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• 제18권12호
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• pp.645-649
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• 2008

Graphite for the nuclear reactor is used to the moderator, reflector and supporter in which fuel rod inside of nuclear reactor. Recently, there are many researches has been performed on the various characteristics of nuclear graphite, however most of them are restricted to the structural and the mechanical properties. Therefore we focused on the thermal property of nuclear graphite. This study investigated the thermal emissivity following the oxidation degree of nuclear graphite with IG-11 used as a sample. IG-11 was oxidized to 6% and 11% in air at 5 l/min at $600^{\circ}C$. The porosity and thermal emissivity of the sample were measured using a mercury porosimeter and by an IR method, respectively. The thermal emissivity of an oxidized sample was measured at $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$ and $500^{\circ}C$. The porosity of the oxidized samples was found to increase as the oxidation degree increased. The thermal emissivity increased as the oxidation degree increased, and the thermal emissivity decreased as the measured temperature increased. It was confirmed that the thermal emissivity of oxidized IG-11 is correlated with the porosity of the sample.

• 대한전자공학회논문지
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• 제25권11호
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• pp.1329-1334
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• 1988

$NH_3-O_2$의 열반응에 의해 산화막을 성장시키는 새로운 방법을 소개하고, 기존의 건식산화방법을 이용한 $SiO_2$박막의 특성을 비교 설명하였다. $NH_3$의 유량에 따라서 박막의 성장비가 증가하고, 성장된 막의 구성성분이 건식산화때와 같음을 확인하였다. C-V특성곡선에서도 $Q_{OX}$와 $Q_{SS}$가 거의같았고 히스테리시스현상도 없었다. 또한 n-MOS트랜지스터를 제작하고 측정한 결과 $I_D$-$V_{DS}$특성곡선이 건식산화와 비교하여 우수함을 확인했다.

• 한국재료학회지
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• 제23권1호
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• pp.1-6
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• 2013

A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.

• 전자공학회논문지D
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• 제34D권2호
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• pp.38-45
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• 1997

본 논문에서는 반도체 소자 제조 공정 중, 염산화 공정 시에 발생하는 스트레스에 따른 산화막의 3차원적 거동을 시뮬레이션하였다. 이를 위해, 이동하는 3차원 경계면에서의 노드 생성 및 제거 기능을 지는 3차원 적응 메쉬 생성기를 개발하였고, 지배 방정식을 유한요소법(finite element method)으로 이산화시켜 수치 해석적으로 해를 구하는, 스트레스 효과를 고려한 3차원 산화 시뮬레이터를 개발하였다. 본 연구에서는 열산화 공정에 의한 산화막의 3차원적 거동을 관찰하기 위하여, 섬구조(island) 및 공구조(hole structure)의 산화막 성장을 <100> 실리콘 기판에 대하여 $1000^{\circ}C$, 60분간 습식 산화 조건에서 시뮬레이션하였다. 초기 산화막의 두께는 $300\AA$, 질화막의 두께는 $2,000\AA$으로 가정하였다. 마스크의 형태에 따라 코너에서의 새부리(bird's beak)형태가 변하는데, 코너에서의 효과는 마스크 형태에 따라 산화제의 확산이 다른 영역에 비해 감소하거나 증가하는 영향이 주된 이유이지만, 스트레스에 의해 그 영향이 더 커짐을 확인하였다. 섬구조에서는 compressive 스트레스에 의해 코너 부근에서 산화가 감소하는 결과를 가져오고, 공구조에서는 tensile 스트레스로 인해 산화가 더 증가하는 결과를 보임을 확인하였다.

• 전자공학회논문지A
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• 제28A권12호
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• pp.59-64
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• 1991

Thin (25-103$\AA$) SiO$_2$ films are grown using the rapid thermal oxidation processing at temperatures of 105$0^{\circ}C$-115$0^{\circ}C$ for 5-30 sec, in order to investigate the characteristics of ultra thin oxide. For measuring the thickness of oxide TEM, ellipsometry, and C-V method which is taken in the condition of small surface band bending are used and compared. When neglecting the small deviation affected by both interface state and moisture charge effect, those three methods described above give similar results. In order to examine the effect of rapid thermal annealing, part of samples are annealed in N$_2$ ambient. MOS capacitors are fabricated and the characteristics of I-V and C-V are measured. Measurements show that the activation energy of initial thickness of oxide grown during the ramp-up time is of 1.125eV and the activation energy of the oxidation rate is of 0.98eV. As oxidation temperature is increased, dielectric breakdown field E$_{BD}$ is decreased due to the increase of fixed charge density N$_f$ However, E$_{BD}$ is shown to be decreased as increasing the thickness of oxide. The increase of N$_f$ in the early stage of thermal annealing results in the decrease of E$_{BD}$.

• 조명전기설비학회논문지
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• 제28권3호
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• pp.57-62
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• 2014

In this work, molybdenum oxide films were fabricated by heat-treatment method. Fundamental surface characteristics of molybdenum oxide films were investigated using XRD and Raman spectroscopy. From the results, the optimum MoOx films could be obtained under the conditions of thermal treatment temperature of $550^{\circ}C$, oxidation time of 30 minutes and oxygen flow rate of 250sccm. The thermal treatment method offers a simple and effective route for the synthesis of uniform $MoO_3$ films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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• pp.360-362
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• 1988

The new oxidation method was presented to grow the oxide layer by thermal reaction of $NH_{3}$ and $O_{2}$. The growth rate increased according as increase of partial pressure of $NH_{3}$. Optical transparent of the grown film was 12% compared with 17% of thermal oxidation when the wave number was $1,100cm^{-1}$. The oxide layer with good quaility was obtained.

• 한국태양에너지학회 논문집
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• 제35권4호
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• pp.9-15
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• 2015

Black cobalt solar selective coatings were prepared by using an electroplating method. The changes in the optical properties of the black cobalt selective coating due to thermal degradation were analyzed by using the Auger electron spectroscopy (AES) and spectrophotometer. The black cobalt selective coating was prepared on a copper substrate by using a synthesized electrolyte with $CoCl_2$ and KSCN at a current density of ${\sim}0.5A/dm^2$ for 45s ~ 60s. Its optical properties were a solar absorptance (${\alpha}$) of the order of 0.80 ~ 0.84 and a thermal emittance (${\epsilon}$) of 0.01. From the AES depth profile analysis of heated sample, thermal degradation of the black cobalt selective coating heated for 33 hours at temperature of $350^{\circ}C$ occurred primarily due to interdiffusion at interface of cobalt and copper substrate. This results were predictable that the ${\alpha}$ decreases due to the thermal oxidation and diffusion.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1992년도 춘계학술발표회
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• pp.57-58
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• 1992

The NH$_3$oxidation, which forms thermal oxide layer on silicon substrate with pure $O_2$gas added with small amounts of NH$_3$gas, has good interface sates due to activated gettering effect during oxidation. The superiority of interfae state in NH$_3$ oxidation method is not affected by preprocess but by gettering during oxidation. The dramatec reduction fo interface state is conformed with observing OSF when NH$_3$ oxide is annealed in NH$_3$ atmosphere.