• Korean Journal of Materials Research
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• v.12 no.5
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• pp.327-333
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• 2002

In order to obtain the oxidation layer for SiC MOS, the oxide layers by thermal oxidation process with dry and wet method were deposited and characterized. Deposition temperature for oxidation layer was $1100^{\circ}C$~130$0^{\circ}C$ by $O_2$ and Ar atmosphere. The oxide thickness, surface morphology, and interface characteristic of deposited oxide layers were measurement by ellipsometer, SEM, TEM, AFM, and SIMS. Thickness of oxidation layer was confirmed 50nm and 90nm to with deposition temperature at $1150^{\circ}C$ and $1200{\circ}C$ for dry 4 hours and wet 1 hour, respectively. For the high purity oxidation layer, the necessity of sacrificial oxidation which is etched for the removal of the defeats on the wafer after quickly thermal oxidation was confirmed.

• Korean Journal of Metals and Materials
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• v.46 no.6
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• pp.363-369
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• 2008

Effects of top coat morphology and thickness on thermal fatigue behavior of thermal barrier coatings (TBC) were investigated in this study. Thermal fatigue tests were conducted on three coating specimens with different top coat morphology and thickness, and then the test data were compared via microstructures, cycles to failure, and fracture surfaces. In the air plasma spray specimens (APS1, APS2), top coat were 200 and $300{\mu}m$ respectively. The thickness of top coat was about $700{\mu}m$ in the perpendicular cracked specimen (PCS). Under thermal fatigue condition at $1,100^{\circ}C$, the cycles to top coat failure of APS1, APS2, and PCS were 350, 560 and 480 cycles, respectively. The cracks were initiated at the interface of top coat and thermally grown oxide (TGO) and propagated into TGO or top coat as the number of thermal fatigue cycles increased. For the PCS specimen, additive cracks were initiated and propagated at the starting points of perpendicular cracks in the top coat. Also, the thickness of TGO and the decrease of aluminium concentration in bond coat do not affect the cycles to failure.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.2
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• pp.98-102
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• 2000

The effect of vacuum heat treatment in the thermal sprayed ceramics coating on a capstan by either high velocity oxygen fuel(HVOF) or plasma thermal spray process was investigated. The coating materials applied on the capstan were tungsten and chrome carbides. In order to characterize the interface between coating layer and bare materials, hardness, adhesion strength, X-ray diffraction(XRD) and microstructural analysis are conducted. The adhesion strength of the carbide coated materials by HVOF process is over 500MPa compared to those of plasma coating process is 230MPa. In case of the carbide coated materials by HVOF process, the adhesion strength is increased to 15MPa and the porosity is reduced under 5% by vacuum heat treatment for 5 hrs at $1000^{\circ}C$. The XRD results reveal that the increasement is believed due to the phase stabilization of metastable $Cr_3C_2$ phase to stable $Cr_{23}C_6$ phase.

• Journal of Welding and Joining
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• v.26 no.6
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• pp.74-80
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• 2008

A finite element modeling approach has been described for the simulation and analysis of the micron-scaled solid particle impact behavior in kinetic spraying process, using an explicit code (ABAQUS 6.7-2). High-strain-rate plastic deformation and interface bonding features of the copper, nickel, aluminum, and titanium were investigated via FEM in conjunction with the Johnson-Cook plasticity model. Different aspects of adiabatic shear instabilities of the materials were characterized as a concept of thermal boost-up zone (TBZ), and also discussed based upon energy balance concept with respect to relative recovery energy (RRE) for the purpose of optimizing the bonding process.

• Elastomers and Composites
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• v.54 no.4
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• pp.345-350
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• 2019

In this study, aliphatic polyketone (PK)/chopped carbon fiber (CCF) composites with various CCF contents were prepared using a modular intermeshing co-rotating twin screw extruder, and their mechanical and thermal properties such as tensile, flexural, and impact strength and thermal conductivity were investigated. The amount of CCF was increased from 0 to 50 wt%. The tensile and flexural strength of the PK/CCF composites increased as the CCF content increased, but the elongation at break and impact strength was lower than that of pure PK. Thermal properties such as heat distortion temperature and thermal conductivity increased as the CCF content increased. Morphological observations revealed that fiber orientation and interface adhesion between the PK and the CCF in the PK/CCF composites were formed due to the twin screw extrusion, which contributed to improving the mechanical and thermal properties of the composites.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.3
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• pp.302-308
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• 2008

Composite materials are widely used as structural materials for aerospace engineering because of its excellent mechanical properties such as light weight, high stiffness, and low thermal expansion. In driving, impact damage is one of the common but dangerous damages, caused by internal failure of the laminas interface which is not detected by in the surface. Many techniques to detect defects or delaminate between laminates have been reported. Shearography is a kind of laser speckle pattern interferometry with the advantages of non-destructive, non-contact, high resolution and displacement slope measurement. In this paper, the shearography is used to evaluate non-destructively impact damaged surface of the composite material and a measuring method using shearography for the thermal deformation of a impact damaged composite material is discussed. The basic principles of the technique are also described briefly.

• Macromolecular Research
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• v.14 no.3
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• pp.261-266
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• 2006

Blends of silicone rubber (VMQ) and liquid crystalline polymer (LCP) were prepared using a melt blending technique in the presence and absence of glass fiber and coupling agents. The effect of glass fiber and coupling agents on the thermal, dynamic mechanical, morphological pro-perties and cure characteristics of VMQ/LCP blends were studied. The vinyl silane coupling agent showed a significant effect on the above mentioned properties of VMQ/LCP blends by reacting at the interface between VMQ and LCP. The viscosity of the VMQ/LCP blends decreased with the addition of a coupling agent. A substantial improvement in storage modulus of VMQ/LCP blends was observed in the presence of glass fiber and coupling agents. However, as a coupling agent vinyl silane proved to be better than amine for the VMQ/LCP-glass-containing blends. The thermal stability of the pure silicone rubber was higher than those of the blends. This high thermal stability of silicone rubber was attributed to the Si-O-Si bonds. However, the thermal stability of the blends decreased further in the presence of a coupling agent, possibly due to a decrease in blend crystallinity.

• Journal of Adhesion and Interface
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• v.13 no.2
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• pp.58-63
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• 2012

CFRP chip is the byproduct from carbon fiber reinforced plastic (CFRP) processing. CFRP chip is not simply a waste mainly composed of fine carbon fiber and epoxy resin. CFRP chip keeps matrix to maximize their reinforcing effect. To obtain a uniform length of carbon fiber in CFRP chip, chip was chopped ina mortar. CFRP chip should be purified to get better interface adhesion. Epoxy resin on the carbon fiber was removed by $H_2O_2$ surface etching treatment. Optimal dispersion and fabrication conditions of CFRP chip embedded in phenolic resin were determined by thermal stability for fire retardant applications. CFRP chip-phenolic composite exhibits better mechanical and thermal properties than neat phenolic resin. Surface condition of CFRP chip-phenolic composite was evaluated by static contact angle measurement. Contact angle of CFRP chip-phenolic composite was greater than neat phenolic due to heterogeneous condition of fine carbon fibers. From the evaluation for fire retardant (ASTM D635-06) test, thermal stability of CFRP chip-phenolic composite was found to be improved with higher concentration of CFRP chip.

• Structural Engineering and Mechanics
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• v.62 no.1
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• pp.43-54
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• 2017

In this study, the failure behavior of composite material in the biaxial and off-axis loading is studied based on a computational micromechanical model. The model is developed so that the combination of mechanical and thermal loading conditions can be considered in the analysis. The modified generalized plane strain assumption of the theory of elasticity is used for formulation of the micromechanical modeling of the problem. A truly meshless method is employed to solve the governing equation and predict the distribution of micro-stresses in the selected RVE of composite. The fiber matrix interface is assumed to be perfect until the interface failure occurs. The biaxial and off-axis loading of the SiC/Ti and Kevlar/Epoxy composite is studied. The failure envelopes of SiC/Ti and Kevlar/Epoxy composite in off-axis loading, biaxial transverse-transverse and axial-transverse loading are predicted based on the micromechanical approach. Various failure criteria are considered for fiber, matrix and fiber-matrix interface. Comparison of results with the available results in the litreture shows excellent agreement with experimental studies.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.