References
- H.I. Matsunami, Electronics and Communications in Japan. Part 2., 81 (7), 38 (1998) https://doi.org/10.1002/(SICI)1520-6424(199807)81:7<38::AID-ECJA5>3.0.CO;2-0
- M. Ventra and S.T. Pantelides, J. Electronic materials., 26(3), 353 (2000)
- M. Eickhoff, N. Vouroutzis, A. Nielsen, G. Krotz, and J. Stoemenos, J. electrochemical society., 148(6), G336 (2001) https://doi.org/10.1149/1.1370972
- E.F.Opila, J.Am. Ceram.Soc., 82(3), 625 (1999) https://doi.org/10.1111/j.1151-2916.1999.tb01810.x
- K. Yamashita, M. Iwamoto, and T. Hino, Jpn. J. Appl. Phsy., 20(8), 1429 (1981) https://doi.org/10.1143/JJAP.20.1429
- P.K. Nauta and M.W. Hillen, J. Appl. Phys., 49(5), 2862 (1978) https://doi.org/10.1063/1.325168
- A.G. Tangena, J. Middelhoek, and N.F. de Rooij, Jpn. J. Appl. phys., 49 (5), 2876 (1978) https://doi.org/10.1063/1.325170
- K. Yamashita and T. Hino, Jpn. J. Appl. Phys., 21 (10), 1437 (1982) https://doi.org/10.1143/JJAP.21.1437
- A. Goetzberger and J.C. Irvin, IEEE. Trans. Electron Devices., 15, 1009 (1968) https://doi.org/10.1109/T-ED.1968.16554
- E.I. Goldman, A.G. Zhdan, and N. F. Kukharsksya, semicconductors., 33(3), 308 (1999) https://doi.org/10.1134/1.1187685
- M. Bakowski, U. Gustafsson, and Z. Ovuka, Microelectron. Reliab., 38 (3), 381 (1998) https://doi.org/10.1016/S0026-2714(97)00061-9
- H. Kobayashi, T. Sakurai, M. Nishiyama, and Y. Nishioka, Appl. phys. Let., 76(16), 2336 (2001)
- R.C. Jaeger, Introduction to Microelectronic Fabrication Volume V, P. 29
- B.E. Deal and A. S. Grove, J. Appl. Phys., 36, 3770 (1965) https://doi.org/10.1063/1.1713945
- A. Rys, N. Singh, and M. Cameron, J. Electrochem. Soc, 142(4), 1318 (1995) https://doi.org/10.1149/1.2044170
- Inter-university Semiconductor Research Center, SEOUL NATIONAL UNIVERSITY.,
- A. Suzuki, H. Ashida, and N. Furui, Jpn. J. Appl. Phys., 21 (4), 579 (1982) https://doi.org/10.1143/JJAP.21.579
- J. Anthony powell, David J. Larkin, and Phillip B. ABEL, J. Electronic Materials., 24(4), 295 (1995) https://doi.org/10.1007/BF02659690
- M.B. Johnson, M.E. Zvanut, and Otha Fichardson, J. electronic materials., 29 (3), 368 (2000) https://doi.org/10.1007/s11664-000-0079-3
- L.A. Lipkin and J.W. Palmour, J. Electronic Materials., 25(5), 909 (1995) https://doi.org/10.1007/BF02666657
- M.K. Das, J.A. Cooper, JR., and M.R. Melloch, J. electronic Materials., 27(4), 353 (1998) https://doi.org/10.1007/s11664-998-0414-7
- L. zhou, V. Audurier, and P. Pirouz, J. Electrochem. Soc, 144(6), L161 (1997) https://doi.org/10.1149/1.1837711
- J. Boo, S. Lee, K. Yu, M. Sung, and Y.Kim, surface and coatings Tech., 131, 147 (2000) https://doi.org/10.1016/S0257-8972(00)00820-3