• 한국세라믹학회지
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• 제51권6호
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• pp.554-559
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• 2014

Gadolinium zirconate, $Gd_2Zr_2O_7$, is one of the most promising candidates for replacing yttira-stabilized zirconia (YSZ) in thermal barrier coating (TBC) applications due to its low thermal conductivity and chemical stability at high temperature. In this study, rare-earth zirconate ceramics in the $GdO_{1.5}-ZrO_2$ system with reduced gadolinia contents were fabricated via solid-state reaction as well as hot-pressing at $1800^{\circ}C$. The phase formation, microstructure, and thermo-physical properties of these oxides were examined. The potential application of $GdO_{1.5}-ZrO_2$ ceramics for TBC was also discussed.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1465-1472
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• 2009

완전혼합 반응기에서 외부로의 열손실이 $CH_4/air$예혼합화염의 NOx 생성특성에 미치는 영향을 수치해석으로 검토하였다. 주요 결과로서, 단열조건에서 NOx는 체류시간에 따라 급격히 증가하는 반면에, 열손실이 고려될 때 열전 달 상수와 체류시간의 증가에 따라 NOx 저감현상이 뚜렷하게 발생하였다. 민감도 해석을 통해 열손실율이 증가함에 따라 Thermal NO 기구와 Re-burning NO 기구는 NOx 저감에 크게 기여하는 반면, Prompt NO 기구와 $N_2O$-경유 NO 기구는 오히려 NOx 증가에 기여함을 확인하였다. NOx 생성기구는 열전달 상수 및 체류시간의 변화에 따라 매우 복합한 특성을 갖지만, NOx 농도는 독립된 Thermal NO 기구에 의해 표현될 수 있었다. 이를 통해 실용 $CH_4/air$예혼합 연소기에서 NOx 농도를 예측할 수 있는 열손실율과 체류시간을 조합한 새로운 NOx 상관식이 도출되었다.

• 대한환경공학회지
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• 제38권3호
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• pp.110-116
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• 2016

최근 다양한 형태의 슬러지 최종처리 기술들이 제안되고, 기존 혐기성 소화공정에서 바이오가스 생산효율을 증가시키기 위한 전처리 기술들이 개발되어왔다. 이들 기술 중 열적전처리(Thermal pretreatment) 기술은 기존 슬러지 처리방법과 다르게 입자의 유기성 성분을 용해시킴으로써 슬러지 특성을 변화시켜 감량과 재이용이 가능한 전처리 기술이다. 그러나 대부분의 연구들은 높은 온도에서 입자의 가수분해, COD 가용화부분에 중점을 두고 연구 되어졌으며, 소수의 결과들만이 물리, 화학적 특성변화에 대해서 보고되었다. 본 연구는 열적전처리 효율에 영향을 미칠 수 있는 온도, 약품이 탄소원 형성과 분율에 미치는 영향을 알아보고자 하였다. 그 결과 반응온도가 증가함에 따라 입자의 가수분해 속도가 증가하였으며, 산화제의 주입량이 증가 할수록 고분자 유기성 물질은 감소하고 저분자 유기성 물질(분자량 350 g/mol 이하)의 분율이 증가하는 것을 확인할 수 있었다. 이번 실험결과는 슬러지 감량화 및 재이용를 위한 열적 전처리에 의한 분자의 특성을 파악하는데 기여할 수 있을 것이라 판단한다.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 1995년도 춘계학술발표회 프로그램 및 초록
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• pp.19-20
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• 1995

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 추계학술발표회
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• pp.146-146
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• 1997

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.450-454
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• 2018

In recent years, thermal insulation coating technology for automotive engine parts has received significant attention as a means of improving the thermal efficiency of automotive engines. One of the characteristics of thermal insulation coatings is their low thermal conductivity, and, materials such as YSZ (Yttria-stabilized zirconia), which have low thermal conductivity, are used for this purpose. This research presents a study of the changes in the microstructure and thermal conductivity of $8YSZ/SiO_2$ multi compositional thermal insulation coating for different compositions, and particle size distributions of suspension, when it is subjected to suspension plasma spraying. To obtain a porous coating structure, the mixing ratio of 8YSZ and $SiO_2$ particles and the particle sizes of the $SiO_2$ were changed. The microstructure, phase formation behavior, porosity and thermal conductivity of the coatings were analyzed. The porosities were found to be 1.2-32.1%, and the thermal conductivities of the coatings were 0.797-0.369 W/mK. The results of the study showed that the microstructures of the coatings were strongly influenced by the particle size distributions, and that the thermal conductivities of the coatings were greatly impacted by the microstructures of the coatings.

• 한국수소및신에너지학회논문집
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• 제2권1호
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• pp.69-75
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• 1990

The effect of thermal cycling on the hydrogenation characteristics of the $Mg_2Cu-H$ system was investigated in order to study of intrinsic degradation of the system. The hydrogen storage capacity decreased with thermal cycling from $573^{\circ}K$ to $663^{\circ}K$. By the thermal analysis it is found that stable $MgH_2$ hydride is formed during thermal cycling. With a heat treatment at $693^{\circ}K$ at a hydrogen pressure of 16 atm, the hydrogenation rate drastically decreased. From these observation, it suggested that the intrinsic degradation of $Mg_2Cu$ system results from mainly the formation of stable $MgH_2$ hydride phase.

• 한국포장학회지
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• 제21권3호
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• pp.107-113
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• 2015

This work focused on the study of thermal properties and kinetic behavior of LDPE-nanoclay composite films. The effect of nanoclay content (0.5, 1, 3, and 5 wt%) on thermal stability and crystallization characteristics of the nanocomposites were investigated by Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). The results from endothermic curve showed that the nanoclay played an important role in the crystallization of nanocomposites by acting as nucleating agent. From exothermic curve, there was a crystallization temperature shift which was attributed to crystallization process induced by nanoclay. The TGA results showed that the addition of nanoclay significantly increased the thermal stability of LDPE matrix, which was likely due to the characteristic of layered silicates/clays dispersed in LDPE matrix as well as the formation of multilayered carbonaceous-silicate char. A well-known Coats-Redfern method was used to evaluate the decomposition activation energy of nanocomposite. It was demonstrated that introducing of nanoclay to LDPE matrix escalated the activation energy of nanocomposite decomposition resulting in thermal stability improvement.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.50-50
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• 2011

The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.