• Title/Summary/Keyword: Thermal force

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Finite Element Analysis for Thermal Stresses of Microaccelerometers (마이크로가속도계의 열응력에 대한 유한요소해석)

  • 김옥삼
    • Proceedings of the Korean Society of Marine Engineers Conference
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    • 2000.05a
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    • pp.100-104
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    • 2000
  • This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a mcroaccelerometers. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional bean up to 80 degree and get is through the cooling process. We learn the thermal internal stress of each shape and compare the results with each other after heating the tunnel gap up to 400 degree during the Pt deposition process. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer by electrostatic force.

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THERMO-MECHANICAL ANALYSIS OF OPTICALLY ACCESSIBLE QUARTZ CYLINDER UNDER FIRED ENGINE OPERATION

  • Lee, K.S.;Assanis, D.N.
    • International Journal of Automotive Technology
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    • v.1 no.2
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    • pp.79-87
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    • 2000
  • Analytical approach was followed in this work under both the steady state and transient operating conditions to find optimum boundary conditions, where the optically accessible quartz engine can run safely without breaking. Temperature and stress distribution was predicted by FEM analysis. In order to validate thermal boundary condition, model reliability and constraint, outside cylinder temperature was measured and previous study was also followed up numerically. To reduce thermal stress level, three types of outside cooling (natural, moderate forced and intensive forced convection) were considered. Effects of clamping force and combustion pressure were conducted to investigate mechanical stress level. Cylinder thickness, was changed to fine the optimum cylinder thickness. The versatile results achieved from this work can be basic indication, which is capable of causing a sudden quartz cylinder breaking during fired operation.

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Effects of Seed Layer and Thermal Treatment on Atomic Layer Deposition-Grown Tin Oxide

  • Choi, Woon-Seop
    • Transactions on Electrical and Electronic Materials
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    • v.11 no.5
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    • pp.222-225
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    • 2010
  • The preparation of tin oxide thin films by atomic layer deposition (ALD), using a tetrakis (ethylmethylamino) tin precursor, and the effects of a seed layer on film growth were examined. The average growth rate of tin oxide films was approximately 1.2 to 1.4 A/cycle from $50^{\circ}C$ to $150^{\circ}C$. The rate rapidly decreased at the substrate temperature at $200^{\circ}C$. A seed effect was not observed in the crystal growth of tin oxide. However, crystallinity and the growth of seed material were detected by XPS after thermal annealing. ALD-grown seeded tin oxide thin films, as-deposited and after thermal annealing, were characterized by X-ray diffraction, atomic force microscopy and XPS.

Performance of Assembled-type Drills (조립형 드릴의 성능 평가)

  • Yang, Hae-Jeong;Lee, Jai-Hak;Seo, Jeong-Hwan
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.2
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    • pp.238-243
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    • 2015
  • Recently, the use of assembled-type drills as environmentally friendly products has expanded because the shanks of drills can be reused by replacing the tip when the tools are worn or cut. In addition to their precision and endurable stiffness with respect to the cutting force, assembled-type drills need no stricture because of thermal deformation, which makes replacement easily. In this study, we developed novel assembled-type drills and compared their characteristics, such as the precision, stiffness, and thermal deformation, with those of conventional drills. The new drills exhibited a precision over IT 8 class and no changes in dimensions due to thermal deformation, such that we can change the assembly easily with durability.

Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delamination in Plastic Packages under Thermal and Vapor Pressure Loadings

  • Jin Yu
    • Journal of the Microelectronics and Packaging Society
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    • v.5 no.2
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    • pp.37-48
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    • 1998
  • The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

The Wear Behavior and Cutting Characteristics of Coated Tools (코팅공구의 마모 및 절삭특성)

  • 정진혁;윤형석;최덕기;주종남
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.3-8
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    • 1996
  • To enhance the cutting performance of the tool, single or multilayer coating is applied on the substrate of the tool. Coating material reduces cutting force and heat generation in tool-chip contact zone and enhances resistance against abrasive wear. This paper presents that the effect of different coatings on abrasive wear resistance varies with work material and the flank wear rate is different with depth of cut. Crater wear rate is also found to decrease with higher thermal diffusivity of coating material. It is verified that the estimated thermal diffusivity of multilayer coating has consistent effect on the crater wear.

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Morphology and Thermal Oxidation Behavior of Graphene Supported on Atomically Flat Mica Substrates

  • Go, Taek-Yeong;Sim, Ji-Hye;Ryu, Sun-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.459-459
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    • 2011
  • Graphene has many fascinating material properties such as high electron mobility, high optical transparency, excellent thermal conductivity, superior Young's modulus, etc. Several studies have recently found that single-layer graphene is chemically more reactive than few-layer graphene when supported on silicon dioxide substrates with sub-nm roughness. In this study, we have investigated the influence of substrates on chemical reactivity of graphene. Morphology and thermal oxidation behavior of graphene on atomically flat mica substrates were studied by atomic force microscopy (AFM) and Raman spectroscopy compared to graphene on SiO2/Si substrates. Notably, oxidation of single-layer graphene proceeds more slowly on mica than SiO2/Si. Detailed analysis led to a conclusion that deformation along the out-of-plane direction enhances reactivity of graphene.

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Study on Hygrothermal Degradation and Corrosion Protection of Epoxy Coatings Cured by Different Amine Based Curing Agents

  • Shon, Min-Young;Kwon, Huck-Sang
    • Corrosion Science and Technology
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    • v.9 no.5
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    • pp.201-208
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    • 2010
  • Epoxy coatings cured by different amine based curing agents have been prepared. Atomic force microscopy (AFM) has been used to monitor the surface topology changes of epoxy coatings before and after hygrothermal cyclic test. The glass transition temperature ($T_g$) and coefficient of thermal expansion (CTE) of the epoxy coating were measured by Thermo-mechanical Analysis (TMA). The Electrochemical impedance spectroscopy (EIS) with hygrothermal cyclic test has been introduced to evaluate the corrosion protection of the epoxy coatings. In conclusion, thermal properties of epoxy coatings were in good agreement with the results of corrosion protection of epoxy coated carbon steel obtained result by EIS with hygrothermal cyclic test. The relationship between thermal properties, surface roughness changes and corrosion protection of epoxy coatings are discussed in this study.

An Experimental Study on the Frost Prevention using Micro Liquid Film of an Antifreeze Solution

  • Chang Young-Soo;Yun Won-Nam
    • International Journal of Air-Conditioning and Refrigeration
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    • v.14 no.2
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    • pp.66-75
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    • 2006
  • The effect of antifreeze solution liquid film on the frost prevention is experimentally investigated. It is desirable that the antifreeze solution spreads widely on the heat exchanger surface forming thin liquid film to prevent frost nucleation while having small thermal resistance across the film. A porous layer coating technique is adopted to improve the wettability of the antifreeze solution on a parallel plate heat exchanger. The antifreeze solution spreads widely on the heat exchanger surface with $100{\mu}m$ thickness by the capillary force resulted from the porous structure. It is observed that the antifreeze solution liquid film prevents a parallel plate heat exchanger from frosting. The reductions of heat and mass transfer rate caused by the thin liquid film are only $1{\sim}2%$ compared with those for non-liquid film surface.

Thin Plate Fabrication and Characterization of Plain Woven Carbon / 6061 Al Composites (Plain woven carbon/6061Al 금속복합재료의 제조와 특성분석)

  • Chang Jae-Jun;Ha Dong-Ho;Eom Mun-Gwang;Lee Sang-kwan
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.04a
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    • pp.250-253
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    • 2004
  • Emphasis has been placed on thin plate fabrication of plain woven carbon fabric reinforced Al matrix composites using liquid pressing process. The composite has potential applications for PDP rear plate. The process is to use the low pressure for infiltration of Al melt into plain woven carbon fabric as the Al melt is pressurized directly. The minimum pressure required for the infiltration was calculated from force balance equation, permeability measurements and compaction behavior of carbon fiber. Also, the melting temperature and the holding time have been optimized. In order to measure coefficient of thermal expansion (CTE) of the composites, the thermal strain measurement using strain gage was performed and the thermal conductivity of the composites was measured using laser flash method. The constituent materials of the composite are PAN type carbon fibers as reinforcements and 6061 Al alloys as matrices.

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