• Steel and Composite Structures
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• v.15 no.5
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• pp.481-505
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• 2013

This paper focuses on thermal post-buckling analysis of functionally graded beams with temperature dependent physical properties by using the total Lagrangian Timoshenko beam element approximation. Material properties of the beam change in the thickness direction according to a power-law function. The beam is clamped at both ends. In the case of beams with immovable ends, temperature rise causes compressible forces and therefore buckling and post-buckling phenomena occurs. It is known that post-buckling problems are geometrically nonlinear problems. Also, the material properties (Young's modulus, coefficient of thermal expansion, yield stress) are temperature dependent: That is the coefficients of the governing equations are not constant in this study. This situation suggests the physical nonlinearity of the problem. Hence, the considered problem is both geometrically and physically nonlinear. The considered highly non-linear problem is solved considering full geometric non-linearity by using incremental displacement-based finite element method in conjunction with Newton-Raphson iteration method. In this study, the differences between temperature dependent and independent physical properties are investigated for functionally graded beams in detail in post-buckling case. With the effects of material gradient property and thermal load, the relationships between deflections, critical buckling temperature and maximum stresses of the beams are illustrated in detail in post-buckling case.

• Geomechanics and Engineering
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• v.12 no.3
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• pp.465-481
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• 2017

Thermal effect has great influence on wellbore stability in Dongfang 1-1 (DF 1-1) gas field, a reservoir with high-temperature and high-pressure. In order to analyze the wellbore stability in DF1-1 gas field, the variation of temperature field after drilling was analyzed. In addition, the effect of temperature changing on formation strength and the thermal expansion coefficients of formation were tested. On this basis, a wellbore stability model considering thermal effect was developed and the thermal effect on fracture pressure and collapse pressure was analyzed. One of the main challenges in this gas field is the decreasing temperature of the wellbore will reduce fracture pressure substantially, resulting in the drilling fluid leakage. If the drilling fluid density was reduced, kick or blowout may happen. Therefore, the key of safe drilling in DF1-1 gas field is to predict the fracture pressure accurately.

• Journal of the Korean Ceramic Society
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• v.50 no.5
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• pp.326-332
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• 2013

In this study, we prepared yttria stabilized zirconia granules for thermal barrier coatings using a spray drying process. First, we characterized the properties of granules such as flow rate and packing density for utilizing the air plasma spray process. The flow rate and packing density data showed 0.732 g/sec and 2.14 $g/cm^3$, respectively, when we used larger and denser particles, which are better than hollow granules or smaller spherical granules. Second, we chose larger, spherical granules fabricated in alcohol solvent as starting powders and sprayed it on the bondcoat/nimonic alloy by an atmospheric plasma spray process varying the process parameters, the feeding rate, gun speed and spray distance. Finally, we evaluated representative thermal and mechanical characteristics. The thermal expansion coefficients of the coatings were $11{\sim}12.7{\times}10^{-6}/^{\circ}C$ and the indentation stress measured was 2.5 GPa at 0.15 of indentation strain.

• Restorative Dentistry and Endodontics
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• v.31 no.5
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• pp.344-351
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• 2006

The purpose of this study was to evaluate the thermal expansion characteristics of injectable ther-moplasticized gutta-perchas and a Resilon. The materials investigated are Obtura gutta-percha, Diadent gutta-percha, E&Q Gutta-percha Bar and Epiphany (Resilon). The temperature at the heating chamber orifice of an Obtura II syringe and the extruded gutta-percha from the tip of both 23- and 20-gauge needle was determined using a Digital thermometer. A cylindrical ceramic mold was fabricated for thermal expansion test, which was 27 mm long, with an internal bore diameter of 3 mm and an outer diameter of 10 mm. The mold was filled with each experimental material and barrel ends were closed with two ceramic plunger. The samples in ceramic molds were heated in a dilatometer over the temperature range from $25^{\circ}C$ to $75^{\circ}C$. From the change of specimen length as a function of temperature, the coefficients of thermal expansion were deter-mined. There was no statistical difference between four materials in the thermal expansion in the range from $35^{\circ}C$ to $55^{\circ}C$ (p > 0.05). However, Obtura Gutta-percha showed smaller thermal expansion than Diadent and Metadent ones from $35^{\circ}C$ to $75^{\circ}C$ (p < 0.05). The thermal expansion of Epiphany was similar to those of the other gutta-percha groups.

• Advances in materials Research
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• v.5 no.1
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• pp.35-53
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• 2016

Flexural bending analysis of perfect and imperfect functionally graded materials plates under hygro-thermo-mechanical loading are investigated in this present paper. Due to technical problems during FGM fabrication, porosities and micro-voids can be created inside FGM samples which may lead to the reduction in density and strength of materials. In this investigation, the FGM plates are assumed to have even and uneven distributions of porosities over the plate cross-section. The modified rule of mixture is used to approximate material properties of the FGM plates including the porosity volume fraction. In order the elastic coefficients, thermal coefficient and moisture expansion coefficient of the plate are assumed to be graded in the thickness direction. The elastic foundation is modeled as two-parameter Pasternak foundation. The equilibrium equations are given and a number of examples are solved to illustrate bending response of Metal-Ceramic plates subjected to hygro-thermo-mechanical effects and resting on elastic foundations. The influences played by many parameters are investigated.

• Proceedings of the Korea Concrete Institute Conference
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• 1999.04a
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• pp.58-63
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• 1999

Almost all concrete structures have many inevitable cracks for various reasons such as drying shrinkage, heat liberation of cement, fatigues or repeating loads and movements. Conventionally, they are repaired with epoxy materials. The Epoxy resins used by repair materials are different from properties of the base concrete materials such as thermal and mechanical properties - thermal expansion coefficients, bending strength. And the epoxy resin cannot release the water inside the concrete structure and cause corrosion of the steel bars. In this study, before the experiment got launched, we had analyzed cement and slag. Then We blended the two grades of ultra fine cement using high blaine cement and slag. And the cement slurry was produced by water and suprplasticizer to each blended ultra fine cement in various conditions. The slurry produced by each conditions was evaluated with flow properties such as viscosity, dropping time, segregation and observation of dry surface after injection.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.954-960
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• 2008

The effects of elastic modulus coefficient and linear expansion coefficient of overhead distribution power line(ACSR $58 mm^2$) on sag behavior in distribution line have been investigated to clarify the difference between specification and experimental level. The elastic modulus coefficients of Al wire and steel wire were $5,182.6 kgf/mm^2,\;18,348.8 kgf/mm^2$, respectively Therefore, the computational composition elastic modulus coefficient of the power line was $7,063.5 kgf/mm^2$, while that of experimentally measured was $7681.1 kgf/mm^2$. As a result, we found that elastic modulus coefficient which was experimentally measured was higher than that of computational by 8.7 %. However, when planner designs the sag of disoibution line, the elastic modulus coefficient of power line $8,400 kgf/mm^2$ should be generally adopted. These two different using values lead to the sag difference of 0.62 m. The other results will be discussed.

• Journal of the Korean Ceramic Society
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• v.56 no.2
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• pp.173-177
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• 2019

Thermal properties of a SiO₂-B₂O₃-BaO ternary glass system depending on compositional change of BaO have been examined to find a proper sealing material for reversible oxide cells. Glass transition temperature and thermal expansion coefficients increased simultaneously up to 55 mol% of BaO content. The structural role of BaO with regard to the thermal properties has been discussed on the basis of Raman spectroscopy results. Flowability of the glass at sealing temperature has been examined with packed glass powders of 12 mm diameter along with a high temperature optical microscope. The practical sealing property of the glass was also examined with YSZ coated with NiO-yittria stabilized zirconia (NiO-YSZ) and it showed good adhesion without noticeable reaction with NiO-YSZ layer.

• Structural Engineering and Mechanics
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• v.44 no.1
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• pp.109-125
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• 2012

Post-buckling behavior of Timoshenko beams subjected to uniform temperature rising with temperature dependent physical properties are studied in this paper by using the total Lagrangian Timoshenko beam element approximation. The beam is clamped at both ends. In the case of beams with immovable ends, temperature rise causes compressible forces end therefore buckling and post-buckling phenomena occurs. It is known that post-buckling problems are geometrically nonlinear problems. Also, the material properties (Young's modulus, coefficient of thermal expansion, yield stress) are temperature dependent: That is the coefficients of the governing equations are not constant in this study. This situation suggests the physical nonlinearity of the problem. Hence, the considered problem is both geometrically and physically nonlinear. The considered highly non-linear problem is solved considering full geometric non-linearity by using incremental displacement-based finite element method in conjunction with Newton-Raphson iteration method. The beams considered in numerical examples are made of Austenitic Stainless Steel (316). The convergence studies are made. In this study, the difference between temperature dependent and independent physical properties are investigated in detail in post-buckling case. The relationships between deflections, thermal post-buckling configuration, critical buckling temperature, maximum stresses of the beams and temperature rising are illustrated in detail in post-buckling case.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.