• Polymer(Korea)
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• v.34 no.4
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• pp.352-356
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• 2010

The effects of the filler shapes and contents on the coefficient of thermal expansion (CTE) for polypropylene (PP) composites which included three dimensional ellipsoids ($a_1>a_2>a_3$), as determined by two aspect ratios (${\rho}_\alpha=a_1/a_3$ and ${\rho}_\beta=a_1/a_2$) were analyzed by the theoretical approach proposed by Lee and Paul and compared with the experimental results. The shapes of fillers in the composites were various, such as spherical, fiber, disc, and ellipsoid, using barium sulfate, glass fiber, and mica. The longitudinal CTE of barium sulfate whose shape was sphere ($\rho_\alpha=\rho_\beta=1$) decreased. For the glass fiber, primary aspect ratio decreased with the filler content, and longitudinal CTE decreased as filler contents increased. Normal CTE initially increased in the lower filler content. For the mica, longitudinal and transverse CTE decreased but normal CTE increased in the lower filler content like predicted values.

• Korean Journal of Materials Research
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• v.25 no.7
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• pp.330-335
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• 2015

A low thermal expansion ceramic, cordierite ($2MgO{\cdot}2Al_2O_3{\cdot}5SiO_2$), was synthesized using pyrophyllite. Pyrophyllite usually consists of $SiO_2$ and $Al_2O_3$, which are the main components of cordierite. $MgCO_3$ and $Al(OH)_3$ were added in various amounts to pyrophyllite and fired for synthesis and sintering. ${\alpha}$-cordierite crystallized from $1000^{\circ}C$ with mixing of 20 wt% $MgCO_3$ and 1.7 wt% $Al(OH)_3$, and un-reacted cristobalite was also detected with the cordierite. As the temperature was increased to $1400^{\circ}C$, the cordierite yield was gradually increased. Powder compacts of the synthesized cordierite were sintered between $1250^{\circ}C{\sim}1400^{\circ}C$; the sintered samples showed a low thermal expansion coefficient of $2.1{\times}10^{-6}/^{\circ}C$ and typical sintering behavior. It is anticipated that it will be possible to synthesize cordierite ceramics on a mass production scale using the mineral pyrophyllite.

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.107-114
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• 1993

Zinc-Borosilicate(ZnO 65.0wt%, B2O3 21.5wt%, SiO2 9.0wt%, PbO or tiO2 4wt%) passivation glasses were studied using differential thermal analysis(DTA), scanning electron microscopy(SEM) observations, X-ray diffraction (XRD) patterns and measurement of thermal expansion coefficients. Passivation glasses containing 4wt% TiO2 and 4wt% PbO had crystallization temperature of 680~73$0^{\circ}C$ and major crystalline phases were identified by X-ray diffraction as $\alpha$-ZnO.B2O3 and $\alpha$-5ZnO.2B2O3. As increasing firing temperature, the size of crystalline phases increased by observation of SEM. The thermal expansion coefficient of crystallized glass frits was smaller than that of unfired glass.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1370-1373
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• 2003

Specimens of Ti-10Ta-10Nb have been tested for Rockwall hardness after heating to either the $\alpha$+$\beta$ and $\beta$-phase field. And the specific heat and the dilatometer of Ti-10Ta-103Nb swaged have been measured. From the result, the $\beta$ transus of the alloy was determined to be 82$0^{\circ}C$. The hot deformation behavior of Ti-10Ta-10Nb with an $\alpha$+$\beta$ microstructure is modeled in the temperature 75$0^{\circ}C$ and strain rate range 0.001-10$^{-1}$

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.9
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• pp.1504-1510
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• 2016

The aim of this study is to improve properties both glass transition temperature($T_g$) and coefficient of thermal expansion(CTE) using epoxy/micro-nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2,3,5g). This paper deals with the effects of GDE addition for epoxy/micro alumina contents (40, 50, 60wt%)+surface modified nano alumina(1_phr) composites. 20 kinds specimen were prepared with containing micro, nano alumina and GDE as a micro composites(10, 20, 30, 40, 50, 60, 70wt%) or a nano/micro alumina composites(1phr/40, 50, 60wt%). Average particle size of nano and micro alumina used were 30nm and $1{\sim}2{\mu}m$, respectively. The micro alumina used were alpha phase with Heterogeneous and nano alumina were gamma phase particles of spherical shape. The glass transition temperature and coefficients of thermal expansion was evaluated by DSC and TMA. The glass transition temperature decreased and coefficients of thermal expansion become smaller with filled contents of epoxy/micro alumina composites. On the other hand, $T_g$ and CTE as GDE addition variation(1,2,3,5g) of epoxy/micro-nano alumina composites decreased and increased respectively.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.128-130
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• 2003

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• The Journal of Advanced Prosthodontics
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• v.7 no.4
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• pp.312-316
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• 2015

PURPOSE. This study aimed to present the clinical applicability of restorations fabricated by a new method, by comparing the bond strength of between ceramic powder with different coefficient of thermal expansion and alloys fabricated by Selective laser sintering (SLS). MATERIALS AND METHODS. Fifty Co-Cr alloy specimens ($25.0{\times}3.0{\times}0.5mm$) were prepared by SLS and fired with the ceramic ($8.0{\times}3.0{\times}0.5mm$) (ISO 9693:1999). For comparison, ceramics with different coefficient of thermal expansion were used. The bond strength was measured by three-point bending testing and surfaces were observed with FE-SEM. Results were analyzed with a one-way ANOVA (${\alpha}$=.05). RESULTS. The mean values of Duceram Kiss ($61.18{\pm}6.86MPa$), Vita VM13 ($60.30{\pm}7.14MPa$), Ceramco 3 ($58.87{\pm}5.33MPa$), Noritake EX-3 ($55.86{\pm}7.53MPa$), and Vintage MP ($55.15{\pm}7.53MPa$) were found. No significant difference was observed between the bond strengths of the various metal-ceramics. The surfaces of the specimens possessed minute gaps between the additive manufactured layers. CONCLUSION. All the five powders have bond strengths higher than the required 25 MPa minimum (ISO 9693); therefore, various powders can be applied to metal structures fabricated by SLS.

• Journal of the Korean Ceramic Society
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• v.49 no.6
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• pp.586-591
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• 2012

$Zr_2WP_2O_{12}$ powder, which has a negative thermal expansion coefficient, was synthesized by a solid-state reaction with $ZrO_2$, $WO_3$ and $NH_4H_2PO_4$ as the starting materials. The synthesis behavior was dependent on the solvent media used in the wet mixing process. The $Zr_2WP_2O_{12}$ powder prepared with a solvent consisting of D. I. water was fully crystallized at $1200^{\circ}C$, showing a sub-micron particle size. According to the results obtained from a thermal analysis, a $ZrP_2O_7$ was synthesized at a low temperature of $310^{\circ}C$, after which it was reacted with $WO_3$ at $1200^{\circ}C$. A new sintering additive, $Al(OH)_3$, was applied for the densification of the $Zr_2WP_2O_{12}$ powders. The cold isostatically pressed samples were densified with 1 wt% $Al(OH)_3$ additive or more at $1200^{\circ}C$ for 4 h. The main densification mechanism was liquid-phase sintering due to the liquid which resulted from the reaction with amorphous or unstable $Al_2O_3$ and $WO_3$. The densified $Zr_2WP_2O_{12}$ ceramics showed a relative density of 90% and a negative thermal expansion coefficient of $-3.4{\times}10^{-6}/^{\circ}C$. When using ${\alpha}-Al_2O_3$ as the sintering agent, densification was not observed at $1200^{\circ}C$.