• 접착 및 계면
• /
• 제11권4호
• /
• pp.162-167
• /
• 2010

본 연구에서는 셀룰로스계 섬유인 황마(jute)의 화학적 특성 및 열적 특성에 미치는 전자빔조사의 영향을 원소분석, ESR분석, ATR-FTIR 분광분석, 열중량분석 그리고 열기계분석을 통하여 탐구하였다. 전자빔 조사는 전자빔터널 내에서 콘베이어 카트를 이용한 연속식 방법에 의해 2~100 kGy까지 다양한 세기의 전자빔이 황마섬유다발에 일정하게 행하였다. 전자빔 처리는 황마섬유의 화학조성을 다소 변화시켰으며, 전자빔세기가 커질수록 황마섬유에 형성된 라디칼이 증가하는 것으로 확인되었다. 그러나 전자빔 조사는 황마섬유표면의 화학관능기를 크게 변화시키지 않는 것으로 판단되었다. 또한 전자빔 조사는 황마섬유의 열안정성과 열수축/팽창 거동에 영향을 주었으며, 그 거동은 전자빔세기에 의존하였다.

• Korea-Australia Rheology Journal
• /
• 제12권2호
• /
• pp.101-105
• /
• 2000

The crystallization behavior of homo polypropylene (PP) and PP in the PP-poly($\varepsilon$-caprolactone) (PCL) blends during isothermal crystallization has been investigated using differential scanning calorimeter (DSC) and advanced rheometric expansion system (ARES). From the storage modulus data of the homo PP and PP-PCL blends during isothermal crystallization, the volume fraction of crystallized material ($X_t$) of the homo PP and PP in the PP-PCL blends was calculated using the various rheological models. The results of $X_t$ of the homo PP and PP in the PP-PCL blends from ARES measurement were compared with the results from DSC. The $X_t$ of the homo PP was found to be higher in the ARES measurement than in the DSC. The crystallization rate of the homo PP was found to be faster in the rheological measurements than in the thermal analysis. The $X_t$ of PP in the PP-PCL blends with various compositions was obtained from the thermal analysis and rheological measurements. The $X_t$ of PP in the PP-PCL blends obtained from the thermal analysis and rheological measurements are not consistent. This discrepancy of $X_t$ may be due to the morphological changes resulted from the different crystallization kinetics of PP in the PP-PCL blends.

• 한국항공우주학회지
• /
• 제49권8호
• /
• pp.617-626
• /
• 2021

비행체의 초음속 비행 중 고온 환경에서의 열 거동은 비행체의 열 구조 설계에 중요하다. 본 연구에서는 전역-국부 다중 디지털 이미지 상관기법을 사용하여 노치 구조물의 전 영역의 열변형 및 응력집중 현상에 대해 관찰/분석하였다. 다중 DIC 시스템은 2D DIC 시스템과 3D DIC 시스템으로 구성되었다. 가열 챔버를 이용하여 노치 시편을 가열하였으며 여러 온도에서 다중 DIC 시스템을 사용하여 구조물의 변형 이미지를 촬영하고 분석하였다. 다중 DIC 기법을 사용하여 노치 시편의 전 영역 변형률과 노치 부위의 응력집중 현상을 계측/분석하였으며 ABAQUS^TM 프로그램을 이용하여 노치 시편에 대해 유한요소해석을 진행하고 실험결과와 비교 분석하였다. 본 연구를 통해 다중 DIC 시스템의 열변형 계측과 응력 집중 현상의 연구 분석에서의 활용 가능성을 보여주었다.

• Advances in nano research
• /
• 제7권5호
• /
• pp.293-310
• /
• 2019

In this paper, thermal-buckling behavior of the functionally graded (FG) nanocomposite plates reinforced with graphene oxide powder (GOP) is studied under three types of thermal loading once the plate is supposed to be rested on a two-parameter elastic foundation. The effective material properties of the nanocomposite plate are considered to be graded continuously through the thickness according to the Halpin-Tsai micromechanical scheme. Four types of GOPs' distribution namely uniform (U), X, V and O, are considered in a comparative way in order to find out the most efficient model of GOPs' distribution for the purpose of improving the stability limit of the structure. The governing equations of the plate have been derived based on a refined higher-order shear deformation plate theory incorporated with Hamilton's principle and solved analytically via Navier's solution for a simply supported GOP reinforced (GOPR) nanocomposite plate. Some new results are obtained by applying different thermal loadings to the plate according to the GOPs' negative coefficient of thermal expansion and considering both Winkler-type and Pasternak-type foundation models. Besides, detailed parametric studies have been carried out to reveal the influences of the different types of thermal loading, weight fraction of GOP, aspect and length-to-thickness ratios, distribution type, elastic foundation constants and so on, on the critical buckling load of nanocomposite plates. Moreover, the effects of thermal loadings with various types of temperature rise are investigated comparatively according to the graphical results. It is explicitly shown that the buckling behavior of an FG nanocomposite plate is significantly influenced by these effects.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 추계학술대회
• /
• pp.1407-1412
• /
• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권8호
• /
• pp.570-576
• /
• 1999

$LaCrO_3$-dispersed Cr alloys for metallic interconnector of solid oxide fuel cell have been studied as function of $LaCrO_3$ content in the range of 5 to 25 vol.% in order to examine the electric conductivity, the oxidation property and the thermal expansion behavior of these alloys. The $LaCrO_3$-dispersed Cr alloys showed high electrical conductivities of $3~5\times10^4$ S/cm at room temperature, and as the $LaCrO_3$content increased the conductivity decreased slightly. During the cyclic oxidation test at $1100^{\circ}C$, the weight change of the Cr alloys decreased with increasing number of oxidation cycle except first cycle, which is attributed to the vaporization of the oxide scale. More addition of the $LaCrO_3$ content reduced also the weight change of the Cr alloys. These mean that the oxide scale formed at the surface of the Cr alloy becomes stable with increasing number of oxidation cycle and$LaCrO_3$ content. The measured thermal expansion of the Cr alloy was well fitted to that of 8 mol% $Y_2O_3$-stabilized $ZrO_2$ electrolyte. These results demonstrate that $LaCrO_3$-dispersed Cr alloy is a useful material for metallic interconnector of solid oxide fuel cell.

• 한국재료학회지
• /
• 제24권9호
• /
• pp.481-487
• /
• 2014

The effect of alpha phase on the fatigue properties of Fe-29%Ni-17%Co low thermal expansion alloy was investigated. Two kinds of alloys (Base alloy and Alpha alloy) were prepared by controlling the minimal alloy composition. Microstructure observation, tensile, high-cycle fatigue, and low-cycle fatigue results were measured in this study. The Base alloy microstructure showed typical austenite ${\gamma}$ phase. Alpha alloy represented the dispersed phase in the austenite ${\gamma}$ matrix. As a result of tensile testing, Alpha alloy was found to have higher strengths (Y.S. & T.S.) and lower elongation compared to those of the Base alloy. High cycle fatigue results showed that Alpha alloy had a higher fatigue limit (360MPa) than that (330MPa) of the Base alloy. The Alpha alloy exhibited the superior high cycle fatigue property in all of the fatigue stress conditions. SEM fractography results showed that the alpha phase could act to effectively retard both fatigue crack initiation and crack propagation. In the case of low-cycle fatigue, the Base alloy had longer fatigue life in the high plastic strain amplitude region and the Alpha alloy showed better fatigue property only in the low plastic strain amplitude region. The fatigue deformation behavior of the Fe-29%Ni-17%Co alloy was also discussed as related with its microstructure.

• 마이크로전자및패키징학회지
• /
• 제27권1호
• /
• pp.67-73
• /
• 2020

본 논문에서는 FEM(유한요소) 기법을 사용하여 FCCSP용 임베디드 PCB의 캐비티 구조와 프리프레그 재료의 종류에 따라 PCB에서 발생한 warpage와 von Mises 응력 해석을 수행하였다. 유한요소 해석에는 1/2 substrate 모델과 정적해석이 적용되었다. warpage 해석 결과에 의하면 칩이 실장되는 캐비티와 칩의 간격이 증가할수록 warpage가 증가하였고, 탄성계수와 열팽창계수가 높은 프리프레그 재료를 적용했을 때 warpage가 증가하였다. 응력의 해석결과에 따르면 칩이 실장되는 캐비티와 칩의 간격의 영향은 프리프레그 재료에 따라 다르게 나타났다. 즉 열팽창계수가 코어재료보다 월등히 높은 재료를 적용했을 때 칩이 실장되는 캐비티와 칩의 간격이 증가할수록 응력이 증가하였고, 열팽창계수가 코어재료보다 낮은 프리프레그를 적용하면 응력이 감소하였다. 이와 같은 결과는 신뢰성 관점에서 실장된 칩이 실장되는 캐비티의 구조와 프리프레그 재료간 상관관계가 있음을 시사하고 있다.

• Structural Engineering and Mechanics
• /
• 제47권6호
• /
• pp.839-856
• /
• 2013

Metallic annular discs with their outer boundary fully constrained are studied with newly derived semi-analytical solutions for the effects of thickness variations under thermal loading and unloading. The plane stress and axisymmetric assumptions were adopted, and the thickness of the disk depends on the radius hyperbolically with an exponent n. Furthermore, it is assumed that the stress state is two dimensional and temperature is uniform in the domain. The solutions include the elastic, elastic-plastic and plastic-collapse behavior, depending on the values of temperature. The von Mises type yield criterion is adopted in this work. The material properties, Young's modulus, yield stress and thermal expansion coefficient, are assumed temperature dependent, while the Poisson's ratio is assumed to be temperature independent. It is found that for any n values, if the normalized hole radius a greater than 0.6, the normalized temperature difference between the elastically reversible temperature and plastic collapse temperature is a monotonically decreasing function of inner radius. For small holes, the n values have strong effects on the normalized temperature difference. Furthermore, it is shown that thickness variations may have stronger effects on the strain distributions when temperature-dependent material properties are considered.

• 전자공학회논문지A
• /
• 제29A권7호
• /
• pp.73-81
• /
• 1992

We have investigated the thermal reaction property and the oxygen behavior of TiN/Ti/Si structure after different hear treatments using x-ray photoelectron spectroscopy and cross-sectional transmission electron microscopy measurements. During the heat treatment in N$_2$ amibient, the considerable amount of oxygen atoms incorporates into TiN/Ti/Si Structures. It is found that oxygen atoms pile up at the top surface of TiN and TiN/Ti interface, forming a compound of TiO$_2$ above $600^{\circ}C$. Inside the TiN film, the oxygen content increases as the annealing temperature increases, mostly TiO and Ti$_2$O$_3$ rather than thermodynamically stable TiO$_2$. Above the annealing temperature of 55$0^{\circ}C$, the TiSi$_2$ formation has initiated. One thing to note is that a severe blistering is observed in the sample annealed at $600^{\circ}C$, due to (1) the difference of thermal expansion coefficient between TiN and Si` (2) the compressive stress induced by the volume reduction caused by the Ti-Silicide grain while elevating temperatures.